MPC8306VMABDCA vs MPC8306SVMABDCA Perbandingan
Perbandingan bersamaan detil MPC8306VMABDCA dari NXP Semiconductors dan MPC8306SVMABDCA dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8306VMABDCA - PowerQUICC II Pro SoC, e300, 133MHz | NXP
MPC8306VMABDCA ✗ Akhir HidupNXP Semiconductors
MPC8306SVMABDCA - PowerQUICC II Pro MPU, e300, 133MHz | NXP
MPC8306SVMABDCA ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MPC8306VMABDCA | MPC8306SVMABDCA |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Waktu Pembelian Terakhir |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | — |
| Lebar Bus Data | 32 bit | 32-bit |
| Core Frequency | 133 MHz | 133 MHz |
| Memory Controller | DDR2 with ECC | DDR2 up to 333 MHz data rate |
| Co-Processor / DSP | QUICC Engine (communications offload) | — |
| Ethernet | 2x 10/100 MAC with R/MII, IEEE 1588 v2 | Dual 10/100 MAC with MII/RMII |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| CAN | CAN 2.0 | — |
| Serial Protocols | HDLC, TDM (time-slot) | — |
| Graphics Acceleration | No | — |
| Paket | 369-LFBGA (19x19 mm) | 369-MAPBGA (19x19 mm, 0.8 mm pitch) |
| Tipe Mounting | Surface Mount (BGA) | — |
| Suhu Kerja | 0 °C to +105 °C | 0C to +105C |
| Status RoHS | [DATA_NEEDED: rohs status] | Compliant (lead-free) |
| Series | MPC83xx / PowerQUICC II Pro | — |
| Core Architecture | — | PowerPC e300c3 (Power Architecture) |
| Core Count | — | 1 |
| On-chip Cache | — | 32 KB instruction / 32 KB data |
| Connectivity | — | QUICC Engine (HDLC, TDM), 2x UART |
| Tegangan Pemuat | — | 1.0 V core / 1.8 V, 2.5 V, 3.3 V I/O |
| Lead-Free | — | Yes |
| Level MSL | — | [DATA_NEEDED: MSL level] |