MPC860PZQ80D4R2518 vs MPC860PZQ66D4 Perbandingan
Perbandingan bersamaan detil MPC860PZQ80D4R2518 dari NXP Semiconductors dan MPC860PZQ66D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC860PZQ80D4R2518 - PowerQUICC 80MHz SoC | NXP | 357-PBGA
MPC860PZQ80D4R2518 NrndPerbandingan Spesifikasi
| Parameter Umum | MPC860PZQ80D4R2518 | MPC860PZQ66D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Akhir Hidup |
| Series | PowerQUICC MPC860 | PowerQUICC |
| Core Architecture | 32-bit PowerPC (Power Architecture) | 32-bit PowerPC |
| Core Count | 1 | 1 |
| Maximum Core Frequency | 80 MHz | — |
| On-Chip Communications Module (CPM) | Yes (RISC engine for protocol acceleration) | — |
| Ethernet MAC | 10/100 Mbps with MII | — |
| HDLC/SDLC Controllers | Multiple SCCs with HDLC support | — |
| ATM Support | Yes (via CPM SAR) | — |
| PCMCIA Interface | Yes | — |
| Serial Communications Controllers (SCC) | 2 | — |
| Serial Management Controllers (SMC) | 2 | — |
| SPI / I2C | 1 SPI, 1 I2C | — |
| DMA Channels | 4 | — |
| Paket | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) |
| Suhu Kerja | 0C to +95C | -40C to +95C (industrial, per D4 revision) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (Contains Lead) |
| Tegangan Pemuat | [DATA_NEEDED: core and I/O voltage rails] | — |
| Processor Family | — | PowerQUICC MPC8xx |
| Maximum CPU Clock | — | 66 MHz |
| Tegangan Pemuat Kerja | — | 3.3 V |
| Lead Status | — | Contains Lead (non-RoHS) |
| Packaging | — | Tray |
| On-chip Communications Module | — | CPM with SCCs, SMCs, Ethernet, HDLC |
| Memory Controller | — | DRAM, SRAM, Flash, EPROM |
| Timers | — | 4 x 16-bit |
| Process Technology | — | 0.32 um CMOS |
| Level MSL | — | 3 |