Altera

EPM570GF256C3N - 570 LEs MAX II G CPLD | Intel / Altera

MPN: EPM570GF256C3N ✓ Aktif

3.3 V (core) Vdss 256-ball FineLine BGA (GF256), 17 x 17 mm, 1.0 mm pitch Package 8 Kbit Memory

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EPM570GF256C3N Ringkasan

The Intel (formerly Altera) EPM570GF256C3N is a MAX II G family CPLD (Complex Programmable Logic Device) offering 570 logic elements in a 256-ball FineLine BGA (GF256) package with industrial operating temperature range (-40C to +125C).

A CPLD is a non-volatile programmable logic device that provides instant-on configuration from on-chip flash memory, combining the deterministic timing of a PAL/GAL architecture with the integration density of an FPGA. CPLDs sit in the programmable logic hierarchy between discrete 74-series glue logic and full FPGAs, and are commonly used for I/O expansion, bus bridging, power-up sequencing, and control state machines where sub-10 ns propagation delays and zero boot latency are required.

Key features include 570 logic elements, 76 user I/Os, 4-input LUT-based logic blocks, an 8 Kbit user flash memory block, JTAG IEEE 1149.1 boundary-scan support, and an internal oscillator. The device operates from a single 3.3 V core supply (VCCINT) with multi-voltage I/O banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V interface levels. The GF256 FineLine BGA package measures 17 mm x 17 mm with a 1.0 mm ball pitch, providing high board density for space-constrained designs.

The MAX II G architecture combines a flash-based configuration memory with a Look-Up Table (LUT) logic fabric, eliminating the external configuration PROM required by older SRAM FPGAs. This instant-on capability, combined with multi-voltage I/O support and low power consumption, makes the EPM570GF256C3N well suited for glue logic replacement, bus interface translation, and LED drive multiplexing in industrial and communications equipment.

Typical applications include I/O expansion and level shifting for microcontrollers and ASICs, bus interface bridging between legacy and modern peripherals, control logic for power supply sequencing, LED drive and multiplexing in signage, and general-purpose glue logic replacement on industrial control boards.

When designing with this part, take advantage of Quartus II design software for synthesis, place-and-route, and timing analysis. The 256-ball BGA footprint requires careful PCB layout with microvia technology for reliable assembly, and the device supports in-system programmability via JTAG for production line updates.

This page synthesizes distributor pricing, drop-in MAX II / MAX II G alternatives, and practical design notes not found in the manufacturer datasheet.

Alternatif penggantian untuk EPM570GF256C3N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian EPM570GF256C3N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, RoHS Status, Programming Interface, Operating Temperature.

EPM570F256C3N

Intel

Package: 256-ball FBGA (FineLine BGA)

Process Technology: 0.18 um, 6-layer-metal flash CMOS

RoHS Status: Compliant (per DigiKey listing)