MPC870ZT133 vs MPC875VR133 Perbandingan
Perbandingan bersamaan detil MPC870ZT133 dari NXP Semiconductors dan MPC875VR133 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC870ZT133 | MPC875VR133 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Manufacturer | NXP USA Inc. (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Family | PowerQUICC MPC8xx | — |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | — |
| Core Architecture | Power Architecture (G2_LE) | Power Architecture (32-bit RISC) |
| Core Frequency | 133 MHz | 133 MHz |
| Number of Cores | 1 | — |
| External Data Bus Width | 32-bit | — |
| Tegangan Pemuat | 3.3 V I/O, 1.8 V core | — |
| Suhu Kerja | 0C to +95C (commercial) | 0 °C to +95 °C |
| Paket / Case | 256-PBGA (23 x 23 mm) | — |
| Terminal Form | BALL | — |
| Number of Terminals | 256 | — |
| Package Code | HBGA | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Lead Free Status | Contains Lead | — |
| Status RoHS | Non-Compliant (legacy part) | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Performance | — | 176 MIPS |
| Lebar Bus Data | — | 32 bit |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |
| Level MSL | — | [DATA_NEEDED: MSL level] |