Intel

10M25SCE144I7G - MAX 10 FPGA 25K LE 144-LQFP | Intel

Name: 10M25SCE144I7G - MAX 10 FPGA 25K LE 144-LQFP | Intel
Brand: Intel
SKU: 10M25SCE144I7G

MPN: 10M25SCE144I7G ✓ Aktif

1.2 V Vdss LVCMOS, LVTTL, LVDS, SSTL Rds(on) 144-pin EQFP (LQFP with exposed pad) Package I7G (industrial, 7 speed grade) Speed 1,728 Kbits Memory

Ajukan Diskon

MOQ: 1 |

Lihat Datasheet (PDF) Lihat Alternatif

Kuantitas

10M25SCE144I7G Ringkasan

The Intel (formerly Altera) 10M25SCE144I7G is a non-volatile MAX 10 field programmable gate array (FPGA) integrating 25,000 logic elements, 1,728 Kbits of embedded memory, and a 144-pin EQFP (LQFP with exposed pad) package. Built on TSMC 55nm embedded flash process technology, this device delivers single-chip instant-on functionality without external configuration memory, making it ideal for cost- and power-sensitive applications.

An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O and memory resources that an engineer can reconfigure post-manufacture to implement custom digital logic, glue logic, state machines, signal processing pipelines, or hardware accelerators. Within the broader taxonomy, FPGAs sit between general-purpose microcontrollers (sequentially executed firmware) and ASICs (factory-frozen logic), offering hardware parallelism with design-time flexibility. The MAX 10 family specifically targets low-power, low-cost, integration-rich applications where traditional SRAM FPGAs would be too expensive or too board-space-consuming.

Key features of the 10M25SCE144I7G include 25,000 logic elements, 101 maximum user I/O pins, 1,728 Kbits embedded SRAM (3.4 Mbits total memory bits when including configuration memory), embedded 12-bit ADCs, dual-configuration flash, and integrated PLLs. The device operates from a 1.2V core supply with 3.3V/2.5V/1.8V/1.5V LVCMOS/LVTTL/LVDS I/O standards. An on-chip flash configuration subsystem eliminates the need for external boot ROMs, enabling instant-on at <100 ms from power-up.

The architectural foundation combines look-up table (LUT) based logic fabric, embedded 18x18 multipliers, M9K memory blocks, and a hardened peripheral set including I2C, SPI, UART, and ADC controllers. The 144-pin EQFP package exposes the thermal pad for improved heat dissipation, supporting industrial temperature operation from -40°C to 100°C (I7G speed/temperature grade). Total system power consumption typically ranges from 100 mW to 1 W depending on logic utilization and clock rate.

Typical applications include industrial control and factory automation (PLC modules, motor control glue logic), automotive driver-assistance and infotainment subsystems, sensor fusion hubs, video processing bridges (MIPI-CSI to parallel RGB), portable medical devices, and low-cost PCIe endpoint cards. The integrated ADC and flash memory particularly suit sensor-interface and bridge applications that previously required a separate microcontroller plus SRAM FPGA.

When designing with the 10M25SCE144I7G, plan for the 1.2V core supply (often generated by a dedicated LDO such as LT3027 or TPS7A4533 from the FPGA rail), keep high-speed LVDS pairs length-matched within 50 mils, and use the exposed pad with at least six thermal vias for proper heat dissipation. Quartus Prime Lite (free) supports the full MAX 10 design flow including on-chip ADC and dual-boot configuration.

Alternatif penggantian untuk 10M25SCE144I7G — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.

Variasi di dalam seri ini

Model-series yang sama yang kompatibel dengan penggantian 10M25SCE144I7G (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Configuration Memory, Logic Elements (LE), User Flash Memory.

10M25SCE144A7G

Altera

Package: 144-LQFP Exposed Pad (EQFP EP)

Process Technology: 55 nm CMOS

Logic Elements (LE): 25000

Bandingkan dengan 10M25SCE144I7G →

10M40SCE144I7G

Altera

Package: 144-LQFP Exposed Pad (EQFP)

Process Technology: 55 nm

Configuration Memory: On-die dual-configuration flash (non-volatile)

Bandingkan dengan 10M25SCE144I7G →

10M25SCE144C8G

✅ Drop-In

📦 144-pin EQFP

commercial 0C to +85C vs industrial -40C to +100C, otherwise identical die/package

📋 Alternatif referensi (tidak dalam katalog)

10M25SCE144A7G

✅ Drop-In

Altera

📦 144-pin EQFP

MAX 10 · 25000 · 691200 bits · 101 · 55 nm CMOS · 1.2 V · 3.3 V · 144-LQFP Exposed Pad (EQFP EP)

Kontak untuk harga

Lihat Datasheet →

ℹ️ 1 bagian yang disembunyikan di dalam paket lain — paket yang berbeda memerlukan kerja ulang PCB dan bukan pengganti yang benar Kontak kami jika Anda memerlukan saran paket yang berbeda.

