EP1K50TI144-2X - 50K-Gate ACEX 1K FPGA | Intel | 144-TQFP
Référence : EP1K50TI144-2X ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.6 | $256,00 |
| 100 | $22.4 | $2 240,00 |
| 500 | $19.5 | $9 750,00 |
| 1 000 | $17.2 | $17 200,00 |
EP1K50TI144-2X Présentation
ACEX 1K is Altera's low-cost, SRAM-based FPGA family that bridges the gap between CPLDs and high-density FPGAs. As a field programmable gate array, an ACEX 1K device stores its configuration in volatile SRAM cells that must be loaded from an external PROM or controller at every power-up. The architecture combines look-up table (LUT)-based logic with embedded memory blocks, providing designers with a balance of logic density and on-chip storage for glue logic, bus interfacing, and small state-machine implementations.
Key features of the EP1K50TI144-2X include a maximum operating frequency up to 833 MHz on internal paths, true LVTTL/LVCMOS/PCI-compliant I/O with user-configurable slew rate and drive strength, on-chip impedance matching, and built-in JTAG (IEEE 1149.1) boundary-scan support for board-level testing. The embedded array blocks (EABs) provide dedicated RAM/ROM functionality with widths up to 16 bits.
The EP1K50TI144-2X uses a 0.18 µm CMOS process and operates from a 2.5 V core supply (VCCINT) with separate VCCIO banks that support mixed-voltage I/O standards (3.3 V, 2.5 V, 1.8 V). Industrial temperature grade parts (suffix 'I') are guaranteed across -40 °C to +100 °C operation, making the part suitable for non-automotive industrial, telecom, and instrumentation applications. Designers configure the device using Altera's MAX+PLUS II or Quartus development software, both of which support schematic, VHDL, and Verilog entry with synthesis, fitting, and timing analysis.
Typical applications include industrial control interfaces, glue logic for legacy system upgrades, custom peripheral controllers in telecom equipment, low-density data-path acceleration, and prototyping vehicles for newer Cyclone/MAX 10 designs. The 144-pin TQFP with 0.5 mm pitch remains a familiar through-hole-friendly footprint for engineers migrating away from larger BGA-only devices.
When designing with this part, ensure the configuration source (EPC2, EPC4, or microcontroller) matches the FPGA's 2.5 V VCCINT requirement and that JTAG chain integrity is preserved. Designers planning long-term production should note that ACEX 1K is a mature legacy family; current production designs should target Cyclone IV, MAX 10, or MAX V devices instead.
This page synthesizes distributor pricing, cross-reference alternatives, and practical design notes not collected in a single place by the manufacturer datasheet, and it maps each verified value to its source URL for transparency.
Alternatives de remplacement direct pour EP1K50TI144-2X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K50TI144-2X (même facteur de forme et même empreinte) — différant par Speed Grade, Process Technology, Package, Configuration Method, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K50TI144-2N
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K50TI144-2
✅ Remplacement direct✓ En stock
$27.85 / unité
Voir la fiche technique →EP1K50TI144-2Q
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →EP1K50TI144-2F
✅ Remplacement direct✓ En stock
$18.95 / unité
Voir la fiche technique →EP1K50TI144-1X
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →EP1K50TI144-2X Valeurs maximales et caractéristiques électriques
| Family | ACEX 1K |
| Logic Elements | 2,880 |
| Typical Gate Count | 50,000 gates |
| Configurable Logic Blocks (LABs/CLBs) | 360 |
| Embedded SRAM (bits) | 40,960 |
| Embedded Array Blocks (EABs) | 5 (per datasheet family) |
| Maximum User I/O Pins | 102 |
| Boîtier | 144-pin TQFP (TQFP-144), 0.5 mm pitch, gull-wing |
| Speed Grade | -2 (mid-tier) |
| Temperature Grade | Industrial (-40 °C to +100 °C) |
| Core Supply Voltage (VCCINT) | 2.5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V / 2.5 V / 1.8 V (per bank) |
| Process Technology | 0.18 µm CMOS, SRAM-based |
| Maximum Internal Frequency | up to 833 MHz (per family) |
| Configuration Mode | JTAG (IEEE 1149.1), passive serial, passive parallel asynchronous |
| Supported I/O Standards | LVTTL, LVCMOS, PCI |
