GX36220-DNT vs GX36420 Perbandingan
Perbandingan bersamaan detil GX36220-DNT dari Renesas Electronics dan GX36420 dari Renesas Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Renesas Electronics
GX36220-DNT - 2x64Gb/s Linear TIA Die | Renesas | 400G Coherent
GX36220-DNT ✓ AktifRenesas Electronics
GX36420 - 64 Gbps Quad Linear TIA for 400G/600G Coherent | Renesas
GX36420 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | GX36220-DNT | GX36420 |
|---|---|---|
| Merek | Renesas Electronics | Renesas Electronics |
| Kategori | Interface ICs | Amplifier ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Type | Linear Transimpedance Amplifier (TIA) | — |
| Number of Channels | 2 (I and Q) | 4 (quad: XI, XQ, YI, YQ) |
| Data Rate per Channel | 32 Gb/s | — |
| Aggregate Data Rate | 64 Gb/s (2 x 32 Gb/s) | — |
| Tipe Output | Linear (non-limiting) | — |
| Target Application | 400G Coherent Receiver Optical Sub-Assembly (ROSA) | 400G / 600G coherent optical receivers |
| Tegangan Pemuat | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: VCC / VEE] |
| Transimpedance Gain | [DATA_NEEDED: transimpedance gain] | [DATA_NEEDED: gain (kOhm)] |
| Input Current Noise | [DATA_NEEDED: input-referred noise] | — |
| Bandwidth | [DATA_NEEDED: -3 dB bandwidth] | — |
| Differential Output Swing | [DATA_NEEDED: output swing] | — |
| Delivery Format | Die Sale (Price in Good Die) - Wafer | — |
| Paket | Bare Die (DNT die-sale option) | — |
| Tipe Mounting | Surface Mount (die attach in hybrid/ROSA assembly) | — |
| Category Subtype | Telecom IC Amplifier Die | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | — |
| Status RoHS | unknown | Compliant (assumed; bare die) |
| Device Type | — | Linear Transimpedance Amplifier (TIA) |
| Per-Lane Data Rate | — | 64 Gbps (symbol rate, NRZ/PAM) |
| Aggregate Bandwidth | — | 256 Gbps (4 x 64 Gbps) |
| Topologi | — | Linear (preserves amplitude for coherent ADC) |
| Output Interface | — | Differential, per lane |
| Integrated DC Control | — | Yes (on-die digital control interface) |
| Form Factor | — | Bare die (DNT = die, no package) |
| Process Technology | — | SiGe BiCMOS |
| Rentang Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Input-Referred Noise | — | [DATA_NEEDED: input noise current (pA/sqrt(Hz))] |
| Level MSL | — | In-pack die / wafer |