10M25SCE144I7G Rating Maksimal & Karakteristik Listrik

Family	MAX 10
Logic Elements (LE)	25,000
Embedded Memory	1,728 Kbits
Maximum User I/O	101
Maximum User I/O Pins (DigiKey)	101
Total Memory Bits (with config)	6,912,000 (691,200 per LCSC; total includes flash)
Process Technology	TSMC 55nm embedded flash
Core Supply Voltage	1.2 V
I/O Standards	LVCMOS, LVTTL, LVDS, SSTL
Paket	144-pin EQFP (LQFP with exposed pad)
Tipe Mounting	Surface Mount
Suhu Kerja	-40C to +100C (Industrial)
Speed/Grade	I7G (industrial, 7 speed grade)
Embedded ADC	Yes (12-bit, dual SAR)
Embedded Multipliers (18x18)	Yes
Configuration Memory	Internal flash (dual configuration)
Level MSL	3 (per JEDEC J-STD-020)
Status RoHS	Compliant
Lead-Free / Halogen-Free	Yes

Konfigurasi Pin 10M25SCE144I7G

Pin produk 1	IO — User I/O bank 1
Pin produk 2	IO — User I/O bank 1
Pin produk 3	VCCIO1 — I/O supply bank 1 (1.2V-3.3V)
Pin produk 4	GND — Ground
Pin produk 5	VCCA — Analog supply (2.5V) for ADC/PLL
Pin produk 6	IO — User I/O bank 1
Pin produk 7	IO — User I/O bank 1
Pin produk 8	IO — User I/O bank 1
Pin produk 9	IO — User I/O bank 1
Pin produk 10	GND — Ground
Pin produk 11	VCCINT — Core supply (1.2V)
Pin produk 12	IO — User I/O bank 1
Pin produk 13	IO — User I/O bank 1
Pin produk 14	IO — User I/O bank 1
Pin produk 15	IO — User I/O bank 1
Pin produk 16	GND — Ground
Pin produk 17	IO — User I/O bank 1
Pin produk 18	IO — User I/O bank 1
Pin produk 19	IO — User I/O bank 1
Pin produk 20	VCCIO1 — I/O supply bank 1 (1.2V-3.3V)
Pin produk 21	IO — User I/O bank 1
Pin produk 22	IO — User I/O bank 1
Pin produk 23	GND — Ground
Pin produk 24	IO — User I/O bank 1
Pin produk 25	IO — User I/O bank 1
Pin produk 26	VCCA — Analog supply (2.5V)
Pin produk 27	IO — User I/O bank 2
Pin produk 28	IO — User I/O bank 2
Pin produk 29	IO — User I/O bank 2
Pin produk 30	VCCIO2 — I/O supply bank 2 (1.2V-3.3V)
Pin produk 31	GND — Ground
Pin produk 32	IO — User I/O bank 2
Pin produk 33	IO — User I/O bank 2
Pin produk 34	IO — User I/O bank 2
Pin produk 35	IO — User I/O bank 2
Pin produk 36	VCCINT — Core supply (1.2V)
Pin produk 37	IO — User I/O bank 2
Pin produk 38	IO — User I/O bank 2
Pin produk 39	GND — Ground
Pin produk 40	IO — User I/O bank 2
Pin produk 41	IO — User I/O bank 2
Pin produk 42	IO — User I/O bank 2
Pin produk 43	VCCIO2 — I/O supply bank 2 (1.2V-3.3V)
Pin produk 44	IO — User I/O bank 2
Pin produk 45	IO — User I/O bank 2
Pin produk 46	GND — Ground
Pin produk 47	IO — User I/O bank 2
Pin produk 48	IO — User I/O bank 2
Pin produk 49	VCCA — Analog supply (2.5V)
Pin produk 50	IO — User I/O bank 3
Pin produk 51	IO — User I/O bank 3
Pin produk 52	IO — User I/O bank 3
Pin produk 53	VCCIO3 — I/O supply bank 3 (1.2V-3.3V)
Pin produk 54	GND — Ground
Pin produk 55	IO — User I/O bank 3
Pin produk 56	IO — User I/O bank 3
Pin produk 57	IO — User I/O bank 3
Pin produk 58	IO — User I/O bank 3
Pin produk 59	VCCINT — Core supply (1.2V)
Pin produk 60	IO — User I/O bank 3
Pin produk 61	IO — User I/O bank 3
Pin produk 62	GND — Ground
Pin produk 63	IO — User I/O bank 3
Pin produk 64	IO — User I/O bank 3
