MC9S12XDT256VAL vs MC9S12XDT512MAA 比較

詳細並排比較 MC9S12XDT256VAL 由 NXP Semiconductors 與 MC9S12XDT512MAA 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S12XDT256VAL MC9S12XDT256VAL - 16-Bit 80MHz HCS12X MCU 256KB Flash | NXP

MC9S12XDT256VAL - 16-Bit 80MHz HCS12X MCU 256KB Flash | NXP

MC9S12XDT256VAL Nrnd
NXP Semiconductors
MC9S12XDT512MAA MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA Nrnd

規格比較

參數 MC9S12XDT256VAL MC9S12XDT512MAA
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND NRND
Product Type 16-bit Microcontroller (MCU) —
Core Architecture HCS12X (enhanced HCS12) with XGATE co-processor —
CPU Instruction Set CISC, upward-compatible with HCS12 —
Maximum CPU Frequency 80 MHz —
Program Memory (Flash) 256 KB (256K x 8) —
Data Memory (RAM) [DATA_NEEDED: RAM size, datasheet shows 16 KB] —
EEPROM 4 KB —
ADC 16-channel, 10-bit —
CAN Controllers (msCAN) [DATA_NEEDED: msCAN count] —
General-Purpose I/O Up to 91 GPIO —
PWM Channels 8 channels —
Supply Voltage - Core 2.5 V —
Supply Voltage - I/O 5 V —
工作溫度 -40C to +105C (VAL = Automotive grade) -40C to +125C (TA)
封裝 112-LQFP (20 x 20 mm) 80-QFP (14x14 mm), Square, Gull Wing
安裝類型 Surface Mount Surface Mount
MSL 等級 3 —
Debug Interface Background Debug Mode (BDM) —
RoHS 狀態 Compliant —
生命週期狀態 NRND (Not Recommended for New Designs) —
Core Processor — HCS12X
Core Size — 16-Bit
Maximum Clock Speed — 80 MHz
Program Memory Size — 512KB (512K x 8)
Program Memory Type — FLASH
RAM Size — 20KB
EEPROM Size — 4KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 59
ADC Resolution — 10-bit, 8-channel
供應電壓 — [DATA_NEEDED: supply voltage range]
Packaging Method — Tray
無鹵素 — Compliant
ECCN — 3A991.a.2
Estimated EOL Date — 2028

資料表與資源

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