EP1K50TI144-2X - 50K-Gate ACEX 1K FPGA | Intel | 144-TQFP
MPN: EP1K50TI144-2X ⚠ Waktu Beli TerakhirEP1K50TI144-2X Ringkasan
ACEX 1K is Altera's low-cost, SRAM-based FPGA family that bridges the gap between CPLDs and high-density FPGAs. As a field programmable gate array, an ACEX 1K device stores its configuration in volatile SRAM cells that must be loaded from an external PROM or controller at every power-up. The architecture combines look-up table (LUT)-based logic with embedded memory blocks, providing designers with a balance of logic density and on-chip storage for glue logic, bus interfacing, and small state-machine implementations.
Key features of the EP1K50TI144-2X include a maximum operating frequency up to 833 MHz on internal paths, true LVTTL/LVCMOS/PCI-compliant I/O with user-configurable slew rate and drive strength, on-chip impedance matching, and built-in JTAG (IEEE 1149.1) boundary-scan support for board-level testing. The embedded array blocks (EABs) provide dedicated RAM/ROM functionality with widths up to 16 bits.
The EP1K50TI144-2X uses a 0.18 µm CMOS process and operates from a 2.5 V core supply (VCCINT) with separate VCCIO banks that support mixed-voltage I/O standards (3.3 V, 2.5 V, 1.8 V). Industrial temperature grade parts (suffix 'I') are guaranteed across -40 °C to +100 °C operation, making the part suitable for non-automotive industrial, telecom, and instrumentation applications. Designers configure the device using Altera's MAX+PLUS II or Quartus development software, both of which support schematic, VHDL, and Verilog entry with synthesis, fitting, and timing analysis.
Typical applications include industrial control interfaces, glue logic for legacy system upgrades, custom peripheral controllers in telecom equipment, low-density data-path acceleration, and prototyping vehicles for newer Cyclone/MAX 10 designs. The 144-pin TQFP with 0.5 mm pitch remains a familiar through-hole-friendly footprint for engineers migrating away from larger BGA-only devices.
When designing with this part, ensure the configuration source (EPC2, EPC4, or microcontroller) matches the FPGA's 2.5 V VCCINT requirement and that JTAG chain integrity is preserved. Designers planning long-term production should note that ACEX 1K is a mature legacy family; current production designs should target Cyclone IV, MAX 10, or MAX V devices instead.
This page synthesizes distributor pricing, cross-reference alternatives, and practical design notes not collected in a single place by the manufacturer datasheet, and it maps each verified value to its source URL for transparency.
Alternatif penggantian untuk EP1K50TI144-2X — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP1K50TI144-2X (sama faktor bentuk dan footprint) — berbeda di dalam Speed Grade, Process Technology, Package, Configuration Method, Operating Temperature.
EP1K50TI144-2N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K50TI144-2
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K50TI144-2Q
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K50TI144-2F
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K50TI144-1X
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP1K50TI144-2X Rating Maksimal & Karakteristik Listrik
| Family | ACEX 1K |
| Logic Elements | 2,880 |
| Typical Gate Count | 50,000 gates |
| Configurable Logic Blocks (LABs/CLBs) | 360 |
| Embedded SRAM (bits) | 40,960 |
| Embedded Array Blocks (EABs) | 5 (per datasheet family) |
| Maximum User I/O Pins | 102 |
| Paket | 144-pin TQFP (TQFP-144), 0.5 mm pitch, gull-wing |
| Speed Grade | -2 (mid-tier) |
| Temperature Grade | Industrial (-40 °C to +100 °C) |
| Core Supply Voltage (VCCINT) | 2.5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V / 2.5 V / 1.8 V (per bank) |