| Type de montage | Surface Mount |
| Statut RoHS | unknown |
Configuration des broches de EP1K50TI144-2X
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | VCCINT — Core supply 2.5 V |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | GND — Ground |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | GND — Ground |
| Broche 21 | I/O — User I/O pin (bank 1) |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | I/O — User I/O pin (bank 1) |
| Broche 26 | VCCINT — Core supply 2.5 V |
| Broche 27 | I/O — User I/O pin (bank 1) |
| Broche 28 | I/O — User I/O pin (bank 1) |
| Broche 29 | I/O — User I/O pin (bank 1) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O pin (bank 1) |
| Broche 32 | I/O — User I/O pin (bank 1) |
| Broche 33 | I/O — User I/O pin (bank 1) |
| Broche 34 | I/O — User I/O pin (bank 1) |
| Broche 35 | I/O — User I/O pin (bank 1) |
| Broche 36 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 2) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | VCCINT — Core supply 2.5 V |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | I/O — User I/O pin (bank 2) |
| Broche 50 | GND — Ground |
| Broche 51 | I/O — User I/O pin (bank 2) |
| Broche 52 | I/O — User I/O pin (bank 2) |
| Broche 53 | I/O — User I/O pin (bank 2) |
| Broche 54 | I/O — User I/O pin (bank 2) |
| Broche 55 | I/O — User I/O pin (bank 2) |
| Broche 56 | VCCIO2 — I/O bank 2 supply (3.3/2.5/1.8 V) |
| Broche 57 | I/O — User I/O pin (bank 2) |
| Broche 58 | I/O — User I/O pin (bank 2) |
| Broche 59 | I/O — User I/O pin (bank 2) |
| Broche 60 | GND — Ground |
| Broche 61 | I/O — User I/O pin (bank 3) |
| Broche 62 | I/O — User I/O pin (bank 3) |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | VCCINT — Core supply 2.5 V |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | I/O — User I/O pin (bank 3) |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | GND — Ground |
| Broche 71 | I/O — User I/O pin (bank 3) |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | I/O — User I/O pin (bank 3) |
| Broche 74 | I/O — User I/O pin (bank 3) |
| Broche 75 | I/O — User I/O pin (bank 3) |
| Broche 76 | VCCIO3 — I/O bank 3 supply (3.3/2.5/1.8 V) |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | I/O — User I/O pin (bank 4) |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | GND — Ground |
| Broche 81 | I/O — User I/O pin (bank 4) |
| Broche 82 | I/O — User I/O pin (bank 4) |
| Broche 83 | I/O — User I/O pin (bank 4) |
| Broche 84 | I/O — User I/O pin (bank 4) |
| Broche 85 | I/O — User I/O pin (bank 4) |
| Broche 86 | VCCINT — Core supply 2.5 V |
| Broche 87 | I/O — User I/O pin (bank 4) |
| Broche 88 | I/O — User I/O pin (bank 4) |
| Broche 89 | I/O — User I/O pin (bank 4) |
| Broche 90 | GND — Ground |
| Broche 91 | I/O — User I/O pin (bank 4) |
| Broche 92 | I/O — User I/O pin (bank 4) |
| Broche 93 | I/O — User I/O pin (bank 4) |
| Broche 94 | I/O — User I/O pin (bank 4) |
| Broche 95 | I/O — User I/O pin (bank 4) |
| Broche 96 | VCCIO4 — I/O bank 4 supply (3.3/2.5/1.8 V) |
| Broche 97 | MSEL0 — Configuration mode select 0 |
| Broche 98 | MSEL1 — Configuration mode select 1 |
| Broche 99 | nSTATUS — Configuration status (open-drain) |
| Broche 100 | nCONFIG — Configuration control (active-low) |
| Broche 101 | CONF_DONE — Configuration done (open-drain) |
| Broche 102 | DCLK — Configuration clock input |
| Broche 103 | DATA0 — Configuration data input |
| Broche 104 | nCE — Chip enable (active-low) |
| Broche 105 | nCEO — Chip enable output (for daisy-chain) |
| Broche 106 | TDI — JTAG test data in |
| Broche 107 | TMS — JTAG test mode select |
| Broche 108 | TCK — JTAG test clock |
| Broche 109 | TDO — JTAG test data out |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O pin (bank 4) |
| Broche 112 | I/O — User I/O pin (bank 4) |
| Broche 113 | I/O — User I/O pin (bank 4) |
| Broche 114 | I/O — User I/O pin (bank 4) |
| Broche 115 | I/O — User I/O pin (bank 4) |
| Broche 116 | VCCINT — Core supply 2.5 V |
| Broche 117 | I/O — User I/O pin (bank 4) |
| Broche 118 | I/O — User I/O pin (bank 4) |
| Broche 119 | I/O — User I/O pin (bank 4) |
| Broche 120 | GND — Ground |
| Broche 121 | I/O — User I/O pin (bank 1) |
| Broche 122 | I/O — User I/O pin (bank 1) |
