K4A8G085WB vs K4A8G085WC-BCTD Perbandingan
Perbandingan bersamaan detil K4A8G085WB dari Samsung Electronics dan K4A8G085WC-BCTD dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Samsung Electronics
K4A8G085WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps 1.2V | Samsung
K4A8G085WC-BCTD ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | K4A8G085WB | K4A8G085WC-BCTD |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Tipe Memori | DDR4 SDRAM (B-die) | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gb |
| Organisasi | 1G x 8 | 1G x 8 |
| Tegangan Pemuat | 1.2 V | — |
| Paket | 78-pin FBGA | 78-ball FBGA (78FBGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Operating Mode | DLL Enabled mode (per datasheet) | — |
| Speed Grade Suffixes | -BCRC, -BIRC, -BCTD, -BCPB (per family naming) | — |
| Laju Data | [DATA_NEEDED: speed grade data rate in Mbps] | 2666 Mbps (PC4-2133) |
| tCL/cas latency | [DATA_NEEDED: CAS latency] | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | 0C to +95C |
| Refresh | [DATA_NEEDED: refresh rate 1x/2x] | — |
| Bank Groups | [DATA_NEEDED: bank/bank group count] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Termination Voltage (VTT) | [DATA_NEEDED: VTT value] | — |
| Supply Voltage (VDD/VDDQ) | — | 1.2 V (1.14 V to 1.26 V) |
| Ball Pitch | — | 0.8 mm |
| Standard Operating Temp Range | — | 0C to +85C |
| Burst Length | — | 8 (chop 4) |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| ZQ Calibration | — | Yes |
| Dynamic ODT | — | Yes |
| Data Mask | — | Yes |
| Tipe Antarmuka | — | Synchronous, parallel |