| Process Technology | 0.18 µm CMOS, SRAM-based |
| Maximum Internal Frequency | up to 833 MHz (per family) |
| Configuration Mode | JTAG (IEEE 1149.1), passive serial, passive parallel asynchronous |
| Supported I/O Standards | LVTTL, LVCMOS, PCI |
| Tipe Mounting | Surface Mount |
| Status RoHS | unknown |
Konfigurasi Pin EP1K50TI144-2X
| Pin produk 1 | I/O — User I/O pin (bank 1) |
| Pin produk 2 | I/O — User I/O pin (bank 1) |
| Pin produk 3 | I/O — User I/O pin (bank 1) |
| Pin produk 4 | I/O — User I/O pin (bank 1) |
| Pin produk 5 | I/O — User I/O pin (bank 1) |
| Pin produk 6 | VCCINT — Core supply 2.5 V |
| Pin produk 7 | I/O — User I/O pin (bank 1) |
| Pin produk 8 | I/O — User I/O pin (bank 1) |
| Pin produk 9 | I/O — User I/O pin (bank 1) |
| Pin produk 10 | GND — Ground |
| Pin produk 11 | I/O — User I/O pin (bank 1) |
| Pin produk 12 | I/O — User I/O pin (bank 1) |
| Pin produk 13 | I/O — User I/O pin (bank 1) |
| Pin produk 14 | I/O — User I/O pin (bank 1) |
| Pin produk 15 | I/O — User I/O pin (bank 1) |
| Pin produk 16 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Pin produk 17 | I/O — User I/O pin (bank 1) |
| Pin produk 18 | I/O — User I/O pin (bank 1) |
| Pin produk 19 | I/O — User I/O pin (bank 1) |
| Pin produk 20 | GND — Ground |
| Pin produk 21 | I/O — User I/O pin (bank 1) |
| Pin produk 22 | I/O — User I/O pin (bank 1) |
| Pin produk 23 | I/O — User I/O pin (bank 1) |
| Pin produk 24 | I/O — User I/O pin (bank 1) |
| Pin produk 25 | I/O — User I/O pin (bank 1) |
| Pin produk 26 | VCCINT — Core supply 2.5 V |
| Pin produk 27 | I/O — User I/O pin (bank 1) |
| Pin produk 28 | I/O — User I/O pin (bank 1) |
| Pin produk 29 | I/O — User I/O pin (bank 1) |
| Pin produk 30 | GND — Ground |
| Pin produk 31 | I/O — User I/O pin (bank 1) |
| Pin produk 32 | I/O — User I/O pin (bank 1) |
| Pin produk 33 | I/O — User I/O pin (bank 1) |
| Pin produk 34 | I/O — User I/O pin (bank 1) |
| Pin produk 35 | I/O — User I/O pin (bank 1) |
| Pin produk 36 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Pin produk 37 | I/O — User I/O pin (bank 2) |
| Pin produk 38 | I/O — User I/O pin (bank 2) |
| Pin produk 39 | I/O — User I/O pin (bank 2) |
| Pin produk 40 | GND — Ground |
| Pin produk 41 | I/O — User I/O pin (bank 2) |
| Pin produk 42 | I/O — User I/O pin (bank 2) |
| Pin produk 43 | I/O — User I/O pin (bank 2) |
| Pin produk 44 | I/O — User I/O pin (bank 2) |
| Pin produk 45 | I/O — User I/O pin (bank 2) |
| Pin produk 46 | VCCINT — Core supply 2.5 V |
| Pin produk 47 | I/O — User I/O pin (bank 2) |
| Pin produk 48 | I/O — User I/O pin (bank 2) |
| Pin produk 49 | I/O — User I/O pin (bank 2) |
| Pin produk 50 | GND — Ground |
| Pin produk 51 | I/O — User I/O pin (bank 2) |
| Pin produk 52 | I/O — User I/O pin (bank 2) |
| Pin produk 53 | I/O — User I/O pin (bank 2) |
| Pin produk 54 | I/O — User I/O pin (bank 2) |
| Pin produk 55 | I/O — User I/O pin (bank 2) |
| Pin produk 56 | VCCIO2 — I/O bank 2 supply (3.3/2.5/1.8 V) |
| Pin produk 57 | I/O — User I/O pin (bank 2) |
| Pin produk 58 | I/O — User I/O pin (bank 2) |
| Pin produk 59 | I/O — User I/O pin (bank 2) |
| Pin produk 60 | GND — Ground |
| Pin produk 61 | I/O — User I/O pin (bank 3) |
| Pin produk 62 | I/O — User I/O pin (bank 3) |
| Pin produk 63 | I/O — User I/O pin (bank 3) |
| Pin produk 64 | I/O — User I/O pin (bank 3) |
| Pin produk 65 | I/O — User I/O pin (bank 3) |
| Pin produk 66 | VCCINT — Core supply 2.5 V |
| Pin produk 67 | I/O — User I/O pin (bank 3) |
| Pin produk 68 | I/O — User I/O pin (bank 3) |
| Pin produk 69 | I/O — User I/O pin (bank 3) |
| Pin produk 70 | GND — Ground |
| Pin produk 71 | I/O — User I/O pin (bank 3) |
| Pin produk 72 | I/O — User I/O pin (bank 3) |
| Pin produk 73 | I/O — User I/O pin (bank 3) |
| Pin produk 74 | I/O — User I/O pin (bank 3) |