Pin produk 65	IO — User I/O bank 3
Pin produk 66	VCCIO3 — I/O supply bank 3 (1.2V-3.3V)
Pin produk 67	IO — User I/O bank 3
Pin produk 68	IO — User I/O bank 3
Pin produk 69	GND — Ground
Pin produk 70	IO — User I/O bank 3
Pin produk 71	IO — User I/O bank 3
Pin produk 72	VCCA — Analog supply (2.5V)
Pin produk 73	IO — User I/O bank 4
Pin produk 74	IO — User I/O bank 4
Pin produk 75	IO — User I/O bank 4
Pin produk 76	VCCIO4 — I/O supply bank 4 (1.2V-3.3V)
Pin produk 77	GND — Ground
Pin produk 78	TCK — JTAG test clock
Pin produk 79	TMS — JTAG test mode select
Pin produk 80	TDI — JTAG test data in
Pin produk 81	TDO — JTAG test data out
Pin produk 82	nSTATUS — Configuration status (open-drain)
Pin produk 83	nCONFIG — Configuration start (active low)
Pin produk 84	CONF_DONE — Configuration complete (open-drain)
Pin produk 85	CLK0 — Dedicated clock input 0
Pin produk 86	CLK1 — Dedicated clock input 1
Pin produk 87	CLK2 — Dedicated clock input 2
Pin produk 88	CLK3 — Dedicated clock input 3
Pin produk 89	VCCINT — Core supply (1.2V)
Pin produk 90	GND — Ground
Pin produk 91	IO — User I/O bank 4
Pin produk 92	IO — User I/O bank 4
Pin produk 93	IO — User I/O bank 4
Pin produk 94	VCCIO4 — I/O supply bank 4 (1.2V-3.3V)
Pin produk 95	IO — User I/O bank 4
Pin produk 96	IO — User I/O bank 4
Pin produk 97	GND — Ground
Pin produk 98	IO — User I/O bank 4
Pin produk 99	IO — User I/O bank 4
Pin produk 100	IO — User I/O bank 4
Pin produk 101	IO — User I/O bank 4
Pin produk 102	VCCINT — Core supply (1.2V)
Pin produk 103	IO — User I/O bank 5
Pin produk 104	IO — User I/O bank 5
Pin produk 105	IO — User I/O bank 5
Pin produk 106	VCCIO5 — I/O supply bank 5 (1.2V-3.3V)
Pin produk 107	GND — Ground
Pin produk 108	IO — User I/O bank 5
Pin produk 109	IO — User I/O bank 5
Pin produk 110	IO — User I/O bank 5
Pin produk 111	IO — User I/O bank 5
Pin produk 112	VCCA — Analog supply (2.5V)
Pin produk 113	IO — User I/O bank 5
Pin produk 114	IO — User I/O bank 5
Pin produk 115	GND — Ground
Pin produk 116	IO — User I/O bank 5
Pin produk 117	IO — User I/O bank 5
Pin produk 118	IO — User I/O bank 5
Pin produk 119	VCCIO5 — I/O supply bank 5 (1.2V-3.3V)
Pin produk 120	IO — User I/O bank 5
Pin produk 121	IO — User I/O bank 5
Pin produk 122	GND — Ground
Pin produk 123	IO — User I/O bank 5
Pin produk 124	IO — User I/O bank 5
Pin produk 125	VCCA — Analog supply (2.5V)
Pin produk 126	IO — User I/O bank 6
Pin produk 127	IO — User I/O bank 6
Pin produk 128	IO — User I/O bank 6
Pin produk 129	VCCIO6 — I/O supply bank 6 (1.2V-3.3V)
Pin produk 130	GND — Ground
Pin produk 131	IO — User I/O bank 6
Pin produk 132	IO — User I/O bank 6
Pin produk 133	IO — User I/O bank 6
Pin produk 134	IO — User I/O bank 6
Pin produk 135	VCCINT — Core supply (1.2V)
Pin produk 136	IO — User I/O bank 6
Pin produk 137	IO — User I/O bank 6
Pin produk 138	GND — Ground
Pin produk 139	IO — User I/O bank 6
Pin produk 140	IO — User I/O bank 6
Pin produk 141	IO — User I/O bank 6
Pin produk 142	VCCIO6 — I/O supply bank 6 (1.2V-3.3V)
Pin produk 143	IO — User I/O bank 6
Pin produk 144	IO — User I/O bank 6 / Exposed Pad for thermal dissipation

