M29F800FB55M3F2 vs M29F800FB55N3F2 Perbandingan
Perbandingan bersamaan detil M29F800FB55M3F2 dari Micron Technology dan M29F800FB55N3F2 dari Micron Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Micron Technology
M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron
M29F800FB55N3F2 ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | M29F800FB55M3F2 | M29F800FB55N3F2 |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | NOR Flash, Parallel | — |
| Density | 8389 kbits (8 Mbit) | — |
| Organisasi | 512K x 16-bit / 1M x 8-bit | 1M x 8 / 512K x 16 |
| Number of Words | 512 k | — |
| Bits per Word | 16 bits | — |
| Access Time | 55 ns | 55 ns |
| Supply Voltage (VCC) | 5 V | — |
| Boot Block Type | Bottom Boot Block | — |
| Antarmuka | Parallel, Asynchronous | — |
| Programming | Embedded byte/word program algorithms | — |
| OTP Area | 64 byte | — |
| Suhu Kerja | -40C to +125C | -40C to +125C |
| Automotive Qualification | Auto Grade 3 (temperature grade 3, +125C) | — |
| Paket | 44-pin SO (SOIC-44) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Packing | Tape & Reel (T/R) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free terminations) |
| Endurance | [DATA_NEEDED: program/erase endurance cycles] | — |
| Memory Density | — | 8389 kbits (8 Mbit) |
| Tegangan Pemuat | — | 5 V |
| Tipe Antarmuka | — | Parallel NOR |
| Boot Block Architecture | — | Bottom Boot Block |
| Program/Erase Controller | — | Embedded byte/word program algorithms |
| Temperature Grade | — | Automotive (AEC-Q100) |
| Package Type | — | 48-pin TSOP1 |
| Package Shape | — | Rectangular (JESD designation TSOP1) |
| Terminal Count | — | 48 |
| JESD-609 Termination Code | — | e3 (lead-free) |
| Packaging | — | Tape & Reel (T/R) |