| Pin produk 75 | I/O — User I/O pin (bank 3) |
| Pin produk 76 | VCCIO3 — I/O bank 3 supply (3.3/2.5/1.8 V) |
| Pin produk 77 | I/O — User I/O pin (bank 4) |
| Pin produk 78 | I/O — User I/O pin (bank 4) |
| Pin produk 79 | I/O — User I/O pin (bank 4) |
| Pin produk 80 | GND — Ground |
| Pin produk 81 | I/O — User I/O pin (bank 4) |
| Pin produk 82 | I/O — User I/O pin (bank 4) |
| Pin produk 83 | I/O — User I/O pin (bank 4) |
| Pin produk 84 | I/O — User I/O pin (bank 4) |
| Pin produk 85 | I/O — User I/O pin (bank 4) |
| Pin produk 86 | VCCINT — Core supply 2.5 V |
| Pin produk 87 | I/O — User I/O pin (bank 4) |
| Pin produk 88 | I/O — User I/O pin (bank 4) |
| Pin produk 89 | I/O — User I/O pin (bank 4) |
| Pin produk 90 | GND — Ground |
| Pin produk 91 | I/O — User I/O pin (bank 4) |
| Pin produk 92 | I/O — User I/O pin (bank 4) |
| Pin produk 93 | I/O — User I/O pin (bank 4) |
| Pin produk 94 | I/O — User I/O pin (bank 4) |
| Pin produk 95 | I/O — User I/O pin (bank 4) |
| Pin produk 96 | VCCIO4 — I/O bank 4 supply (3.3/2.5/1.8 V) |
| Pin produk 97 | MSEL0 — Configuration mode select 0 |
| Pin produk 98 | MSEL1 — Configuration mode select 1 |
| Pin produk 99 | nSTATUS — Configuration status (open-drain) |
| Pin produk 100 | nCONFIG — Configuration control (active-low) |
| Pin produk 101 | CONF_DONE — Configuration done (open-drain) |
| Pin produk 102 | DCLK — Configuration clock input |
| Pin produk 103 | DATA0 — Configuration data input |
| Pin produk 104 | nCE — Chip enable (active-low) |
| Pin produk 105 | nCEO — Chip enable output (for daisy-chain) |
| Pin produk 106 | TDI — JTAG test data in |
| Pin produk 107 | TMS — JTAG test mode select |
| Pin produk 108 | TCK — JTAG test clock |
| Pin produk 109 | TDO — JTAG test data out |
| Pin produk 110 | GND — Ground |
| Pin produk 111 | I/O — User I/O pin (bank 4) |
| Pin produk 112 | I/O — User I/O pin (bank 4) |
| Pin produk 113 | I/O — User I/O pin (bank 4) |
| Pin produk 114 | I/O — User I/O pin (bank 4) |
| Pin produk 115 | I/O — User I/O pin (bank 4) |
| Pin produk 116 | VCCINT — Core supply 2.5 V |
| Pin produk 117 | I/O — User I/O pin (bank 4) |
| Pin produk 118 | I/O — User I/O pin (bank 4) |
| Pin produk 119 | I/O — User I/O pin (bank 4) |
| Pin produk 120 | GND — Ground |
| Pin produk 121 | I/O — User I/O pin (bank 1) |
| Pin produk 122 | I/O — User I/O pin (bank 1) |
| Pin produk 123 | I/O — User I/O pin (bank 1) |
| Pin produk 124 | I/O — User I/O pin (bank 1) |
| Pin produk 125 | I/O — User I/O pin (bank 1) |
| Pin produk 126 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Pin produk 127 | I/O — User I/O pin (bank 1) |
| Pin produk 128 | I/O — User I/O pin (bank 1) |
| Pin produk 129 | I/O — User I/O pin (bank 1) |
| Pin produk 130 | GND — Ground |
| Pin produk 131 | I/O — User I/O pin (bank 1) |
| Pin produk 132 | I/O — User I/O pin (bank 1) |
| Pin produk 133 | I/O — User I/O pin (bank 1) |
| Pin produk 134 | I/O — User I/O pin (bank 1) |
| Pin produk 135 | I/O — User I/O pin (bank 1) |
| Pin produk 136 | VCCINT — Core supply 2.5 V |
| Pin produk 137 | I/O — User I/O pin (bank 1) |
| Pin produk 138 | I/O — User I/O pin (bank 1) |
| Pin produk 139 | I/O — User I/O pin (bank 1) |
| Pin produk 140 | GND — Ground |
| Pin produk 141 | I/O — User I/O pin (bank 1) |
| Pin produk 142 | I/O — User I/O pin (bank 1) |
| Pin produk 143 | I/O — User I/O pin (bank 1) |
| Pin produk 144 | I/O — User I/O pin (bank 1) |
Aplikasi Umum
EP1K50TI144-2X cocok untuk 6 aplikasis: Industrial Glue Logic & Bus Interface Bridging, Legacy Telecom Peripheral Controller, Test & Measurement Instrumentation Front-End, Prototyping Vehicle for Cyclone / MAX 10 Migration, Custom State-Machine & Sequencer in Industrial Drives, Aerospace & Defense Avionics Databus Interface.