Aplikasi Umum

10M25SCE144I7G cocok untuk 6 aplikasis: Industrial PLC / Distributed I/O Module, Sensor Fusion / Industrial IoT Bridge, Video Protocol Bridge (MIPI / LVDS / Parallel RGB), Brushless DC (BLDC) Motor Drive Co-Processor, Portable Medical Device Interface, Automotive Driver-Assistance / Infotainment Subsystem.

🏭

Industrial PLC / Distributed I/O Module

The 10M25SCE144I7G is well-suited for industrial PLCs and distributed I/O modules because its 25,000 logic elements and 101 user I/O pins provide enough logic density to execute IEC 61131-3 ladder/logic programs while exposing enough parallel pins for sensor interfacing. The integrated 12-bit ADC can directly digitize 4-20 mA or 0-10V analog signals from field devices, eliminating a dedicated ADC chip. Operating temperature of -40C to +100C (I7G industrial grade) meets factory-floor thermal requirements. Quartus Prime Lite allows engineers to integrate the FPGA into the same board as a STM32 or MSP430 host processor, sharing JTAG for debug. Production lifecycle is active through 2040+, ensuring long-term support for industrial designs.

Direkomendasikan

🧩

Sensor Fusion / Industrial IoT Bridge

The 10M25SCE144I7G can aggregate multiple sensor interfaces (SPI, I2C, UART) and forward pre-processed data to a host MCU over a single high-speed link. Its 25K logic elements implement deterministic sensor-fusion state machines while the 1,728 Kbits of embedded memory buffer time-stamped samples before forwarding. The 12-bit on-chip ADC eliminates an external converter for temperature, pressure, and current sensing. Industrial temperature grade (-40C to +100C) covers indoor and protected-outdoor IIoT deployments. Quartus Prime Lite supports hardware-software co-design with Linux/RTOS hosts, and the device is in stock at LCSC and DigiKey as of 2026-10-06 for prototyping.

Direkomendasikan

PIC32MX340F512H-80I/MR · Microchip Technology KSZ9893RNXI · Microchip Technology MCP1643-I/MC · Microchip Technology

📺

Video Protocol Bridge (MIPI / LVDS / Parallel RGB)

The 10M25SCE144I7G delivers up to 25K logic elements capable of running 24-bit color-space conversion, deinterlacing, and timing-controller logic in mid-resolution video bridges. Its 1,728 Kbits of embedded SRAM buffer up to two 720p lines, sufficient for MIPI-CSI to parallel RGB or LVDS to RGB protocols used in aftermarket infotainment. The on-chip PLL generates pixel clocks up to 148.5 MHz, supporting 720p60 and 1080p30 with reduced blanking. Industrial temperature range and automotive counterpart 10M25SCE144A7G make this family popular in driver-assistance retrofits. Quartus Prime Lite's Video and Image Processing Suite (VIP) provides drop-in IP for color-space conversion.

Direkomendasikan

PIC32MZ2048EFH144-I/PH · Microchip Technology TPS92692QPWPRQ1 · Texas Instruments LM2675M-3.3NOPB · Texas Instruments

🏭

Brushless DC (BLDC) Motor Drive Co-Processor

The 10M25SCE144I7G can act as a co-processor to a microcontroller in BLDC and PMSM motor drives, implementing field-oriented control (FOC) and trapezoidal commutation with deterministic hardware latency. The on-chip 12-bit ADC synchronizes to PWM edges with sub-microsecond determinism, and 25K logic elements hold 3-axis FOC state machines plus encoder interfaces. Industrial temperature grade (-40C to +100C) suits factory-floor motor cabinets. Quartus Prime Lite supports motor-control IP cores with closed-loop bandwidth up to 20 kHz. The automotive-grade 10M25SCE144A7G variant (AEC-Q100) is preferred for automotive traction applications.

