H5ANAG6NBJR-VKC vs H5ANAG6NAMR-UHC Perbandingan
Perbandingan bersamaan detil H5ANAG6NBJR-VKC dari SK hynix dan H5ANAG6NAMR-UHC dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5ANAG6NBJR-VKC | H5ANAG6NAMR-UHC |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Manufacturer | SK Hynix | — |
| Part Number | H5ANAG6NBJR-VKC | — |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 16Gb (2GB) | 16 Gbit (2 GB) |
| Organisasi | [DATA_NEEDED: x16 organization per datasheet] | 1G x 16 |
| Laju Data | 2666 Mbps (per family reference, VKC speed code) | — |
| Tegangan Pemuat | 1.2 V (DDR4 standard) | — |
| Antarmuka | DDR4, SSTL-12 | — |
| Paket | FBGA-96 (PBGA96) | FBGA-96 (PBGA96) |
| Tipe Mounting | Surface Mount | Surface Mount (BGA solder ball) |
| Suhu Kerja | -40C to +95C (family grade reference) | [DATA_NEEDED: operating temperature range] |
| Auto Self-Refresh | Yes | — |
| Data Mask Function | Yes | — |
| Asynchronous Reset | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| CRC Function | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Supply Voltage (VDD) | — | 1.2 V |
| Architecture | — | CMOS DDR4 with bank groups |
| Power Class | — | Normal Power |
| Refresh | — | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| Latensi CAS | — | [DATA_NEEDED: CL for UHC bin] |
| Tipe Antarmuka | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| Status Lingkungan Hidup | — | Active production |