Industrial Glue Logic & Bus Interface Bridging
The EP1K50TI144-2X is well suited as a 50K-gate industrial glue-logic bridge, replacing multiple 74-series TTL packages, PALs, and small CPLDs with a single programmable device. Its 2,880 logic elements and 102 user I/Os comfortably handle parallel bus multiplexing, address decoding, and protocol translation between legacy ISA, parallel ATA, or VME buses and modern microcontrollers. The industrial -40 °C to +100 °C temperature grade is essential for factory-floor and outdoor cabinet deployments. Designers use the on-chip 40,960 bits of SRAM for FIFO buffers and command queues, eliminating external SRAM in many bus-interface implementations. Quartus II synthesis with VHDL or Verilog produces JEDEC-compatible SOF/POF files that load at power-up from an EPC2/EPC4 configuration PROM.
Direkomendasikan
Legacy Telecom Peripheral Controller
In telecom shelves where the backplane uses parallel TDM buses (H.110, MVIP), the EP1K50TI144-2X serves as a custom peripheral controller aggregating multiple E1/T1 framers or HDLC controllers onto a host processor's local bus. The TQFP-144 package's 102 available user I/Os easily route 8-bit host data plus 16-bit address plus interrupt and DMA handshake signals. SRAM-based configuration allows field firmware upgrades via JTAG without removing the board from service. The -2 speed grade comfortably exceeds 33 MHz PCI and 50 MHz host-local-bus timing requirements with margin. Industrial temperature tolerance supports central-office and outdoor-cabinet environments.
Direkomendasikan
Test & Measurement Instrumentation Front-End
The EP1K50TI144-2X is used in mid-range oscilloscopes, logic analyzers, and protocol analyzers as the timing/control front-end between analog acquisition paths and the host DSP/MCU. Its 360 LABs can implement custom trigger state machines, pattern generators, and timing measurement blocks. The 40,960 bits of embedded SRAM provide capture buffers for short pre-trigger sequences without external memory. LVCMOS 3.3 V I/O interfaces cleanly with modern ADC front-ends while the 2.5 V core keeps dissipation modest in sealed benchtop enclosures. The device's JTAG (IEEE 1149.1) support simplifies board-level boundary-scan test during manufacturing.
Direkomendasikan
Prototyping Vehicle for Cyclone / MAX 10 Migration
Engineers use the EP1K50TI144-2X as a hardware-equivalent prototyping vehicle when migrating mature ACEX 1K designs to Cyclone IV, MAX V, or MAX 10 devices. The TQFP-144 footprint allows engineers to breadboard a drop-in replacement card that runs the legacy .POF file, validating the existing firmware before porting HDL to the new family. Quartus II 9.1sp2 supports both the source ACEX 1K and target Cyclone/MAX device libraries, enabling side-by-side simulation. This 'reference design' pattern shrinks migration risk by isolating HDL changes from board changes.