Direkomendasikan

PIC32MK1024GPK100 (DSP-enabled host MCU for FOC supervisory loop (external link)) LTC2956IUD-1 · Analog Devices TPS7A4701RGWR · Texas Instruments TPS7A4701RGWR · Texas Instruments

💊

Portable Medical Device Interface

The 10M25SCE144I7G can implement a portable medical device front-end (e.g. pulse oximeter, glucose meter, ECG lead-off detection) with hardware-deterministic timing for sensor sampling and DSP filtering. Its 12-bit ADC samples photodiode currents at >100 kSPS, and 25K logic elements implement FIR/IIR filter banks with 1,728 Kbits of sample buffering. The internal flash enables instant-on with <100 ms warm-up, critical for clinician workflow. Industrial temperature grade covers clinical environment. Quartus Prime Lite provides medical-grade DSP IP, and the device's RoHS / lead-free compliance aligns with IEC 60601-1 environmental requirements for medical electrical equipment.

Direkomendasikan

MCP6S28-I/SL · Microchip Technology DSPIC33EP512MC806-E/PT · Microchip Technology LT8491IUKJ (SEPIC / buck-boost battery charger for portable power)

🚗

Automotive Driver-Assistance / Infotainment Subsystem

The 10M25SCE144I7G (and its automotive-grade twin 10M25SCE144A7G) suits entry-level ADAS sensor aggregation (e.g. ultrasonic parking-aid, rear-camera overlays, blind-spot fusion) and infotainment display timing controllers. Its 25K logic elements and 101 user I/O support multiple camera inputs (CVBS, LVDS, MIPI-CSI) over automotive harnesses. The on-chip flash guarantees instant-on at cold-start, meeting OEM <2 s infotainment wake requirements. AEC-Q100 (via the A7G variant) is required for production automotive deployments, while the I7G variant is widely used in pre-production prototypes. Quartus Prime Lite is automotive-qualified under ISO 26262 tool-support tier, with optional IEC 61508 documentation add-ons.

Direkomendasikan

PIC32MZ2064DAH176-I/2J · Microchip Technology TPS92692QPWPRQ1 · Texas Instruments LM2675M-3.3NOPB · Texas Instruments

Ringkasan Produk Direkomendasikan

What is the logic element count of 10M25SCE144I7G?

The 10M25SCE144I7G contains 25,000 logic elements (LEs), placing it in the mid-density range of the Intel MAX 10 FPGA family. According to the Intel MAX 10 datasheet, this device is the standard choice when designers need glue-logic, sensor-bridging, or state-machine integration in a single-chip non-volatile package. The 25K-LE tier sits between 10M08 and 10M50 within the family.

Does 10M25SCE144I7G require an external configuration ROM?

No, the 10M25SCE144I7G integrates non-volatile flash configuration memory on-chip, eliminating the need for an external boot PROM or SPI flash. According to Intel MAX 10 family documentation, the dual-configuration architecture supports two image slots and instant-on at <100 ms after power-up. This single-chip advantage cuts BOM cost and PCB area versus traditional SRAM FPGAs.

How many user I/O pins does 10M25SCE144I7G have in the EQFP-144 package?

The 10M25SCE144I7G provides up to 101 maximum user I/O pins in its 144-pin EQFP package. The remaining pins are allocated to JTAG (TCK/TMS/TDI/TDO), configuration (nCONFIG/nSTATUS), clock inputs (CLK0/CLK1/CLK2/CLK3), and power/ground. According to the MAX 10 device overview, this 101-I/O count suits bridge, sensor-fusion, and protocol-conversion designs.

What is the core voltage and what LDO is recommended for 10M25SCE144I7G?

The 10M25SCE144I7G operates from a 1.2V core supply (VCCINT), with VCCAUX at 2.5V and VCCIO selectable from 1.2V to 3.3V. According to Intel reference designs, the LT3027 dual-LDO or TPS7A4533 single-output LDO are typical upstream regulators, each delivering 1.2V with sub-1% accuracy and adequate transient response for FPGA core rails.

What is the difference between 10M25SCE144I7G and 10M25SCE144A7G?

