MC9S12DT256CMPV vs MC9S12E256MPVE Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12DT256CMPV disebabkan oleh NXP Semiconductors dan MC9S12E256MPVE disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ AktifPengandingan Spesifikasi
| Parametr | MC9S12DT256CMPV | MC9S12E256MPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Core Architecture | HCS12 (S12) 16-bit CISC | — |
| Bus Frequency | Up to 50 MHz | — |
| Program Flash | 256 KB | — |
| RAM | 12 KB | 16 KB |
| EEPROM | 4 KB | — |
| Kemasan | LQFP-112 | 112-LQFP (20x20 mm) |
| Kiraan Pin | 112 | 112 |
| Operating Voltage | 5.0 V (4.5 V to 5.5 V) | — |
| Temperature Grade | Automotive (-40C to +125C) | — |
| ADC | 2 x 8-channel 10-bit | 8-channel, 10-bit |
| PWM Channels | 8 channels | 6 |
| Enhanced Capture Timer | 8-channel (ECT) | — |
| SCI (UART) Interfaces | 2 | — |
| SPI Interfaces | 2 | — |
| CAN Modules | 1 x msCAN (CAN 2.0A/B) | — |
| GPIO (Approx.) | 20 discrete digital I/O lines | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Jenis Pemasangan | Surface Mount (LQFP, gull-wing) | Surface Mount |
| Status RoHS | Compliant (per NXP product page) | — |
| Core | — | HCS12 |
| Core Size | — | 16-bit |
| Maximum CPU Speed | — | 25 MHz |
| Program Memory | — | 256 KB Flash |
| Tegangan Pemberi Arus | — | 5 V single rail (Vreg internal) |
| SCI Modules | — | 3 (asynchronous serial) |
| SPI Modules | — | 1 |
| IIC Modules | — | 1 (Inter-IC Bus) |
| Timer Modules | — | 3 x 16-bit, 4-channel |
| Connectivity | — | EBI/EMI, I2C, SPI, SCI |
| Suhu Operasi | — | [DATA_NEEDED: operating temperature range] |
| RoHS | — | [DATA_NEEDED: RoHS status] |