EPM570ZF256C7N vs EPM570F256C3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570ZF256C7N disebabkan oleh Intel dan EPM570F256C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPM570ZF256C7N EPM570F256C3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series MAX II —
Programmable Type In System Programmable —
Macro Cells 440 —
Logic Elements (LE) 440 —
Embedded Flash Memory 8 Kbit —
Pin-to-Pin Logic Delay (tPD) 9 ns —
Maximum Operating Frequency 201 MHz (internal) 304 MHz
Maximum User I/O Pins 160 —
Supply Voltage - Internal (VCCINT) 1.71 V to 1.89 V —
I/O Bank Voltages 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) —
Supplier Device Package 256-MBGA (11x11 mm) —
Package Type Code 256-FBGA / 256-TFBGA —
Ball Pitch 1.0 mm —
Process Technology 0.18 µm flash-based CMOS 0.18 um, 6-layer-metal flash CMOS
Programming Interface JTAG (IEEE 1149.1) JTAG (IEEE 1532 / IEEE 1149.1) + ISP
Gambaran Suhu Operasi 0 °C to +85 °C (commercial, suffix 'C') —
Jenis Pemasangan Surface Mount Surface Mount
Status RoHS Compliant Compliant (per DigiKey listing)
Lead-Free Status Lead free —
Family — MAX II
Logic Elements (LEs) — 570
Equivalent Macrocells — 440
User Flash Memory (UFM) — 8 Kbits
Core Voltage — 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) — 1.5 V, 1.8 V, 2.5 V, 3.3 V
Kemasan — 256-ball FBGA (FineLine BGA)
User I/O Count — [DATA_NEEDED: confirm exact user-IO count for F256 package]
Operating Temperature (C3 grade) — 0 C to +85 C (commercial)
Aras MSL — [DATA_NEEDED: MSL level not stated in provided data]
Lead-Free — Yes (per suffix 'N' convention)
Typical Macroscopic Functions — Glue logic, bus bridging, I/O expansion, power sequencing

Laporan Datasheet & Sumber

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