MCIMX355AVM4BR2 vs MCIMX355AVM4B Perbandingan
Perbandingan bersamaan detil MCIMX355AVM4BR2 dari NXP Semiconductors dan MCIMX355AVM4B dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MCIMX355AVM4BR2 | MCIMX355AVM4B |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core Architecture | ARM1136JF-S (32-bit, Jazelle) | ARM1136JF-S |
| Maximum CPU Frequency | 400 MHz | — |
| Internal SRAM | 128 KB | — |
| Process Technology | 90 nm CMOS | — |
| Paket | 400-LFBGA (MAP-BGA) 17x17 mm, 0.8 mm pitch | 400-LFBGA / MAPBGA-400 (17 x 17 mm, 0.8 mm pitch) |
| Number of I/O | 96 | — |
| Tegangan Pemuat | [DATA_NEEDED: core and I/O voltage] | [DATA_NEEDED: VDD range] |
| Suhu Kerja | [DATA_NEEDED: AEC-Q100 grade and range] | — |
| Automotive Qualification | AEC-Q100 | AEC-Q100 Grade 3 |
| Image Processing Unit (IPU) | Yes (integrated) | — |
| eMMA Multimedia Accelerator | Yes (integrated) | — |
| USB | USB 2.0 High-Speed OTG | — |
| MMC/SD Interfaces | 2 | — |
| UART | 3 | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| Status RoHS | [DATA_NEEDED: explicit RoHS statement] | Compliant |
| Core Count | — | 1 |
| Lebar Bus Data | — | 32-bit |
| Maximum CPU Clock | — | 400 MHz |
| Rentang Suhu Kerja | — | -40 C to +85 C (ambient, AEC-Q100 Grade 3) |
| Program Memory Type | — | ROMless (external memory required) |
| On-chip RAM | — | 128 KB |
| Number of User I/O | — | 96 |
| Oscillator Type | — | External |
| Audio Interfaces | — | ESAI (5.1), SPDIF I/O, ASRC |
| Image Processing Unit | — | Yes (integrated IPU) |
| Level MSL | — | 3 (168 hours) |