MC9S12DT256MFUE vs MC9S12B64CFUE Perbandingan
Perbandingan bersamaan detil MC9S12DT256MFUE dari NXP Semiconductors dan MC9S12B64CFUE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ AktifNXP Semiconductors
MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP
MC9S12B64CFUE ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MC9S12DT256MFUE | MC9S12B64CFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Waktu Pembelian Terakhir |
| Core Architecture | HCS12 (CPU12), 16-bit CISC | — |
| Maximum CPU Frequency | 25 MHz | 25 MHz |
| Flash Memory | 256 KB (256K x 8) | 64 KB |
| RAM | [DATA_NEEDED: RAM size] | 2 KB |
| EEPROM | [DATA_NEEDED: EEPROM size] | 1 KB |
| Lebar Bus Data | 16-bit | — |
| Operating Supply Voltage (Core) | 2.35 V to 2.75 V | — |
| I/O Supply Voltage | 5V-tolerant I/O on VDDR/VSSR | — |
| Number of I/O Pins | 91 | — |
| Package Type | 80-QFP (PQFP/LQFP-80, 14x14 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Terminal Form | GULL WING | — |
| Number of Terminals | 80 | — |
| Temperature Grade | Automotive | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| On-chip CAN Module | MSCAN (CAN 2.0A/B) | — |
| ADC | 16-channel, 10-bit (per family) | 8-channel, 10-bit |
| PWM Module | 8-channel 16-bit PWM | — |
| Communication Peripherals | SCI, SPI, IIC, BDLC | — |
| Core | — | HCS12 (S12 CISC, 16-bit) |
| Tegangan Pemuat | — | 5 V (typical) |
| Rentang Suhu Kerja | — | 0C to +70C (commercial 'C' grade) |
| Paket | — | 80-QFP (14x14 mm) |
| CAN Module | — | 1x MSCAN 2.0A/B |
| SCI/SPI | — | 2x SCI, 1x SPI |
| Timers | — | 16-bit Timer + 8-bit PWM + PIT |
| I/O Pins | — | [DATA_NEEDED: I/O pin count] |
| Debug Interface | — | Background Debug Mode (BDM) |
| Lead-Free / Terminal Finish | — | Matte Tin (Sn) |
| Peak Reflow Temperature | — | 260C (max 40 s) |