MC9S12B256MFUE vs MC9S12DT256MFUE Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12B256MFUE disebabkan oleh NXP Semiconductors dan MC9S12DT256MFUE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MC9S12B256MFUE MC9S12B256MFUE - 16-bit HCS12 MCU, 256KB Flash | NXP

MC9S12B256MFUE - 16-bit HCS12 MCU, 256KB Flash | NXP

MC9S12B256MFUE Nrnd
NXP Semiconductors
MC9S12DT256MFUE MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE ✓ Aktif

Pengandingan Spesifikasi

Parametr MC9S12B256MFUE MC9S12DT256MFUE
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup NRND Aktif
Core HCS12 (16-bit CISC) —
CPU Family S12B (MC9S12B series) —
Maximum CPU Clock 25 MHz —
Program Memory (Flash) 256 KB (256K x 8) —
RAM 12 KB [DATA_NEEDED: RAM size]
EEPROM 4 KB [DATA_NEEDED: EEPROM size]
Tegangan Pemberi Arus 2.35 V to 5.5 V —
ADC 10-bit, 8-channel 16-channel, 10-bit (per family)
PWM Module 8-channel, 8-bit 8-channel 16-bit PWM
CAN (msCAN) 1 x CAN 2.0A/B —
SCI / SPI / I2C Yes (1 each) —
Enhanced Capture Timer 6 x 16-bit channels —
Suhu Operasi -40 C to +125 C (junction) —
Kemasan 80-QFP, 14 x 14 mm, 1.0 mm pitch —
Jenis Pemasangan Surface Mount Surface Mount
Aras MSL 3 (168 hours) [DATA_NEEDED: MSL level]
Status RoHS Compliant [DATA_NEEDED: RoHS status]
Debug Interface BDM (Background Debug Mode) —
Lifecycle NRND (Not Recommended for New Designs) —
Core Architecture — HCS12 (CPU12), 16-bit CISC
Maximum CPU Frequency — 25 MHz
Flash Memory — 256 KB (256K x 8)
Lebar Bus Data — 16-bit
Operating Supply Voltage (Core) — 2.35 V to 2.75 V
I/O Supply Voltage — 5V-tolerant I/O on VDDR/VSSR
Number of I/O Pins — 91
Package Type — 80-QFP (PQFP/LQFP-80, 14x14 mm)
Terminal Form — GULL WING
Number of Terminals — 80
Temperature Grade — Automotive
On-chip CAN Module — MSCAN (CAN 2.0A/B)
Communication Peripherals — SCI, SPI, IIC, BDLC

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