P1012NSN2HFB vs P1012NSE2HFB Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng P1012NSN2HFB sa pamamagitan ng NXP Semiconductors at P1012NSE2HFB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking
P1012NSN2HFB ⚠ Huling PagbiliNXP Semiconductors
P1012NSE2HFB - QorIQ P1 800MHz e500v2 SoC MPU | NXP
P1012NSE2HFB ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | P1012NSN2HFB | P1012NSE2HFB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Manufacturer | NXP Semiconductors | — |
| Series | QorIQ P1 | — |
| Core Processor | PowerPC e500v2 | — |
| Number of Cores | 1 | 1 |
| Core Architecture | 32-bit | 32-Bit Power Architecture |
| Speed | 800 MHz | — |
| Co-processors / DSP | QUICC Engine (QE) | — |
| Connectivity | Ethernet, PCIe, USB, TDM, UART, I2C, SPI | — |
| Ethernet | GbE (10/100/1000 Mbps) | Integrated GbE (multiple MACs) |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| USB | USB 2.0 (dual port) | USB 2.0 (host + device) |
| PCIe | PCIe Gen1 (x1/x2) | — |
| Process Technology | 45 nm | 45 nm CMOS |
| Packhaging / Kaso | 689-TEPBGA II (31x31 mm) with exposed thermal pad | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 C to 125 C | — |
| Packaging | Tray | Tray |
| Lead Free Status | Lead Free | Lead Free |
| Tindminan RoHS | RoHS Compliant | RoHS Compliant |
| Die Revision | 1.1 | — |
| Security | Hardware-accelerated cryptography | — |
| Processor Series | — | QorIQ P1 |
| Processor Core | — | PowerPC e500v2 |
| Maximum Core Frequency | — | 800 MHz |
| PCIe Controllers | — | PCIe Gen 2 (x1/x2/x4) |
| TDM Interfaces | — | 4 (T1/E1) |
| QUICC Engine (QE) | — | Yes (protocol offload) |
| SEC Security Accelerator | — | SEC 4.0 |
| Packhaging | — | 689-TEPBGA II (31x31 mm) with exposed thermal pad |
| Operating Temperature (Tj) | — | 0C to +125C |