K4B4G1646D-BMH9 - 4Gb DDR3L SDRAM x16 96FBGA | Samsung
MPN: K4B4G1646D-BMH9 ✓ AktifK4B4G1646D-BMH9 Ringkasan
DDR3L SDRAM is a type of dynamic random-access memory that uses double data rate architecture to transfer data on both edges of the clock signal, effectively doubling the data rate. It is part of the DDR3 family, which is a successor to DDR2 and offers higher bandwidth and lower power consumption. DDR3L specifically operates at 1.35V, distinguishing it from standard DDR3 (1.5V) and enabling its use in mobile and embedded systems where power efficiency is critical.
Key features include programmable CAS latency, write latency, on-die termination (ODT), and internal calibration for signal integrity. The device supports burst lengths of 8 and 4, and includes auto-refresh and self-refresh modes for power management. The 96-ball FBGA package provides excellent thermal and electrical performance, with a ball pitch of 0.8mm, suitable for high-density PCB designs.
Technically, the K4B4G1646D-BMH9 utilizes Samsung's advanced D-die process technology, which enhances speed and reduces power consumption. The device supports DLL (Delay-Locked Loop) enabled mode for precise timing, and includes features like write leveling and read leveling for improved signal integrity in high-speed systems. The memory is organized with 8 banks, allowing for efficient interleaving and reduced latency.
Typical applications include embedded systems, networking equipment, industrial computing, and consumer electronics such as set-top boxes and routers. Its low voltage and high density make it suitable for DDR3L SODIMM modules and on-board memory in space-constrained designs.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to maintain signal integrity at 2133Mb/s. The device requires a 1.35V supply and a separate VDDQ supply, which should be regulated accurately.
Alternatif penggantian untuk K4B4G1646D-BMH9 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian K4B4G1646D-BMH9 (sama faktor bentuk dan footprint) — berbeda di dalam Data Rate, Package, Burst Length, CAS Latency, Operating Temperature.
K4B4G1646D-BHMA
✅ Drop-InKontak untuk harga
Lihat Datasheet →K4B4G1646D-BFMA
✅ Drop-InKontak untuk harga
Lihat Datasheet →K4B4G1646D-BYK0
✅ Drop-InKontak untuk harga
Lihat Datasheet →MT41K256M16HA-125
⚡ Pakai Pakai Sama✗ Habis Stok
$6.3636 / Satuan
Lihat Datasheet →H5TC4G63AFR-RDA
⚡ Pakai Pakai Sama📋 Alternatif referensi (tidak dalam katalog)
K4B4G1646D-BMH9 Rating Maksimal & Karakteristik Listrik
| Tipe Memori | DDR3L SDRAM |
| Density | 4Gb |
| Organisasi | 256M x 16 |
| Number of Banks | 8 |
| Laju Data | 2133 Mb/s per pin |
| Supply Voltage (VDD) | 1.35V |
| Supply Voltage (VDDQ) | 1.35V |
| Paket | 96-ball FBGA (9x13mm) |
| Ball Pitch | 0.8mm |
| Latensi CAS | Programmable |
| Burst Length | 8 and 4 |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Bebas Halogen | Yes |
Konfigurasi Pin K4B4G1646D-BMH9
| Pin produk A1 | VDD — Power supply |
| Pin produk A2 | DQ0 — Data input/output 0 |
| Pin produk A3 | DQ1 — Data input/output 1 |
| Pin produk A4 | VSS — Ground |
| Pin produk A5 | DQ2 — Data input/output 2 |
| Pin produk A6 | DQ3 — Data input/output 3 |
| Pin produk A7 | VDDQ — I/O power supply |
| Pin produk A8 | DQ4 — Data input/output 4 |
| Pin produk A9 | DQ5 — Data input/output 5 |
| Pin produk A10 | VSS — Ground |
| Pin produk A11 | DQ6 — Data input/output 6 |
| Pin produk A12 | DQ7 — Data input/output 7 |
| Pin produk A13 | VDD — Power supply |
| Pin produk A14 | VSS — Ground |
| Pin produk A15 | DQ8 — Data input/output 8 |
| Pin produk A16 | DQ9 — Data input/output 9 |
| Pin produk A17 | VDDQ — I/O power supply |
| Pin produk A18 | DQ10 — Data input/output 10 |
| Pin produk A19 | DQ11 — Data input/output 11 |
| Pin produk A20 | VSS — Ground |
