K4A4G085WD-BCRC vs K4A4G045WD-BCPB Perbandingan
Perbandingan bersamaan detil K4A4G085WD-BCRC dari Samsung Electronics dan K4A4G045WD-BCPB dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4A4G085WD-BCRC | K4A4G045WD-BCPB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Memory Density | 4 Gbit | — |
| Organisasi | 512M x 8 | 1G x 4 |
| Tipe Memori | DDR4 SDRAM (D-die) | DDR4 SDRAM |
| Laju Data | 2400 Mb/s (PC2400) | — |
| Tegangan Pemuat | 1.2 V | 1.2 V |
| Paket | FBGA-78 (TFBGA) | 78-ball TFBGA (FBGA) |
| Number of Terminals | 78 | 78 |
| Antarmuka | Parallel | DDR4 parallel, double data rate |
| Access Mode | Multi-bank page burst | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Latensi CAS | [DATA_NEEDED: CAS Latency] | — |
| Rentang Suhu Kerja | [DATA_NEEDED: Operating Temperature Range] | — |
| Refresh | [DATA_NEEDED: Refresh specification] | — |
| Status RoHS | [DATA_NEEDED: RoHS Status] | — |
| Level MSL | [DATA_NEEDED: MSL Level] | — |
| Density | — | 4 Gb |
| Speed Class | — | DDR4-2133 (PC2133) |
| Die Generation | — | D-die |
| Terminal Form | — | Ball (BGA) |
| Package Shape | — | Rectangular |
| Burst Length | — | 8 (per Samsung DDR4 SDRAM datasheet Rev. 1.1) |
| Speed Bin Notation | — | CL-tRCD-tRP order (per Samsung ordering information) |
| Datasheet Pages | — | 66 pages (K4A4G045WD / K4A4G085WD family) |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Refresh Rate | — | [DATA_NEEDED: refresh interval 1x/2x/4x support] |