MPC870ZT133 vs MPC875VR133 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC870ZT133 disebabkan oleh NXP Semiconductors dan MPC875VR133 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC870ZT133 | MPC875VR133 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Manufacturer | NXP USA Inc. (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Family | PowerQUICC MPC8xx | — |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | — |
| Core Architecture | Power Architecture (G2_LE) | Power Architecture (32-bit RISC) |
| Core Frequency | 133 MHz | 133 MHz |
| Number of Cores | 1 | — |
| External Data Bus Width | 32-bit | — |
| Tegangan Pemberi Arus | 3.3 V I/O, 1.8 V core | — |
| Suhu Operasi | 0C to +95C (commercial) | 0 °C to +95 °C |
| Kemasan / Case | 256-PBGA (23 x 23 mm) | — |
| Terminal Form | BALL | — |
| Number of Terminals | 256 | — |
| Package Code | HBGA | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Lead Free Status | Contains Lead | — |
| Status RoHS | Non-Compliant (legacy part) | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Performance | — | 176 MIPS |
| Lebar Bus Data | — | 32 bit |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |
| Aras MSL | — | [DATA_NEEDED: MSL level] |