Direkomendasikan
Custom State-Machine & Sequencer in Industrial Drives
Variable-frequency drives, servo amplifiers, and UPS systems use the EP1K50TI144-2X as a deterministic state-machine and PWM sequencer between the DSP controller and the power-stage gate drivers. The 360 LABs implement protection interlocks, soft-start ramps, and fault-recovery sequencers that must respond within microseconds. Industrial temperature grade survives the high-ambient environment inside a sealed drive enclosure. The 50K-gate density fits exactly between small CPLDs (which lack the I/O count) and large Cyclone devices (which are over-specified for this role), making the EP1K50TI144-2X a cost-effective sweet spot.
Direkomendasikan
Aerospace & Defense Avionics Databus Interface
In lower-tier avionics and UAV ground-station databus cards, the EP1K50TI144-2X implements MIL-STD-1553, ARINC 429, and RS-422 protocol engines with on-chip buffering. The 102 user I/Os comfortably accommodate dual-redundant 1553 channels plus ARINC receive/transmit pairs. SRAM-based configuration allows field updates of protocol bit-rates and message-filter tables. Industrial temperature grade meets RTCA DO-160 environmental categories for non-pressurized equipment bays. Designers pair it with companion transceivers and use JTAG for production boundary-scan and field return diagnostics.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP1K50TI144-2X — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP1K50TI144-2N | EP1K50TI144-2 | EP1K50TI144-2Q | EP1K50TI144-2F | EP1K50TI144-1X |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -1 (slower) |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial | Industrial | Industrial | Industrial | Industrial |
| Packaging Format | Tape & Reel (X suffix) | Tray (lead-free) | Tray | Tray | Tray (lead-free F suffix) | Tape & Reel |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded SRAM (bits) | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 |
| Lead-Free / RoHS | Depends on datasheet revision | Yes (N suffix) | Depends on datasheet revision | Depends on datasheet revision | Yes (F suffix) | Depends on datasheet revision |
Diferensiator Kunci
- Tape-and-reel format for high-volume SMT production (vsEP1K50TI144-2N (tray))
- Same-die -2 speed grade (mid-tier) for balanced fMAX/cost (vsEP1K50TI144-1X (speed grade -1))
- TQFP-144 footprint enables hand-rework and socketed qualification (vsEP4CE6E22 (Cyclone IV EQFP-144, smaller pitch))
Catatan Desain
The EP1K50TI144-2X requires a clean 2.5 V ±5% rail (VCCINT) for the core logic and SRAM configuration cells; ripple above 100 mV pk-pk can corrupt configuration and cause bit-level errors that manifest as intermittent functional failures. Decouple every VCCINT pin (typically 6 pins on the TQFP-144) with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a single 10 µF tantalum or polymer bulk capacitor near the FPGA's power pin cluster. Each VCCIO bank (4 banks) must be decoupled independently because mixing 3.3 V and 2.5 V standards on different banks is a common use case.
Route the configuration bus (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) as a short, guarded group to keep them isolated from switching I/O. Place the configuration PROM (EPC2 or EPC4) on the same side of the PCB as the FPGA to minimize stub lengths; long configuration traces cause intermittent configuration failures above 20 MHz DCLK. Provide a pull-up (10 kΩ) on nCONFIG and CONF_DONE per the ACEX 1K handbook; omitting these prevents the device from entering user mode.
The 144-pin TQFP at 0.5 mm pitch is hand-solderable but stack-up sensitive. Use a 4-layer PCB with a continuous ground plane directly under the FPGA to provide the reference for the high-pin-count package; without it, signal-integrity on the inner rows of I/O degrades noticeably above 50 MHz. JTAG (TCK/TMS/TDI/TDO) traces should be length-matched within 25 mm and kept clear of clock edges to meet IEEE 1149.1 timing.
Do not assume the 'X' suffix denotes a different speed grade - it is a packaging-format indicator (tape-and-reel), and confusing it with the -2 speed grade is a common source of order errors. Avoid using the EP1K50TI144-2X in new designs unless maintenance of an existing board layout is the primary requirement; the ACEX 1K family is in last-time-buy status. For new designs, migrate to MAX V 5M80ZE64 or Cyclone IV EP4CE6E22 and reuse the HDL via Quartus re-targeting.
Informasi Konformitas
RoHS / lead-free status is unknown because the part is mature legacy stock and distributor pages do not consistently declare it; verify the finish code on the actual device marking or the manufacturer's CoC before RoHS-critical assembly. AEC-Q100 is not applicable (industrial, not automotive-qualified).