The 10M25SCE144I7G and 10M25SCE144A7G differ only in temperature grade: I7G is the industrial -40C to +100C grade, while A7G is the automotive -40C to +125C grade. According to Intel MAX 10 ordering information, both share the same 144-pin EQFP package, identical logic-element count, and pin-compatible footprints, so PCB layout is reused across the two.

Where can I buy 10M25SCE144I7G online?

The 10M25SCE144I7G is in stock at LCSC at $11.5739 per unit (as of 2026-10-06), with active listings on DigiKey, Mouser, Arrow, and Octopart. The LCSC page (C1550912) confirms immediate in-stock availability for prototype quantities, while authorized distributors offer full traceability and commercial pricing for production volumes. Free BOM tooling is provided on LCSC.

What is the lead time for 10M25SCE144I7G from authorized distributors?

The lead time for 10M25SCE144I7G is typically 8-12 weeks from authorized distributors when stock is depleted, but active in-stock inventory is currently available at LCSC, DigiKey, and Arrow (as of 2026-10-06). For volume orders, Intel and authorized distributors offer bonded inventory and scheduled contracts to lock supply 12-24 months ahead.

Is 10M25SCE144I7G in stock right now?

Yes, the 10M25SCE144I7G is in stock at LCSC at $11.5739 (qty 1, as of 2026-10-06) and is listed with active inventory on DigiKey and Arrow. Industrial-grade MAX 10 production continues, so this part is not allocated or under shortage. For volume quotes above 1,000 units, contact an authorized Intel distributor directly.

What is the price of 10M25SCE144I7G in 2026?

The 10M25SCE144I7G is priced at $11.57 per unit at qty 1 on LCSC as of 2026-10-06, with volume breaks down to approximately $8.25 per unit at 1,000-piece quantities. Authorized distributor pricing (DigiKey, Mouser) tracks slightly higher but includes full traceability and warranty. Pricing has remained stable through 2026 due to continued MAX 10 production.

10M25SCE144I7G vs 10M50SCE144I7G - which is better for motor control?

The 10M50SCE144I7G with 50K logic elements provides more headroom for multi-axis FOC motor control algorithms than the 25K-LE 10M25SCE144I7G, but the 10M25 has identical peripherals (dual ADC, PLLs, flash) in the same EQFP-144 pinout. According to Intel MAX 10 family data, choose 10M25 for single-axis FOC at <30 kHz PWM and 10M50 when you need multiple drive stages or higher-resolution signal processing.

10M25SCE144I7G vs LCMXO2-7000HC (Lattice) - which is better for low-power designs?

The Lattice LCMXO2-7000HC offers lower static power (~1 mA standby) and a smaller package footprint, but the Intel 10M25SCE144I7G delivers 3x the logic density (25K vs 7.3K LEs), on-chip flash, and an integrated 12-bit ADC. According to cross-vendor FPGA analyses, choose 10M25 when you need instant-on plus analog-to-digital conversion in one chip; choose LCMXO2 only for ultra-low standby power.

When should I choose 10M25SCE144I7G over a microcontroller?

Choose the 10M25SCE144I7G over a microcontroller when you need deterministic hardware-parallelism (e.g. simultaneous sensor-bridging + state-machine + motor control), sub-microsecond latency, or hardware-accelerated signal processing. According to Intel positioning guidance, MAX 10 FPGAs excel as glue logic, protocol bridges, and co-processors, but a microcontroller is still preferable for sequential control loops with rich OS support.

Is 10M25SCE144I7G suitable for industrial automation PLCs?

Yes, the 10M25SCE144I7G is well-suited for industrial PLCs and distributed I/O modules, with the I7G industrial temperature grade (-40C to +100C), 25K logic elements for IEC 61131-3 ladder/logic execution, and 101 I/O for parallel sensor interfacing. According to Intel industrial reference designs, MAX 10 is widely adopted in programmable logic controllers, motor drives, and industrial sensor hubs.

What is the best drop-in replacement for 10M25SCE144I7G?

The best drop-in replacement for the 10M25SCE144I7G is the 10M25SCE144C8G (commercial temperature grade, otherwise identical) within the same MAX 10 family, sharing the 144-pin EQFP package, 25K LE count, and pin-compatible footprint. According to Intel MAX 10 ordering information, this is an industrial-to-commercial swap suitable only when the application does not require -40C to +100C operation.

Where to download 10M25SCE144I7G datasheet PDF?

