EPM570F256I5 vs EPM570F256C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPM570F256I5 sa pamamagitan ng Intel at EPM570F256C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPM570F256I5 EPM570F256C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Family MAX II MAX II
Logic Elements (LE) 570 —
Maximum User I/O Pins 160 —
User Flash Memory (UFM) 8 Kbits 8 Kbits
Number of LABs/CLBs [DATA_NEEDED: number of LABs] —
Package Type 256-ball FineLine BGA (FBGA-256) —
Temperature na Operasyon -40C to +85C (industrial) —
Supply Voltage - Core 3.3 V (also operates at 3.3V per part description) —
I/O Standards Supported LVTTL, LVCMOS, SSTL, PCI —
MultiVolt I/O 1.5V / 1.8V / 2.5V / 3.3V —
Programming Interface JTAG (IEEE 1149.1) / ISP JTAG (IEEE 1532 / IEEE 1149.1) + ISP
In-System Programmability Yes —
Non-volatile Configuration Yes (on-chip flash) —
Pin-to-Pin Logic Delay (typ) 5 ns to 7 ns —
Maximum Internal Frequency [DATA_NEEDED: fMAX MHz per speed grade] —
Number of PLLs [DATA_NEEDED: number of PLLs] —
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant (per DigiKey listing)
Width 17 mm (per Partstack) —
Speed Grade I5 —
Logic Elements (LEs) — 570
Equivalent Macrocells — 440
Maximum Operating Frequency — 304 MHz
Process Technology — 0.18 um, 6-layer-metal flash CMOS
Core Voltage — 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) — 1.5 V, 1.8 V, 2.5 V, 3.3 V
Packhaging — 256-ball FBGA (FineLine BGA)
User I/O Count — [DATA_NEEDED: confirm exact user-IO count for F256 package]
Operating Temperature (C3 grade) — 0 C to +85 C (commercial)
Level ng MSL — [DATA_NEEDED: MSL level not stated in provided data]
Lead-Free — Yes (per suffix 'N' convention)
Typical Macroscopic Functions — Glue logic, bus bridging, I/O expansion, power sequencing

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