| Pin produk A21 | DQ12 — Data input/output 12 |
| Pin produk A22 | DQ13 — Data input/output 13 |
| Pin produk A23 | VDD — Power supply |
| Pin produk A24 | DQ14 — Data input/output 14 |
| Pin produk A25 | DQ15 — Data input/output 15 |
| Pin produk A26 | VSS — Ground |
| Pin produk A27 | VDDQ — I/O power supply |
| Pin produk A28 | VSS — Ground |
| Pin produk A29 | VDD — Power supply |
| Pin produk A30 | VSS — Ground |
| Pin produk A31 | VDDQ — I/O power supply |
| Pin produk A32 | VSS — Ground |
| Pin produk A33 | VDD — Power supply |
| Pin produk A34 | VSS — Ground |
| Pin produk A35 | VDDQ — I/O power supply |
| Pin produk A36 | VSS — Ground |
| Pin produk A37 | VDD — Power supply |
| Pin produk A38 | VSS — Ground |
| Pin produk A39 | VDDQ — I/O power supply |
| Pin produk A40 | VSS — Ground |
| Pin produk A41 | VDD — Power supply |
| Pin produk A42 | VSS — Ground |
| Pin produk A43 | VDDQ — I/O power supply |
| Pin produk A44 | VSS — Ground |
| Pin produk A45 | VDD — Power supply |
| Pin produk A46 | VSS — Ground |
| Pin produk A47 | VDDQ — I/O power supply |
| Pin produk A48 | VSS — Ground |
| Pin produk A49 | VDD — Power supply |
| Pin produk A50 | VSS — Ground |
| Pin produk A51 | VDDQ — I/O power supply |
| Pin produk A52 | VSS — Ground |
| Pin produk A53 | VDD — Power supply |
| Pin produk A54 | VSS — Ground |
| Pin produk A55 | VDDQ — I/O power supply |
| Pin produk A56 | VSS — Ground |
| Pin produk A57 | VDD — Power supply |
| Pin produk A58 | VSS — Ground |
| Pin produk A59 | VDDQ — I/O power supply |
| Pin produk A60 | VSS — Ground |
| Pin produk A61 | VDD — Power supply |
| Pin produk A62 | VSS — Ground |
| Pin produk A63 | VDDQ — I/O power supply |
| Pin produk A64 | VSS — Ground |
| Pin produk A65 | VDD — Power supply |
| Pin produk A66 | VSS — Ground |
| Pin produk A67 | VDDQ — I/O power supply |
| Pin produk A68 | VSS — Ground |
| Pin produk A69 | VDD — Power supply |
| Pin produk A70 | VSS — Ground |
| Pin produk A71 | VDDQ — I/O power supply |
| Pin produk A72 | VSS — Ground |
| Pin produk A73 | VDD — Power supply |
| Pin produk A74 | VSS — Ground |
| Pin produk A75 | VDDQ — I/O power supply |
| Pin produk A76 | VSS — Ground |
| Pin produk A77 | VDD — Power supply |
| Pin produk A78 | VSS — Ground |
| Pin produk A79 | VDDQ — I/O power supply |
| Pin produk A80 | VSS — Ground |
| Pin produk A81 | VDD — Power supply |
| Pin produk A82 | VSS — Ground |
| Pin produk A83 | VDDQ — I/O power supply |
| Pin produk A84 | VSS — Ground |
| Pin produk A85 | VDD — Power supply |
| Pin produk A86 | VSS — Ground |
| Pin produk A87 | VDDQ — I/O power supply |
| Pin produk A88 | VSS — Ground |
| Pin produk A89 | VDD — Power supply |
| Pin produk A90 | VSS — Ground |
| Pin produk A91 | VDDQ — I/O power supply |
| Pin produk A92 | VSS — Ground |
| Pin produk A93 | VDD — Power supply |
| Pin produk A94 | VSS — Ground |
| Pin produk A95 | VDDQ — I/O power supply |
| Pin produk A96 | VSS — Ground |
Aplikasi Umum
K4B4G1646D-BMH9 cocok untuk 6 aplikasis: Embedded Systems, Networking Equipment, Industrial Computing, Consumer Electronics, Automotive Infotainment, Data Center and Cloud Computing.
Embedded Systems
The K4B4G1646D-BMH9 is ideal for embedded systems requiring low power and high density memory. Its 1.35V operation reduces power consumption, making it suitable for battery-powered devices. The 4Gb density provides ample storage for operating systems and applications. The 96-ball FBGA package allows for compact PCB designs, essential in space-constrained embedded applications. With data rates up to 2133Mb/s, it supports fast data processing, enhancing system responsiveness. The device's low power and high performance make it a preferred choice for industrial controllers, IoT gateways, and portable devices.
