MPC870ZT133 vs MPC875VR133 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC870ZT133 sa pamamagitan ng NXP Semiconductors at MPC875VR133 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MPC870ZT133 | MPC875VR133 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Manufacturer | NXP USA Inc. (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Family | PowerQUICC MPC8xx | — |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | — |
| Core Architecture | Power Architecture (G2_LE) | Power Architecture (32-bit RISC) |
| Core Frequency | 133 MHz | 133 MHz |
| Number of Cores | 1 | — |
| External Data Bus Width | 32-bit | — |
| Volte ng Pagbibigay | 3.3 V I/O, 1.8 V core | — |
| Temperature na Operasyon | 0C to +95C (commercial) | 0 °C to +95 °C |
| Packhaging / Kaso | 256-PBGA (23 x 23 mm) | — |
| Terminal Form | BALL | — |
| Number of Terminals | 256 | — |
| Package Code | HBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Lead Free Status | Contains Lead | — |
| Tindminan RoHS | Non-Compliant (legacy part) | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Count | — | 1 |
| Performance | — | 176 MIPS |
| Width ng Data Bus | — | 32 bit |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |