MCIMX355AVM4BR2 vs MCIMX355AVM4B Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MCIMX355AVM4BR2 disebabkan oleh NXP Semiconductors dan MCIMX355AVM4B disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MCIMX355AVM4BR2 | MCIMX355AVM4B |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core Architecture | ARM1136JF-S (32-bit, Jazelle) | ARM1136JF-S |
| Maximum CPU Frequency | 400 MHz | — |
| Internal SRAM | 128 KB | — |
| Process Technology | 90 nm CMOS | — |
| Kemasan | 400-LFBGA (MAP-BGA) 17x17 mm, 0.8 mm pitch | 400-LFBGA / MAPBGA-400 (17 x 17 mm, 0.8 mm pitch) |
| Number of I/O | 96 | — |
| Tegangan Pemberi Arus | [DATA_NEEDED: core and I/O voltage] | [DATA_NEEDED: VDD range] |
| Suhu Operasi | [DATA_NEEDED: AEC-Q100 grade and range] | — |
| Automotive Qualification | AEC-Q100 | AEC-Q100 Grade 3 |
| Image Processing Unit (IPU) | Yes (integrated) | — |
| eMMA Multimedia Accelerator | Yes (integrated) | — |
| USB | USB 2.0 High-Speed OTG | — |
| MMC/SD Interfaces | 2 | — |
| UART | 3 | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| Status RoHS | [DATA_NEEDED: explicit RoHS statement] | Compliant |
| Core Count | — | 1 |
| Lebar Bus Data | — | 32-bit |
| Maximum CPU Clock | — | 400 MHz |
| Gambaran Suhu Operasi | — | -40 C to +85 C (ambient, AEC-Q100 Grade 3) |
| Program Memory Type | — | ROMless (external memory required) |
| On-chip RAM | — | 128 KB |
| Number of User I/O | — | 96 |
| Oscillator Type | — | External |
| Audio Interfaces | — | ESAI (5.1), SPDIF I/O, ASRC |
| Image Processing Unit | — | Yes (integrated IPU) |
| Aras MSL | — | 3 (168 hours) |