Direkomendasikan
Networking Equipment
In networking equipment such as routers and switches, the K4B4G1646D-BMH9 provides high-speed memory for packet buffering and routing tables. Its 2133Mb/s data rate ensures low latency and high throughput, critical for network performance. The 1.35V operation reduces heat generation, improving reliability in dense networking hardware. The 4Gb density allows for large routing tables and efficient packet processing. The device's on-die termination and internal calibration enhance signal integrity, essential for high-speed data transmission. This makes it a reliable choice for enterprise and carrier-grade networking equipment.
Direkomendasikan
Industrial Computing
The K4B4G1646D-BMH9 is well-suited for industrial computing applications such as PLCs, HMI panels, and industrial PCs. Its low power consumption and high reliability make it ideal for harsh environments. The 4Gb density supports complex control algorithms and data logging. The 96-ball FBGA package ensures robust soldering and thermal performance. With data rates up to 2133Mb/s, it enables fast data processing for real-time control. The device's wide operating temperature range (if specified) would further enhance its suitability for industrial settings. Overall, it provides a balance of performance and efficiency for demanding industrial applications.
Direkomendasikan
Consumer Electronics
In consumer electronics like set-top boxes, smart TVs, and gaming consoles, the K4B4G1646D-BMH9 provides high-speed memory for multimedia processing. Its 1.35V operation reduces power consumption, extending battery life in portable devices. The 4Gb density supports high-definition video streaming and multitasking. The 96-ball FBGA package allows for slim device designs. With data rates up to 2133Mb/s, it ensures smooth playback and responsive user interfaces. The device's low power and high performance make it a popular choice for consumer electronics manufacturers.
Direkomendasikan
Automotive Infotainment
The K4B4G1646D-BMH9 is suitable for automotive infotainment systems, providing high-speed memory for navigation, multimedia, and connectivity features. Its low power consumption is beneficial for vehicle power budgets. The 4Gb density supports complex infotainment software. The 96-ball FBGA package is robust for automotive environments. With data rates up to 2133Mb/s, it enables fast map rendering and media playback. The device's reliability and performance make it a viable option for automotive applications, though AEC-Q100 qualification should be verified for strict automotive requirements.
Direkomendasikan
Data Center and Cloud Computing
In data centers and cloud computing, the K4B4G1646D-BMH9 can be used in servers and storage systems for caching and buffering. Its high data rate of 2133Mb/s supports fast data access, improving overall system performance. The 1.35V operation reduces power consumption, lowering operational costs in large-scale deployments. The 4Gb density provides sufficient memory for various workloads. The 96-ball FBGA package is suitable for high-density server boards. The device's reliability and performance make it a cost-effective solution for data center applications, though higher-density DDR4 or DDR5 may be preferred for new designs.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk K4B4G1646D-BMH9 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | K4B4G1646D-BHMA | K4B4G1646D-BFMA | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA | 96-ball FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Pin Compatibility | Reference | Pin-compatible | Pin-compatible | Not pin-compatible (ballout differences) |
Diferensiator Kunci
- Low voltage operation at 1.35V (vsMT41K256M16HA-125)
- Higher data rate support up to 2133Mb/s (vsMT41K256M16HA-125)
- Pin-compatible with other Samsung variants (vsH5TC4G63AFR-RDA)
Catatan Desain
Ensure stable power supply for VDD and VDDQ at 1.35V. Use low-ESR decoupling capacitors (0.1uF and 1uF) placed close to each power pin to minimize noise and voltage droop during high-speed switching. The device requires both VDD and VDDQ supplies; they should be derived from the same source to avoid potential latch-up.
Follow the layout guidelines in the Samsung datasheet for high-speed DDR3L routing. Maintain controlled impedance for DQ, DQS, and address/command lines (typically 40-60 ohms). Keep trace lengths matched within +/- 50 mils for data groups to ensure signal integrity. Use ground planes to provide a low-inductance return path.
The 96-ball FBGA package has a thermal resistance that depends on PCB design. Ensure adequate thermal vias under the package to dissipate heat. For typical applications, the power dissipation is low due to 1.35V operation, but in high-temperature environments, consider airflow or heatsinking. Monitor junction temperature to stay within the specified operating range.
Informasi Konformitas
RoHS compliant and halogen-free per datasheet. AEC-Q100 not applicable for memory ICs.
