EPM570F256I5 vs EPM570F256C3N Perbandingan

Perbandingan bersamaan detil EPM570F256I5 dari Intel dan EPM570F256C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EPM570F256I5 EPM570F256C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Aktif
Family MAX II MAX II
Logic Elements (LE) 570 —
Maximum User I/O Pins 160 —
User Flash Memory (UFM) 8 Kbits 8 Kbits
Number of LABs/CLBs [DATA_NEEDED: number of LABs] —
Package Type 256-ball FineLine BGA (FBGA-256) —
Suhu Kerja -40C to +85C (industrial) —
Supply Voltage - Core 3.3 V (also operates at 3.3V per part description) —
I/O Standards Supported LVTTL, LVCMOS, SSTL, PCI —
MultiVolt I/O 1.5V / 1.8V / 2.5V / 3.3V —
Programming Interface JTAG (IEEE 1149.1) / ISP JTAG (IEEE 1532 / IEEE 1149.1) + ISP
In-System Programmability Yes —
Non-volatile Configuration Yes (on-chip flash) —
Pin-to-Pin Logic Delay (typ) 5 ns to 7 ns —
Maximum Internal Frequency [DATA_NEEDED: fMAX MHz per speed grade] —
Number of PLLs [DATA_NEEDED: number of PLLs] —
Tipe Mounting Surface Mount Surface Mount
Status RoHS [DATA_NEEDED: RoHS status] Compliant (per DigiKey listing)
Width 17 mm (per Partstack) —
Speed Grade I5 —
Logic Elements (LEs) — 570
Equivalent Macrocells — 440
Maximum Operating Frequency — 304 MHz
Process Technology — 0.18 um, 6-layer-metal flash CMOS
Core Voltage — 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) — 1.5 V, 1.8 V, 2.5 V, 3.3 V
Paket — 256-ball FBGA (FineLine BGA)
User I/O Count — [DATA_NEEDED: confirm exact user-IO count for F256 package]
Operating Temperature (C3 grade) — 0 C to +85 C (commercial)
Level MSL — [DATA_NEEDED: MSL level not stated in provided data]
Lead-Free — Yes (per suffix 'N' convention)
Typical Macroscopic Functions — Glue logic, bus bridging, I/O expansion, power sequencing

Spek dan Sumber

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