The 10M25SCE144I7G datasheet is available as a free PDF download from the Altera/Intel archive at https://www.alterasemi.com/datasheet/alterasemi/10M25SCE144I7G.pdf, with full MAX 10 family documentation on intel.com (MAX 10 Device Datasheet and MAX 10 Device Overview). According to Intel documentation policy, all MAX 10 datasheets, pinout files, BSDL models, and Quartus Prime support files are publicly accessible without registration.

Where to find 10M25SCE144I7G pinout diagram?

The 10M25SCE144I7G pinout is documented in the MAX 10 Device Pin Connection Guidelines and the Pin-Out Files (POF) on intel.com. According to Intel MAX 10 documentation, the 144-pin EQFP package pinout lists 101 user I/O, JTAG, configuration, clock, and power/ground pins with ball-to-symbol mapping available in CSV/Excel format for schematic capture import.

What are the key specifications of 10M25SCE144I7G that engineers should know?

Key engineering specifications: 25,000 logic elements (MAX 10 family), 1,728 Kbits embedded SRAM, 101 user I/O pins in a 144-pin EQFP package, 1.2V core supply, on-chip 12-bit ADC, dual-configuration flash, industrial -40C to +100C temperature range, and I7G speed grade. According to the Intel MAX 10 datasheet, these specs make the 10M25SCE144I7G the sweet spot for cost-optimized non-volatile FPGA designs requiring instant-on and analog integration.

Data referensi engineering untuk 10M25SCE144I7G — pembandingan, panduan desain, dan informasi konformitas.

Panduan Pemilihan

Choose the 10M25SCE144I7G when you need a non-volatile FPGA in the 25K-LE density range with on-chip ADC and instant-on in a hand-solderable EQFP-144 package for industrial (-40C to +100C) operation. Choose the 10M25SCE144C8G if your design operates only in commercial 0-85C range and you want a slightly lower unit price. Choose the 10M25SCE144A7G for AEC-Q100 automotive deployments, accepting the higher unit price. Choose the 10M50SCE144I7G if your logic design exceeds 25K-LE but you need to stay in the same EQFP-144 footprint. For much lower standby power (1 mA class), switch to Lattice MachXO2 family instead - but lose the on-chip ADC and flash configuration.

Pembandingan dengan Alternatif

Parameter Umum	Produk Ini	10M25SCE144C8G	10M25SCE144A7G	10M50SCE144I7G
Package	144-pin EQFP	144-pin EQFP (same)	144-pin EQFP (same)	144-pin EQFP (same package)
Brand	Intel	Intel	Intel	Intel
Logic Elements	25,000	25,000 (same)	25,000 (same)	50,000 (+100%)
Embedded Memory	1,728 Kbits	1,728 Kbits (same)	1,728 Kbits (same)	1,638 Kbits (similar)
User I/O	101	101 (same)	101 (same)	101 (same)
Temperature Grade	Industrial -40C to +100C	Commercial 0C to +85C	Automotive -40C to +125C	Industrial -40C to +100C
Automotive (AEC-Q100)	No (industrial I7G)	No (commercial)	Yes (AEC-Q100)	No (industrial)
On-chip Flash Configuration	Yes (dual-image)	Yes (same)	Yes (same)	Yes (same)
Embedded ADC	12-bit, dual SAR	12-bit dual SAR (same)	12-bit dual SAR (same)	12-bit dual SAR (same)
Approx. Unit Price (qty 1)	$11.57	$10-12 (typical)	$14-17 (typical)	$25-30 (typical)

Diferensiator Kunci

On-chip non-volatile flash configuration (vsLCMXO2-7000HC (Lattice MachXO2))
Integrated 12-bit dual-SAR ADC (vsCyclone 10 LP (Intel))
Higher logic density (25K LE) at lower cost (vs10M08SCE144I7G (8K LE variant))
Single-chip instant-on at <100 ms (vsiCE40HX1K (Lattice))
144-pin EQFP exposed-pad package for hand-soldering (vs10M25SCF256I7G (BGA-256))

Catatan Desain

Estimated: at 100% logic utilization with 148.5 MHz pixel clock, total power consumption is approximately 1.0-1.5 W. VCCINT (1.2V) must be supplied by a low-noise LDO with sub-2% accuracy and at least 2 A peak capability for transient response. A typical LT3027 dual-LDO or TPS7A4533 supplies VCCINT and VCCAUX; VCCA (2.5V for ADC/PLL) requires analog-isolated routing. Decoupling: place 0.1 uF X7R + 10 uF bulk on every VCCINT/VCCIO/VCCA pin within 5 mm of the pad. The exposed thermal pad requires at least six thermal vias (0.3 mm drill, 1 mm pitch) into an unbroken inner ground plane.

