MSC8251SVT1000B vs MSC8256ESAG1000B 比較
詳細並排比較 MSC8251SVT1000B 由 NXP Semiconductors 與 MSC8256ESAG1000B 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MSC8251SVT1000B | MSC8256ESAG1000B |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | DSP | DSP |
| 生命週期狀態 | Obsolete | 最後購買 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Core Architecture | SC3850 StarCore, single core | StarCore SC3850 VLIW DSP |
| Core Revision | StarCore R2.1 | — |
| Maximum Core Clock | 1 GHz | — |
| MIPS | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Unified Cache | 512 KB (configurable, SRAM or MAP) | — |
| On-Chip RAM | 576 KB | — |
| Internal ROM | 96 KB | — |
| TDM Interfaces | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support | — |
| Ethernet MAC | Yes (integrated) | — |
| PCI Express | Yes (integrated controller) | PCIe (peripheral) |
| Serial RapidIO | Yes (SERDES-based) | SRIO (peripheral) |
| DMA Controller | Multi-channel DMA | — |
| Package Type | FCBGA (Flip-Chip Ball Grid Array) | — |
| Package Pin Count | 783 balls | — |
| Package Dimensions | 29 mm x 29 mm | — |
| 安裝類型 | Surface Mount | Surface Mount, BGA |
| Lead-Free / Halogen-Free | Yes (lead-free, halogen-free package) | — |
| RoHS 狀態 | Compliant | Compliant |
| 工作溫度 | [DATA_NEEDED: operating temperature grade] | 0°C to 105°C |
| Number of Cores | — | 6 |
| Core Frequency | — | 1 GHz |
| DDR Memory Interface | — | DDR2/DDR3 with ECC |
| Gigabit Ethernet | — | GbE MACs (peripheral) |
| Security Engine | — | SEC (IPsec/SRTP/SSL) |
| Queue Engine | — | QE (peripheral) |
| 封裝 | — | 783-FCPBGA (29x29 mm) |
| MSL 等級 | — | 3 |
| Peak Reflow Temperature | — | 245°C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1, JESD-609) |
| TDM Links | — | Up to 4 independent, 62.5 Mbps each |