P1012NSN2HFB vs P1012NSE2HFB 比較
詳細並排比較 P1012NSN2HFB 由 NXP Semiconductors 與 P1012NSE2HFB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
P1012NSN2HFB - QorIQ P1012 800MHz e500v2 MPU | NXP | Networking
P1012NSN2HFB ⚠ 最後購買機會規格比較
| 參數 | P1012NSN2HFB | P1012NSE2HFB |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 最後購買 | 最後購買 |
| Manufacturer | NXP Semiconductors | — |
| Series | QorIQ P1 | — |
| Core Processor | PowerPC e500v2 | — |
| Number of Cores | 1 | 1 |
| Core Architecture | 32-bit | 32-Bit Power Architecture |
| Speed | 800 MHz | — |
| Co-processors / DSP | QUICC Engine (QE) | — |
| Connectivity | Ethernet, PCIe, USB, TDM, UART, I2C, SPI | — |
| Ethernet | GbE (10/100/1000 Mbps) | Integrated GbE (multiple MACs) |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| USB | USB 2.0 (dual port) | USB 2.0 (host + device) |
| PCIe | PCIe Gen1 (x1/x2) | — |
| Process Technology | 45 nm | 45 nm CMOS |
| 封裝 / 外殼 | 689-TEPBGA II (31x31 mm) with exposed thermal pad | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | 0 C to 125 C | — |
| Packaging | Tray | Tray |
| Lead Free Status | Lead Free | Lead Free |
| RoHS 狀態 | RoHS Compliant | RoHS Compliant |
| Die Revision | 1.1 | — |
| Security | Hardware-accelerated cryptography | — |
| Processor Series | — | QorIQ P1 |
| Processor Core | — | PowerPC e500v2 |
| Maximum Core Frequency | — | 800 MHz |
| PCIe Controllers | — | PCIe Gen 2 (x1/x2/x4) |
| TDM Interfaces | — | 4 (T1/E1) |
| QUICC Engine (QE) | — | Yes (protocol offload) |
| SEC Security Accelerator | — | SEC 4.0 |
| 封裝 | — | 689-TEPBGA II (31x31 mm) with exposed thermal pad |
| Operating Temperature (Tj) | — | 0C to +125C |