P1012NSN2HFB vs P1012NSE2HFB Perbandingan
Perbandingan bersamaan detil P1012NSN2HFB dari NXP Semiconductors dan P1012NSE2HFB dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking
P1012NSN2HFB ⚠ Waktu Beli TerakhirNXP Semiconductors
P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP
P1012NSE2HFB ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | P1012NSN2HFB | P1012NSE2HFB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Waktu Pembelian Terakhir |
| Manufacturer | NXP Semiconductors | — |
| Series | QorIQ P1 | — |
| Core Processor | PowerPC e500v2 | — |
| Number of Cores | 1 | 1 |
| Core Architecture | 32-bit | 32-Bit Power Architecture |
| Speed | 800 MHz | — |
| Co-processors / DSP | QUICC Engine (QE) | — |
| Connectivity | Ethernet, PCIe, USB, TDM, UART, I2C, SPI | — |
| Ethernet | GbE (10/100/1000 Mbps) | Integrated GbE (multiple MACs) |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| USB | USB 2.0 (dual port) | USB 2.0 (host + device) |
| PCIe | PCIe Gen1 (x1/x2) | — |
| Process Technology | 45 nm | 45 nm CMOS |
| Paket / Case | 689-TEPBGA II (31x31 mm) with exposed thermal pad | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | 0 C to 125 C | — |
| Packaging | Tray | Tray |
| Lead Free Status | Lead Free | Lead Free |
| Status RoHS | RoHS Compliant | RoHS Compliant |
| Die Revision | 1.1 | — |
| Security | Hardware-accelerated cryptography | — |
| Processor Series | — | QorIQ P1 |
| Processor Core | — | PowerPC e500v2 |
| Maximum Core Frequency | — | 800 MHz |
| PCIe Controllers | — | PCIe Gen 2 (x1/x2/x4) |
| TDM Interfaces | — | 4 (T1/E1) |
| QUICC Engine (QE) | — | Yes (protocol offload) |
| SEC Security Accelerator | — | SEC 4.0 |
| Paket | — | 689-TEPBGA II (31x31 mm) with exposed thermal pad |
| Operating Temperature (Tj) | — | 0C to +125C |