EPM570ZF256C7N vs EPM570F256C3N Perbandingan
Perbandingan bersamaan detil EPM570ZF256C7N dari Intel dan EPM570F256C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570ZF256C7N | EPM570F256C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | — |
| Programmable Type | In System Programmable | — |
| Macro Cells | 440 | — |
| Logic Elements (LE) | 440 | — |
| Embedded Flash Memory | 8 Kbit | — |
| Pin-to-Pin Logic Delay (tPD) | 9 ns | — |
| Maximum Operating Frequency | 201 MHz (internal) | 304 MHz |
| Maximum User I/O Pins | 160 | — |
| Supply Voltage - Internal (VCCINT) | 1.71 V to 1.89 V | — |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Supplier Device Package | 256-MBGA (11x11 mm) | — |
| Package Type Code | 256-FBGA / 256-TFBGA | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 0.18 µm flash-based CMOS | 0.18 um, 6-layer-metal flash CMOS |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Rentang Suhu Kerja | 0 °C to +85 °C (commercial, suffix 'C') | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant (per DigiKey listing) |
| Lead-Free Status | Lead free | — |
| Family | — | MAX II |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Paket | — | 256-ball FBGA (FineLine BGA) |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Level MSL | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |