MC9S12DT256CMPV vs MC9S12E256MPVE 比較
詳細並排比較 MC9S12DT256CMPV 由 NXP Semiconductors 與 MC9S12E256MPVE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ 啟用中規格比較
| 參數 | MC9S12DT256CMPV | MC9S12E256MPVE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | Obsolete |
| Core Architecture | HCS12 (S12) 16-bit CISC | — |
| Bus Frequency | Up to 50 MHz | — |
| Program Flash | 256 KB | — |
| RAM | 12 KB | 16 KB |
| EEPROM | 4 KB | — |
| 封裝 | LQFP-112 | 112-LQFP (20x20 mm) |
| 腳位數 | 112 | 112 |
| Operating Voltage | 5.0 V (4.5 V to 5.5 V) | — |
| Temperature Grade | Automotive (-40C to +125C) | — |
| ADC | 2 x 8-channel 10-bit | 8-channel, 10-bit |
| PWM Channels | 8 channels | 6 |
| Enhanced Capture Timer | 8-channel (ECT) | — |
| SCI (UART) Interfaces | 2 | — |
| SPI Interfaces | 2 | — |
| CAN Modules | 1 x msCAN (CAN 2.0A/B) | — |
| GPIO (Approx.) | 20 discrete digital I/O lines | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| 安裝類型 | Surface Mount (LQFP, gull-wing) | Surface Mount |
| RoHS 狀態 | Compliant (per NXP product page) | — |
| Core | — | HCS12 |
| Core Size | — | 16-bit |
| Maximum CPU Speed | — | 25 MHz |
| Program Memory | — | 256 KB Flash |
| 供應電壓 | — | 5 V single rail (Vreg internal) |
| SCI Modules | — | 3 (asynchronous serial) |
| SPI Modules | — | 1 |
| IIC Modules | — | 1 (Inter-IC Bus) |
| Timer Modules | — | 3 x 16-bit, 4-channel |
| Connectivity | — | EBI/EMI, I2C, SPI, SCI |
| 工作溫度 | — | [DATA_NEEDED: operating temperature range] |
| RoHS | — | [DATA_NEEDED: RoHS status] |