K4B4G1646D-BYK0 vs K4B4G1646D-BMH9 Perbandingan
Perbandingan bersamaan detil K4B4G1646D-BYK0 dari Samsung Electronics dan K4B4G1646D-BMH9 dari Samsung Electronics. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | K4B4G1646D-BYK0 | K4B4G1646D-BMH9 |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gbit | 4Gb |
| Organisasi | 256M x 16 | 256M x 16 |
| Tegangan Pemuat | 1.35 V (1.5 V compatible) | — |
| Laju Data | 1600 Mbps (PC3-12800) | 2133 Mb/s per pin |
| Paket | 96-ball FBGA | 96-ball FBGA (9x13mm) |
| Suhu Kerja | 0°C to 85°C | [DATA_NEEDED: operating temperature range] |
| Latensi CAS | Programmable (e.g., 11, 10, 9) | Programmable |
| Burst Length | 8 (with burst chop 4) | 8 and 4 |
| On-Die Termination | Yes | — |
| Lead-Free | Yes | Yes |
| Bebas Halogen | Yes | Yes |
| RoHS Compliant | Yes | — |
| Jumlah Pin | 96 | — |
| Die Revision | D-die | — |
| Number of Banks | — | 8 |
| Supply Voltage (VDD) | — | 1.35V |
| Supply Voltage (VDDQ) | — | 1.35V |
| Ball Pitch | — | 0.8mm |
| Status RoHS | — | Compliant |