MC9S12XDT256VAL vs MC9S12XDT512MAA Perbandingan
Perbandingan bersamaan detil MC9S12XDT256VAL dari NXP Semiconductors dan MC9S12XDT512MAA dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S12XDT256VAL | MC9S12XDT512MAA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Product Type | 16-bit Microcontroller (MCU) | — |
| Core Architecture | HCS12X (enhanced HCS12) with XGATE co-processor | — |
| CPU Instruction Set | CISC, upward-compatible with HCS12 | — |
| Maximum CPU Frequency | 80 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| Data Memory (RAM) | [DATA_NEEDED: RAM size, datasheet shows 16 KB] | — |
| EEPROM | 4 KB | — |
| ADC | 16-channel, 10-bit | — |
| CAN Controllers (msCAN) | [DATA_NEEDED: msCAN count] | — |
| General-Purpose I/O | Up to 91 GPIO | — |
| PWM Channels | 8 channels | — |
| Supply Voltage - Core | 2.5 V | — |
| Supply Voltage - I/O | 5 V | — |
| Suhu Kerja | -40C to +105C (VAL = Automotive grade) | -40C to +125C (TA) |
| Paket | 112-LQFP (20 x 20 mm) | 80-QFP (14x14 mm), Square, Gull Wing |
| Tipe Mounting | Surface Mount | Surface Mount |
| Level MSL | 3 | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Status RoHS | Compliant | — |
| Status Lingkungan Hidup | NRND (Not Recommended for New Designs) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Tegangan Pemuat | — | [DATA_NEEDED: supply voltage range] |
| Packaging Method | — | Tray |
| Bebas Halogen | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |