M29W160FB70N3E vs M29W800FT70ZA3SE Perbandingan

Perbandingan bersamaan detil M29W160FB70N3E dari Micron Technology dan M29W800FT70ZA3SE dari Micron Technology. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Micron Technology
M29W160FB70N3E M29W160FB70N3E - 16Mb 3V Parallel NOR Flash 70ns | Micron

M29W160FB70N3E - 16Mb 3V Parallel NOR Flash 70ns | Micron

M29W160FB70N3E ✓ Aktif
Micron Technology
M29W800FT70ZA3SE M29W800FT70ZA3SE - 8Mbit 70ns NOR Flash | Micron | Embedded

M29W800FT70ZA3SE - 8Mbit 70ns NOR Flash | Micron | Embedded

M29W800FT70ZA3SE ✓ Aktif

Perbandingan Spesifikasi

Parameter Umum M29W160FB70N3E M29W800FT70ZA3SE
Merek Micron Technology Micron Technology
Kategori Memory ICs EEPROM
Status Lingkungan Hidup Aktif Aktif
Tipe Memori FLASH - NOR NOR Flash (Parallel)
Ukuran Memori 16 Mbit (2M x8 / 1M x16) 8 Mbit
Access Time 70 ns 70 ns
Antarmuka Parallel Parallel
Supply Voltage (VCC) 3.0 V to 3.6 V —
Programming Voltage Single supply (no separate VPP required) —
Bus Configuration x8 / x16 selectable (BYTE# pin) —
Architecture Boot block —
Paket / Case 48-TFSOP (0.724 in, 18.40 mm width) —
Tipe Mounting Surface Mount Surface Mount
Packaging Tray —
Suhu Kerja [DATA_NEEDED: operating temperature range] -40C to +125C
Program/Erase Endurance [DATA_NEEDED: program/erase cycles] —
Data Retention [DATA_NEEDED: data retention] —
Status Output Data polling / toggle bit —
Block Protection Yes (boot block protection) —
Organisasi — 512K x 16
Technology — SLC
Tegangan Pemuat — 2.7 V to 3.6 V
Paket — 48-TFBGA (6x8 mm)
Programming Interface — CFI command set
Boot Block Architecture — Top boot (FT = top boot block)
Density — 8 Mb
FBGA Code — [DATA_NEEDED: FBGA code]
Chipset Validation — N/A
Status RoHS — [DATA_NEEDED: RoHS status]
Program/Erase Cycles — [DATA_NEEDED: endurance]

Spek dan Sumber

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