GX36220-DNT vs GX36420 比較

詳細並排比較 GX36220-DNT 由 Renesas Electronics 與 GX36420 由 Renesas Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Renesas Electronics
GX36220-DNT GX36220-DNT - 2x64Gb/s Linear TIA Die | Renesas | 400G Coherent

GX36220-DNT - 2x64Gb/s Linear TIA Die | Renesas | 400G Coherent

GX36220-DNT ✓ 啟用中
Renesas Electronics
GX36420 GX36420 - 64 Gbps Quad Linear TIA for 400G/600G Coherent | Renesas

GX36420 - 64 Gbps Quad Linear TIA for 400G/600G Coherent | Renesas

GX36420 ✓ 啟用中

規格比較

參數 GX36220-DNT GX36420
品牌 Renesas Electronics Renesas Electronics
類別 Interface ICs Amplifier ICs
生命週期狀態 啟用中 啟用中
Product Type Linear Transimpedance Amplifier (TIA) —
Number of Channels 2 (I and Q) 4 (quad: XI, XQ, YI, YQ)
Data Rate per Channel 32 Gb/s —
Aggregate Data Rate 64 Gb/s (2 x 32 Gb/s) —
輸出類型 Linear (non-limiting) —
Target Application 400G Coherent Receiver Optical Sub-Assembly (ROSA) 400G / 600G coherent optical receivers
供應電壓 [DATA_NEEDED: supply voltage] [DATA_NEEDED: VCC / VEE]
Transimpedance Gain [DATA_NEEDED: transimpedance gain] [DATA_NEEDED: gain (kOhm)]
Input Current Noise [DATA_NEEDED: input-referred noise] —
Bandwidth [DATA_NEEDED: -3 dB bandwidth] —
Differential Output Swing [DATA_NEEDED: output swing] —
Delivery Format Die Sale (Price in Good Die) - Wafer —
封裝 Bare Die (DNT die-sale option) —
安裝類型 Surface Mount (die attach in hybrid/ROSA assembly) —
Category Subtype Telecom IC Amplifier Die —
工作溫度 [DATA_NEEDED: operating temperature range] —
RoHS 狀態 unknown Compliant (assumed; bare die)
Device Type — Linear Transimpedance Amplifier (TIA)
Per-Lane Data Rate — 64 Gbps (symbol rate, NRZ/PAM)
Aggregate Bandwidth — 256 Gbps (4 x 64 Gbps)
拓撲 — Linear (preserves amplitude for coherent ADC)
Output Interface — Differential, per lane
Integrated DC Control — Yes (on-die digital control interface)
Form Factor — Bare die (DNT = die, no package)
Process Technology — SiGe BiCMOS
工作溫度範圍 — [DATA_NEEDED: operating temperature range]
Input-Referred Noise — [DATA_NEEDED: input noise current (pA/sqrt(Hz))]
MSL 等級 — In-pack die / wafer

資料表與資源

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