MC9S12DT256CMPV vs MC9S12E256MPVE Perbandingan
Perbandingan bersamaan detil MC9S12DT256CMPV dari NXP Semiconductors dan MC9S12E256MPVE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ AktifPerbandingan Spesifikasi
| Parameter Umum | MC9S12DT256CMPV | MC9S12E256MPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Core Architecture | HCS12 (S12) 16-bit CISC | — |
| Bus Frequency | Up to 50 MHz | — |
| Program Flash | 256 KB | — |
| RAM | 12 KB | 16 KB |
| EEPROM | 4 KB | — |
| Paket | LQFP-112 | 112-LQFP (20x20 mm) |
| Jumlah Pin | 112 | 112 |
| Operating Voltage | 5.0 V (4.5 V to 5.5 V) | — |
| Temperature Grade | Automotive (-40C to +125C) | — |
| ADC | 2 x 8-channel 10-bit | 8-channel, 10-bit |
| PWM Channels | 8 channels | 6 |
| Enhanced Capture Timer | 8-channel (ECT) | — |
| SCI (UART) Interfaces | 2 | — |
| SPI Interfaces | 2 | — |
| CAN Modules | 1 x msCAN (CAN 2.0A/B) | — |
| GPIO (Approx.) | 20 discrete digital I/O lines | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Tipe Mounting | Surface Mount (LQFP, gull-wing) | Surface Mount |
| Status RoHS | Compliant (per NXP product page) | — |
| Core | — | HCS12 |
| Core Size | — | 16-bit |
| Maximum CPU Speed | — | 25 MHz |
| Program Memory | — | 256 KB Flash |
| Tegangan Pemuat | — | 5 V single rail (Vreg internal) |
| SCI Modules | — | 3 (asynchronous serial) |
| SPI Modules | — | 1 |
| IIC Modules | — | 1 (Inter-IC Bus) |
| Timer Modules | — | 3 x 16-bit, 4-channel |
| Connectivity | — | EBI/EMI, I2C, SPI, SCI |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| RoHS | — | [DATA_NEEDED: RoHS status] |