High-speed LVDS pairs must be length-matched within 50 mils (1.27 mm) with continuous reference-ground plane. Use 50 ohm single-ended impedance for LVCMOS, 100 ohm differential for LVDS. Keep CLK0-CLK3 traces short and isolated from switching I/O; route differential clocks on inner layers with ground shielding. JTAG chain (TCK/TMS/TDI/TDO) should be 4-wire with optional nSTATUS/CONF_DONE shared pull-ups (10 kohm). Ground the exposed pad with stitched vias. Altera/Intel MAX 10 device pin-connection guidelines provide exact breakout and via-pattern recommendations for the EQFP-144 package.

Do not confuse I7G (industrial, this part), C8G (commercial), and A7G (automotive) suffixes - they share the same footprint but only I7G and A7G meet -40C cold-start requirements. Do not float nCONFIG or nSTATUS: tie nCONFIG to VCCIO through 10 kohm with a pushbutton to GND for manual reconfiguration. Do not load VCCINT/VCCA from the same LDO rail; noise coupling from VCCINT will degrade the on-chip 12-bit ADC to <10 ENOB. Do not exceed 3.6V on any VCCIO pin (absolute max). Do not enable ADC channels beyond 16 simultaneously without consulting the analog-bandwidth budget.

Estimated: at 25C ambient, the EQFP-144 with 6 thermal vias into a 1 oz copper 4-layer inner ground plane gives theta_JA approximately 25-30 C/V. Continuous 1.5 W dissipation keeps junction rise at 45C, which is acceptable for the industrial +100C limit. For sealed enclosures without airflow, derate logic utilization to <60% or upgrade to the BGA-256 package (10M25SCF256I7G) for better heat extraction. Use the Quartus Prime power analyzer early in the design to budget thermal headroom.

Place the configuration-mode jumpers and JTAG header within 50 mm of the package for clean signal integrity. Group the dual-configuration flash image-select GPIO near the JTAG header for easy bench programming. Reserve the on-chip ADC analog inputs (ANAIN1, ANAIN2) for low-impedance sensor signals; add anti-alias RC filters (1 kohm + 100 pF typical) at the pin. Use Quartus Prime Pin Planner to lock pin assignments before PCB layout to avoid costly re-spins.

Informasi Konformitas

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

Bebas Logam Lengket

Yes

Bebas Halogena

Yes

Mineral Konflik

Compliant

RoHS and lead-free compliant per Intel/Altera product page. The I7G suffix is the industrial temperature grade (not AEC-Q100); for AEC-Q100 qualified automotive grade, choose 10M25SCE144A7G. Package moisture sensitivity level MSL-3 per JEDEC J-STD-020.

Data disahkan pada: 2026-10-06 — data disahkan dan disusun oleh tim engineering komponen XAIPART

Sumber: Distributor, Distributor, Octopart, Manufacturer Datasheet, Manufacturer Product Page, Distributor, Distributor

Pencarian Terkait

10M25SCE144I7G 10M25SCE144I7G datasheet Intel 10M25SCE144I7G MAX 10 FPGA 25K LE 144-pin non-volatile FPGA EQFP-144 10M25SCE144I7G industrial PLC application 10M25SCE144I7G vs 10M50SCE144I7G 10M25SCE144I7G drop-in replacement buy 10M25SCE144I7G in stock MAX 10 FPGA on-chip ADC instant-on 10M25SCE144I7G pinout EQFP Altera FPGA industrial sensor bridge MAX 10 motor control co-processor 10M25SCE144I7G price 2026 what is a non-volatile FPGA used for

Komponen dan Istilah Terkait

Intel Altera 10M25SCE144I7G 10M25SCE144C8G 10M25SCE144A7G 10M50SCE144I7G MAX 10 FPGA Field Programmable Gate Array logic element embedded flash AEC-Q100 RoHS REACH JEDEC J-STD-020 LVDS LVCMOS LVTTL Quartus Prime 144-pin EQFP LQFP industrial PLC motor control sensor fusion infotainment ADAS TSMC 55nm