MC9S12P128MQK vs MC9S12DT256CPVE Perbandingan
Perbandingan bersamaan detil MC9S12P128MQK dari NXP Semiconductors dan MC9S12DT256CPVE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112
MC9S12DT256CPVE NrndPerbandingan Spesifikasi
| Parameter Umum | MC9S12P128MQK | MC9S12DT256CPVE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | HCS12 / CPU12 (16-bit) | — |
| Program Memory | 128 KB Flash | — |
| Data RAM | 6 KB | — |
| Maximum CPU Frequency | 32 MHz | — |
| Lebar Bus Data | 16-bit | 16-bit |
| Number of I/Os | 64 I/O | — |
| ADC Resolution | 12-bit | — |
| Tegangan Pemuat | 3.15 V to 5.5 V | 2.35 V to 2.75 V (core), 5 V I/O tolerant typical |
| Suhu Kerja | -40 °C to +125 °C (Automotive) | -40C to +85C (industrial, per 'P' suffix family) |
| Gaya Mounting | SMD/SMT | — |
| Paket | QFP-80 (LQFP-80, 14x14 mm) | 112-pin LQFP (20x20 mm) |
| Terminal Form | GULL WING | — |
| Communications | CAN, SCI, SPI | — |
| Programming Interface | Background Debug Mode (BDM) | — |
| Temperature Grade | Automotive | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status from manufacturer] |
| Core Processor | — | HCS12 (CPU12 CISC) |
| Core Size | — | 16-bit |
| Frekuensi Bawah Maximum | — | 25 MHz |
| Program Memory Size | — | 256 KB (256K x 8) Flash |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Pins | — | 91 |
| ADC | — | 2x 8-channel, 10-bit |
| PWM Channels | — | 8 channels |
| Connectivity | — | CAN, I2C, SCI (UART), SPI |
| Timers | — | 8-channel Enhanced Capture Timer (ECT) |
| Tipe Mounting | — | Surface Mount |
| Debug Interface | — | BDM (Background Debug Mode) |
| Watchdog | — | COP (Computer Operating Properly) watchdog |