M29F800FB55M3F2 vs M29F800FB55N3F2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M29F800FB55M3F2 disebabkan oleh Micron Technology dan M29F800FB55N3F2 disebabkan oleh Micron Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Micron Technology
M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron
M29F800FB55N3F2 ✓ AktifPengandingan Spesifikasi
| Parametr | M29F800FB55M3F2 | M29F800FB55N3F2 |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | NOR Flash, Parallel | — |
| Density | 8389 kbits (8 Mbit) | — |
| Organisasi | 512K x 16-bit / 1M x 8-bit | 1M x 8 / 512K x 16 |
| Number of Words | 512 k | — |
| Bits per Word | 16 bits | — |
| Access Time | 55 ns | 55 ns |
| Supply Voltage (VCC) | 5 V | — |
| Boot Block Type | Bottom Boot Block | — |
| Antaramuka | Parallel, Asynchronous | — |
| Programming | Embedded byte/word program algorithms | — |
| OTP Area | 64 byte | — |
| Suhu Operasi | -40C to +125C | -40C to +125C |
| Automotive Qualification | Auto Grade 3 (temperature grade 3, +125C) | — |
| Kemasan | 44-pin SO (SOIC-44) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Packing | Tape & Reel (T/R) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (lead-free terminations) |
| Endurance | [DATA_NEEDED: program/erase endurance cycles] | — |
| Memory Density | — | 8389 kbits (8 Mbit) |
| Tegangan Pemberi Arus | — | 5 V |
| Jenis Antaramuka | — | Parallel NOR |
| Boot Block Architecture | — | Bottom Boot Block |
| Program/Erase Controller | — | Embedded byte/word program algorithms |
| Temperature Grade | — | Automotive (AEC-Q100) |
| Package Type | — | 48-pin TSOP1 |
| Package Shape | — | Rectangular (JESD designation TSOP1) |
| Terminal Count | — | 48 |
| JESD-609 Termination Code | — | e3 (lead-free) |
| Packaging | — | Tape & Reel (T/R) |