MSC8251SVT1000B vs MSC8256ESAG1000B Perbandingan
Perbandingan bersamaan detil MSC8251SVT1000B dari NXP Semiconductors dan MSC8256ESAG1000B dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP
MSC8256ESAG1000B ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | MSC8251SVT1000B | MSC8256ESAG1000B |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Status Lingkungan Hidup | Obsolete | Waktu Pembelian Terakhir |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Core Architecture | SC3850 StarCore, single core | StarCore SC3850 VLIW DSP |
| Core Revision | StarCore R2.1 | — |
| Maximum Core Clock | 1 GHz | — |
| MIPS | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Unified Cache | 512 KB (configurable, SRAM or MAP) | — |
| On-Chip RAM | 576 KB | — |
| Internal ROM | 96 KB | — |
| TDM Interfaces | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support | — |
| Ethernet MAC | Yes (integrated) | — |
| PCI Express | Yes (integrated controller) | PCIe (peripheral) |
| Serial RapidIO | Yes (SERDES-based) | SRIO (peripheral) |
| DMA Controller | Multi-channel DMA | — |
| Package Type | FCBGA (Flip-Chip Ball Grid Array) | — |
| Package Pin Count | 783 balls | — |
| Package Dimensions | 29 mm x 29 mm | — |
| Tipe Mounting | Surface Mount | Surface Mount, BGA |
| Lead-Free / Halogen-Free | Yes (lead-free, halogen-free package) | — |
| Status RoHS | Compliant | Compliant |
| Suhu Kerja | [DATA_NEEDED: operating temperature grade] | 0°C to 105°C |
| Number of Cores | — | 6 |
| Core Frequency | — | 1 GHz |
| DDR Memory Interface | — | DDR2/DDR3 with ECC |
| Gigabit Ethernet | — | GbE MACs (peripheral) |
| Security Engine | — | SEC (IPsec/SRTP/SSL) |
| Queue Engine | — | QE (peripheral) |
| Paket | — | 783-FCPBGA (29x29 mm) |
| Level MSL | — | 3 |
| Peak Reflow Temperature | — | 245°C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1, JESD-609) |
| TDM Links | — | Up to 4 independent, 62.5 Mbps each |