MC68331CEH25 vs MC68332GCEH25 Perbandingan

Perbandingan bersamaan detil MC68331CEH25 dari NXP Semiconductors dan MC68332GCEH25 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MC68331CEH25 MC68331CEH25 - 25MHz CPU32 M68300 Microcontroller PQFP-132 | NXP

MC68331CEH25 - 25MHz CPU32 M68300 Microcontroller PQFP-132 | NXP

MC68331CEH25 ✗ Akhir Hidup
NXP Semiconductors
MC68332GCEH25 MC68332GCEH25 - 32-Bit 25MHz CPU32 MCU | NXP | Automotive

MC68332GCEH25 - 32-Bit 25MHz CPU32 MCU | NXP | Automotive

MC68332GCEH25 ✗ Akhir Hidup

Perbandingan Spesifikasi

Parameter Umum MC68331CEH25 MC68332GCEH25
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Akhir Hidup Akhir Hidup
Core CPU32 (32-bit) —
Operating Frequency 25 MHz —
Program Memory Type ROMless (external memory required) ROMless (external memory)
On-Chip RAM [DATA_NEEDED: RAM size in bytes] —
Paket 132-pin PQFP (24.13 mm x 24.13 mm) 132-PQFP (24.13 x 24.13 mm)
Tipe Mounting Surface Mount Surface Mount
Tegangan Pemuat [DATA_NEEDED: Vcc/Vdd range] 5 V
Rentang Suhu Kerja [DATA_NEEDED: industrial/commercial range] —
Integrated Modules SIM (System Integration Module), GPT (General Purpose Timer), QSM (Queued Serial Module) —
Internal Bus IMB (Intermodule Bus) —
Number of I/O [DATA_NEEDED: GPIO count] —
Peripherals GPT (capture/compare/PWM), QSM (SCI + SPI) TPU, QSM, SIM
Chip-Select Lines Provided by SIM (count [DATA_NEEDED]) —
Status RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS Status]
Level MSL [DATA_NEEDED: moisture sensitivity level] —
Family M68300 modular microcontroller family —
Lifecycle End of Life (per NXP product page) —
Core Processor — CPU32 (M683xx)
Core Size — 32-Bit
Frekuensi Bawah Maximum — 25 MHz
SRAM — 2 KB
TPU Channels — 16 (Time Processing Unit)
Serial Interfaces — QSPI, SCI (QSM)
Suhu Kerja — [DATA_NEEDED: Operating Temperature Range]
Architecture — Modular via Intermodule Bus (IMB)
Application Grade — Automotive
Packaging — Tray
Status Lingkungan Hidup — End of Life (per NXP product page)

Spek dan Sumber

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