MC9S12B256MFUE vs MC9S12DT256MFUE Karşılaştırma
Ayrıntılı yan yana karşılaştırma MC9S12B256MFUE tarafından NXP Semiconductors ve MC9S12DT256MFUE tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ AktifÖzellik Karşılaştırması
| Parametre | MC9S12B256MFUE | MC9S12DT256MFUE |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Yaşam Döngüsü Durumu | NRND | Aktif |
| Core | HCS12 (16-bit CISC) | — |
| CPU Family | S12B (MC9S12B series) | — |
| Maximum CPU Clock | 25 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| RAM | 12 KB | [DATA_NEEDED: RAM size] |
| EEPROM | 4 KB | [DATA_NEEDED: EEPROM size] |
| Besleme Gerilimi | 2.35 V to 5.5 V | — |
| ADC | 10-bit, 8-channel | 16-channel, 10-bit (per family) |
| PWM Module | 8-channel, 8-bit | 8-channel 16-bit PWM |
| CAN (msCAN) | 1 x CAN 2.0A/B | — |
| SCI / SPI / I2C | Yes (1 each) | — |
| Enhanced Capture Timer | 6 x 16-bit channels | — |
| İşletim Sıcaklığı | -40 C to +125 C (junction) | — |
| Paket | 80-QFP, 14 x 14 mm, 1.0 mm pitch | — |
| Montaj Türü | Surface Mount | Surface Mount |
| MSL Seviyesi | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| RoHS Durumu | Compliant | [DATA_NEEDED: RoHS status] |
| Debug Interface | BDM (Background Debug Mode) | — |
| Lifecycle | NRND (Not Recommended for New Designs) | — |
| Core Architecture | — | HCS12 (CPU12), 16-bit CISC |
| Maximum CPU Frequency | — | 25 MHz |
| Flash Memory | — | 256 KB (256K x 8) |
| Veri Bus Genişliği | — | 16-bit |
| Operating Supply Voltage (Core) | — | 2.35 V to 2.75 V |
| I/O Supply Voltage | — | 5V-tolerant I/O on VDDR/VSSR |
| Number of I/O Pins | — | 91 |
| Package Type | — | 80-QFP (PQFP/LQFP-80, 14x14 mm) |
| Terminal Form | — | GULL WING |
| Number of Terminals | — | 80 |
| Temperature Grade | — | Automotive |
| On-chip CAN Module | — | MSCAN (CAN 2.0A/B) |
| Communication Peripherals | — | SCI, SPI, IIC, BDLC |