H5AN8G8NDJR vs MT40A1G8SA-062E Perbandingan

Perbandingan bersamaan detil H5AN8G8NDJR dari SK hynix dan MT40A1G8SA-062E dari Micron Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

SK hynix
H5AN8G8NDJR H5AN8G8NDJR - 8Gb DDR4 SDRAM 3200MT/s | SK hynix

H5AN8G8NDJR - 8Gb DDR4 SDRAM 3200MT/s | SK hynix

H5AN8G8NDJR ✓ Aktif
Micron Technology
MT40A1G8SA-062E MT40A1G8SA-062E - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A1G8SA-062E - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A1G8SA-062E ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum H5AN8G8NDJR MT40A1G8SA-062E
Merek SK hynix Micron Technology
Kategori Memory ICs Memory ICs
Status Lingkungan Hidup Aktif Aktif
Tipe Memori DDR4 SDRAM DDR4 SDRAM
Density 8 Gb 8 Gbit
Organisasi 1G x 8 1G x 8
Laju Data 3200 MT/s 3200 MT/s (DDR4-3200)
Supply Voltage (VDD) 1.2 V (1.14V to 1.26V) —
VDDQ 1.2 V —
VPP 2.5 V 2.5 V, -125 mV, +250 mV
Suhu Kerja 0°C to +95°C (Tc) 0C to +95C (CT range; IT: -40C to +95C)
Paket FBGA-78 (7.5x11 mm) 78-ball FBGA (7.5 x 11 mm)
Latensi CAS 22 (typical) —
tRCD 22 ns —
tRP 22 ns —
Burst Length 8 and 4 (with burst chop) BL8, BC4 (burst chop)
Self-Refresh Current 30 mA (typical) —
Active Standby Current 60 mA (typical) —
RoHS Compliant —
Lead-Free Yes —
Clock Frequency — 1.6 GHz
Access Time (CAS Latency) — CL22 at 3200 MT/s
Row Access Time — 19 ns
VDD / VDDQ — 1.2 V +/-60 mV
Internal Banks — 16 banks (4 bank groups x 4 banks)
Refresh — 8192-cycle; 64 ms (0-85C), 32 ms (85-95C), 16 ms (>95C)
I/O Type — 1.2 V pseudo open-drain
Tipe Mounting — Surface Mount
Fitur — Auto self-refresh, write leveling, dynamic ODT, CRC, auto precharge, ZQ calibration, on-die adjustable VREFDQ

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