MCIMX355AVM4BR2 vs MCIMX355AVM4B 比較
詳細並排比較 MCIMX355AVM4BR2 由 NXP Semiconductors 與 MCIMX355AVM4B 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MCIMX355AVM4BR2 | MCIMX355AVM4B |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 啟用中 |
| Core Architecture | ARM1136JF-S (32-bit, Jazelle) | ARM1136JF-S |
| Maximum CPU Frequency | 400 MHz | — |
| Internal SRAM | 128 KB | — |
| Process Technology | 90 nm CMOS | — |
| 封裝 | 400-LFBGA (MAP-BGA) 17x17 mm, 0.8 mm pitch | 400-LFBGA / MAPBGA-400 (17 x 17 mm, 0.8 mm pitch) |
| Number of I/O | 96 | — |
| 供應電壓 | [DATA_NEEDED: core and I/O voltage] | [DATA_NEEDED: VDD range] |
| 工作溫度 | [DATA_NEEDED: AEC-Q100 grade and range] | — |
| Automotive Qualification | AEC-Q100 | AEC-Q100 Grade 3 |
| Image Processing Unit (IPU) | Yes (integrated) | — |
| eMMA Multimedia Accelerator | Yes (integrated) | — |
| USB | USB 2.0 High-Speed OTG | — |
| MMC/SD Interfaces | 2 | — |
| UART | 3 | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| RoHS 狀態 | [DATA_NEEDED: explicit RoHS statement] | Compliant |
| Core Count | — | 1 |
| 資料匯流排寬度 | — | 32-bit |
| Maximum CPU Clock | — | 400 MHz |
| 工作溫度範圍 | — | -40 C to +85 C (ambient, AEC-Q100 Grade 3) |
| Program Memory Type | — | ROMless (external memory required) |
| On-chip RAM | — | 128 KB |
| Number of User I/O | — | 96 |
| Oscillator Type | — | External |
| Audio Interfaces | — | ESAI (5.1), SPDIF I/O, ASRC |
| Image Processing Unit | — | Yes (integrated IPU) |
| MSL 等級 | — | 3 (168 hours) |