MCIMX355AVM4BR2 vs MCIMX355AVM4B Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MCIMX355AVM4BR2 sa pamamagitan ng NXP Semiconductors at MCIMX355AVM4B sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MCIMX355AVM4BR2 | MCIMX355AVM4B |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Core Architecture | ARM1136JF-S (32-bit, Jazelle) | ARM1136JF-S |
| Maximum CPU Frequency | 400 MHz | — |
| Internal SRAM | 128 KB | — |
| Process Technology | 90 nm CMOS | — |
| Packhaging | 400-LFBGA (MAP-BGA) 17x17 mm, 0.8 mm pitch | 400-LFBGA / MAPBGA-400 (17 x 17 mm, 0.8 mm pitch) |
| Number of I/O | 96 | — |
| Volte ng Pagbibigay | [DATA_NEEDED: core and I/O voltage] | [DATA_NEEDED: VDD range] |
| Temperature na Operasyon | [DATA_NEEDED: AEC-Q100 grade and range] | — |
| Automotive Qualification | AEC-Q100 | AEC-Q100 Grade 3 |
| Image Processing Unit (IPU) | Yes (integrated) | — |
| eMMA Multimedia Accelerator | Yes (integrated) | — |
| USB | USB 2.0 High-Speed OTG | — |
| MMC/SD Interfaces | 2 | — |
| UART | 3 | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Packaging | Tape & Reel (TR) | — |
| Tindminan RoHS | [DATA_NEEDED: explicit RoHS statement] | Compliant |
| Core Count | — | 1 |
| Width ng Data Bus | — | 32-bit |
| Maximum CPU Clock | — | 400 MHz |
| Hanay ng Temperature na Operasyon | — | -40 C to +85 C (ambient, AEC-Q100 Grade 3) |
| Program Memory Type | — | ROMless (external memory required) |
| On-chip RAM | — | 128 KB |
| Number of User I/O | — | 96 |
| Oscillator Type | — | External |
| Audio Interfaces | — | ESAI (5.1), SPDIF I/O, ASRC |
| Image Processing Unit | — | Yes (integrated IPU) |
| Level ng MSL | — | 3 (168 hours) |