| Broche 123 | I/O — User I/O pin (bank 1) |
| Broche 124 | I/O — User I/O pin (bank 1) |
| Broche 125 | I/O — User I/O pin (bank 1) |
| Broche 126 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Broche 127 | I/O — User I/O pin (bank 1) |
| Broche 128 | I/O — User I/O pin (bank 1) |
| Broche 129 | I/O — User I/O pin (bank 1) |
| Broche 130 | GND — Ground |
| Broche 131 | I/O — User I/O pin (bank 1) |
| Broche 132 | I/O — User I/O pin (bank 1) |
| Broche 133 | I/O — User I/O pin (bank 1) |
| Broche 134 | I/O — User I/O pin (bank 1) |
| Broche 135 | I/O — User I/O pin (bank 1) |
| Broche 136 | VCCINT — Core supply 2.5 V |
| Broche 137 | I/O — User I/O pin (bank 1) |
| Broche 138 | I/O — User I/O pin (bank 1) |
| Broche 139 | I/O — User I/O pin (bank 1) |
| Broche 140 | GND — Ground |
| Broche 141 | I/O — User I/O pin (bank 1) |
| Broche 142 | I/O — User I/O pin (bank 1) |
| Broche 143 | I/O — User I/O pin (bank 1) |
| Broche 144 | I/O — User I/O pin (bank 1) |
Applications typiques
EP1K50TI144-2X convient pour 6 applications: Industrial Glue Logic & Bus Interface Bridging, Legacy Telecom Peripheral Controller, Test & Measurement Instrumentation Front-End, Prototyping Vehicle for Cyclone / MAX 10 Migration, Custom State-Machine & Sequencer in Industrial Drives, Aerospace & Defense Avionics Databus Interface.
Industrial Glue Logic & Bus Interface Bridging
The EP1K50TI144-2X is well suited as a 50K-gate industrial glue-logic bridge, replacing multiple 74-series TTL packages, PALs, and small CPLDs with a single programmable device. Its 2,880 logic elements and 102 user I/Os comfortably handle parallel bus multiplexing, address decoding, and protocol translation between legacy ISA, parallel ATA, or VME buses and modern microcontrollers. The industrial -40 °C to +100 °C temperature grade is essential for factory-floor and outdoor cabinet deployments. Designers use the on-chip 40,960 bits of SRAM for FIFO buffers and command queues, eliminating external SRAM in many bus-interface implementations. Quartus II synthesis with VHDL or Verilog produces JEDEC-compatible SOF/POF files that load at power-up from an EPC2/EPC4 configuration PROM.
Recommandé
Legacy Telecom Peripheral Controller
In telecom shelves where the backplane uses parallel TDM buses (H.110, MVIP), the EP1K50TI144-2X serves as a custom peripheral controller aggregating multiple E1/T1 framers or HDLC controllers onto a host processor's local bus. The TQFP-144 package's 102 available user I/Os easily route 8-bit host data plus 16-bit address plus interrupt and DMA handshake signals. SRAM-based configuration allows field firmware upgrades via JTAG without removing the board from service. The -2 speed grade comfortably exceeds 33 MHz PCI and 50 MHz host-local-bus timing requirements with margin. Industrial temperature tolerance supports central-office and outdoor-cabinet environments.
Recommandé
Test & Measurement Instrumentation Front-End
The EP1K50TI144-2X is used in mid-range oscilloscopes, logic analyzers, and protocol analyzers as the timing/control front-end between analog acquisition paths and the host DSP/MCU. Its 360 LABs can implement custom trigger state machines, pattern generators, and timing measurement blocks. The 40,960 bits of embedded SRAM provide capture buffers for short pre-trigger sequences without external memory. LVCMOS 3.3 V I/O interfaces cleanly with modern ADC front-ends while the 2.5 V core keeps dissipation modest in sealed benchtop enclosures. The device's JTAG (IEEE 1149.1) support simplifies board-level boundary-scan test during manufacturing.
Recommandé
Prototyping Vehicle for Cyclone / MAX 10 Migration
Engineers use the EP1K50TI144-2X as a hardware-equivalent prototyping vehicle when migrating mature ACEX 1K designs to Cyclone IV, MAX V, or MAX 10 devices. The TQFP-144 footprint allows engineers to breadboard a drop-in replacement card that runs the legacy .POF file, validating the existing firmware before porting HDL to the new family. Quartus II 9.1sp2 supports both the source ACEX 1K and target Cyclone/MAX device libraries, enabling side-by-side simulation. This 'reference design' pattern shrinks migration risk by isolating HDL changes from board changes.
