MC9S12XDT256VAL vs MC9S12XDT512MAA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S12XDT256VAL disebabkan oleh NXP Semiconductors dan MC9S12XDT512MAA disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S12XDT256VAL | MC9S12XDT512MAA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Product Type | 16-bit Microcontroller (MCU) | — |
| Core Architecture | HCS12X (enhanced HCS12) with XGATE co-processor | — |
| CPU Instruction Set | CISC, upward-compatible with HCS12 | — |
| Maximum CPU Frequency | 80 MHz | — |
| Program Memory (Flash) | 256 KB (256K x 8) | — |
| Data Memory (RAM) | [DATA_NEEDED: RAM size, datasheet shows 16 KB] | — |
| EEPROM | 4 KB | — |
| ADC | 16-channel, 10-bit | — |
| CAN Controllers (msCAN) | [DATA_NEEDED: msCAN count] | — |
| General-Purpose I/O | Up to 91 GPIO | — |
| PWM Channels | 8 channels | — |
| Supply Voltage - Core | 2.5 V | — |
| Supply Voltage - I/O | 5 V | — |
| Suhu Operasi | -40C to +105C (VAL = Automotive grade) | -40C to +125C (TA) |
| Kemasan | 112-LQFP (20 x 20 mm) | 80-QFP (14x14 mm), Square, Gull Wing |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Aras MSL | 3 | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Status RoHS | Compliant | — |
| Status Lingkungan Hidup | NRND (Not Recommended for New Designs) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Tegangan Pemberi Arus | — | [DATA_NEEDED: supply voltage range] |
| Packaging Method | — | Tray |
| Boson Bebas | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |