MC9S12B256MFUE vs MC9S12DT256MFUE Perbandingan
Perbandingan bersamaan detil MC9S12B256MFUE dari NXP Semiconductors dan MC9S12DT256MFUE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MC9S12B256MFUE | MC9S12DT256MFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core | HCS12 (16-bit CISC) | — |
| CPU Family | S12B (MC9S12B series) | — |
| Maximum CPU Clock | 25 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| RAM | 12 KB | [DATA_NEEDED: RAM size] |
| EEPROM | 4 KB | [DATA_NEEDED: EEPROM size] |
| Tegangan Pemuat | 2.35 V to 5.5 V | — |
| ADC | 10-bit, 8-channel | 16-channel, 10-bit (per family) |
| PWM Module | 8-channel, 8-bit | 8-channel 16-bit PWM |
| CAN (msCAN) | 1 x CAN 2.0A/B | — |
| SCI / SPI / I2C | Yes (1 each) | — |
| Enhanced Capture Timer | 6 x 16-bit channels | — |
| Suhu Kerja | -40 C to +125 C (junction) | — |
| Paket | 80-QFP, 14 x 14 mm, 1.0 mm pitch | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Debug Interface | BDM (Background Debug Mode) | — |
| Lifecycle | NRND (Not Recommended for New Designs) | — |
| Core Architecture | — | HCS12 (CPU12), 16-bit CISC |
| Maximum CPU Frequency | — | 25 MHz |
| Flash Memory | — | 256 KB (256K x 8) |
| Lebar Bus Data | — | 16-bit |
| Operating Supply Voltage (Core) | — | 2.35 V to 2.75 V |
| I/O Supply Voltage | — | 5V-tolerant I/O on VDDR/VSSR |
| Number of I/O Pins | — | 91 |
| Package Type | — | 80-QFP (PQFP/LQFP-80, 14x14 mm) |
| Terminal Form | — | GULL WING |
| Number of Terminals | — | 80 |
| Temperature Grade | — | Automotive |
| On-chip CAN Module | — | MSCAN (CAN 2.0A/B) |
| Communication Peripherals | — | SCI, SPI, IIC, BDLC |