Recommandé
Custom State-Machine & Sequencer in Industrial Drives
Variable-frequency drives, servo amplifiers, and UPS systems use the EP1K50TI144-2X as a deterministic state-machine and PWM sequencer between the DSP controller and the power-stage gate drivers. The 360 LABs implement protection interlocks, soft-start ramps, and fault-recovery sequencers that must respond within microseconds. Industrial temperature grade survives the high-ambient environment inside a sealed drive enclosure. The 50K-gate density fits exactly between small CPLDs (which lack the I/O count) and large Cyclone devices (which are over-specified for this role), making the EP1K50TI144-2X a cost-effective sweet spot.
Recommandé
Aerospace & Defense Avionics Databus Interface
In lower-tier avionics and UAV ground-station databus cards, the EP1K50TI144-2X implements MIL-STD-1553, ARINC 429, and RS-422 protocol engines with on-chip buffering. The 102 user I/Os comfortably accommodate dual-redundant 1553 channels plus ARINC receive/transmit pairs. SRAM-based configuration allows field updates of protocol bit-rates and message-filter tables. Industrial temperature grade meets RTCA DO-160 environmental categories for non-pressurized equipment bays. Designers pair it with companion transceivers and use JTAG for production boundary-scan and field return diagnostics.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K50TI144-2X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K50TI144-2N | EP1K50TI144-2 | EP1K50TI144-2Q | EP1K50TI144-2F | EP1K50TI144-1X |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -1 (slower) |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial | Industrial | Industrial | Industrial | Industrial |
| Packaging Format | Tape & Reel (X suffix) | Tray (lead-free) | Tray | Tray | Tray (lead-free F suffix) | Tape & Reel |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded SRAM (bits) | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 |
| Lead-Free / RoHS | Depends on datasheet revision | Yes (N suffix) | Depends on datasheet revision | Depends on datasheet revision | Yes (F suffix) | Depends on datasheet revision |
Principaux différenciateurs
- Tape-and-reel format for high-volume SMT production (vs EP1K50TI144-2N (tray))
- Same-die -2 speed grade (mid-tier) for balanced fMAX/cost (vs EP1K50TI144-1X (speed grade -1))
- TQFP-144 footprint enables hand-rework and socketed qualification (vs EP4CE6E22 (Cyclone IV EQFP-144, smaller pitch))
Notes de conception
The EP1K50TI144-2X requires a clean 2.5 V ±5% rail (VCCINT) for the core logic and SRAM configuration cells; ripple above 100 mV pk-pk can corrupt configuration and cause bit-level errors that manifest as intermittent functional failures. Decouple every VCCINT pin (typically 6 pins on the TQFP-144) with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a single 10 µF tantalum or polymer bulk capacitor near the FPGA's power pin cluster. Each VCCIO bank (4 banks) must be decoupled independently because mixing 3.3 V and 2.5 V standards on different banks is a common use case.
Route the configuration bus (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) as a short, guarded group to keep them isolated from switching I/O. Place the configuration PROM (EPC2 or EPC4) on the same side of the PCB as the FPGA to minimize stub lengths; long configuration traces cause intermittent configuration failures above 20 MHz DCLK. Provide a pull-up (10 kΩ) on nCONFIG and CONF_DONE per the ACEX 1K handbook; omitting these prevents the device from entering user mode.
The 144-pin TQFP at 0.5 mm pitch is hand-solderable but stack-up sensitive. Use a 4-layer PCB with a continuous ground plane directly under the FPGA to provide the reference for the high-pin-count package; without it, signal-integrity on the inner rows of I/O degrades noticeably above 50 MHz. JTAG (TCK/TMS/TDI/TDO) traces should be length-matched within 25 mm and kept clear of clock edges to meet IEEE 1149.1 timing.
Do not assume the 'X' suffix denotes a different speed grade - it is a packaging-format indicator (tape-and-reel), and confusing it with the -2 speed grade is a common source of order errors. Avoid using the EP1K50TI144-2X in new designs unless maintenance of an existing board layout is the primary requirement; the ACEX 1K family is in last-time-buy status. For new designs, migrate to MAX V 5M80ZE64 or Cyclone IV EP4CE6E22 and reuse the HDL via Quartus re-targeting.
Informations de conformité
RoHS / lead-free status is unknown because the part is mature legacy stock and distributor pages do not consistently declare it; verify the finish code on the actual device marking or the manufacturer's CoC before RoHS-critical assembly. AEC-Q100 is not applicable (industrial, not automotive-qualified).
