H5ANAG6NCR-RDC vs H5ANAG6NAMR-UHC Perbandingan
Perbandingan bersamaan detil H5ANAG6NCR-RDC dari SK hynix dan H5ANAG6NAMR-UHC dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5ANAG6NCR-RDC | H5ANAG6NAMR-UHC |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Ukuran Memori | 16 Gb (2 GB) | — |
| Organisasi | 1G x 16 | 1G x 16 |
| Laju Data | 3200 Mbps (PC4-25600 class) | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Paket | 96-ball FBGA | FBGA-96 (PBGA96) |
| Package Body | Rectangular, 8 mm width | — |
| Maximum Standby Current | 0.074 A | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA solder ball) |
| Number of Terminals (Balls) | 96 | — |
| Auto Self-Refresh | Yes | — |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| Data Mask (DM) Function | Yes | — |
| Dynamic On-Chip Termination (ODT) | Yes | — |
| ZQ Calibration | Yes | — |
| CRC Function | Yes | — |
| Write Leveling | Yes | — |
| Status RoHS | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| Suhu Kerja | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Refresh Interval | [DATA_NEEDED: Refresh Interval] | — |
| Memory Density | — | 16 Gbit (2 GB) |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Architecture | — | CMOS DDR4 with bank groups |
| Power Class | — | Normal Power |
| Refresh | — | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| Latensi CAS | — | [DATA_NEEDED: CL for UHC bin] |
| Tipe Antarmuka | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| Status Lingkungan Hidup | — | Active production |