EP1K50TI144-2X - 50K-Gate ACEX 1K FPGA | Intel | 144-TQFP
N.º da peça: EP1K50TI144-2X ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.6 | $256,00 |
| 100 | $22.4 | $2.240,00 |
| 500 | $19.5 | $9.750,00 |
| 1.000 | $17.2 | $17.200,00 |
EP1K50TI144-2X Visão geral
ACEX 1K is Altera's low-cost, SRAM-based FPGA family that bridges the gap between CPLDs and high-density FPGAs. As a field programmable gate array, an ACEX 1K device stores its configuration in volatile SRAM cells that must be loaded from an external PROM or controller at every power-up. The architecture combines look-up table (LUT)-based logic with embedded memory blocks, providing designers with a balance of logic density and on-chip storage for glue logic, bus interfacing, and small state-machine implementations.
Key features of the EP1K50TI144-2X include a maximum operating frequency up to 833 MHz on internal paths, true LVTTL/LVCMOS/PCI-compliant I/O with user-configurable slew rate and drive strength, on-chip impedance matching, and built-in JTAG (IEEE 1149.1) boundary-scan support for board-level testing. The embedded array blocks (EABs) provide dedicated RAM/ROM functionality with widths up to 16 bits.
The EP1K50TI144-2X uses a 0.18 µm CMOS process and operates from a 2.5 V core supply (VCCINT) with separate VCCIO banks that support mixed-voltage I/O standards (3.3 V, 2.5 V, 1.8 V). Industrial temperature grade parts (suffix 'I') are guaranteed across -40 °C to +100 °C operation, making the part suitable for non-automotive industrial, telecom, and instrumentation applications. Designers configure the device using Altera's MAX+PLUS II or Quartus development software, both of which support schematic, VHDL, and Verilog entry with synthesis, fitting, and timing analysis.
Typical applications include industrial control interfaces, glue logic for legacy system upgrades, custom peripheral controllers in telecom equipment, low-density data-path acceleration, and prototyping vehicles for newer Cyclone/MAX 10 designs. The 144-pin TQFP with 0.5 mm pitch remains a familiar through-hole-friendly footprint for engineers migrating away from larger BGA-only devices.
When designing with this part, ensure the configuration source (EPC2, EPC4, or microcontroller) matches the FPGA's 2.5 V VCCINT requirement and that JTAG chain integrity is preserved. Designers planning long-term production should note that ACEX 1K is a mature legacy family; current production designs should target Cyclone IV, MAX 10, or MAX V devices instead.
This page synthesizes distributor pricing, cross-reference alternatives, and practical design notes not collected in a single place by the manufacturer datasheet, and it maps each verified value to its source URL for transparency.
Alternativas drop-in para EP1K50TI144-2X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K50TI144-2X (mesmo formato e footprint) — diferindo em Speed Grade, Process Technology, Package, Configuration Method, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K50TI144-2N
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →EP1K50TI144-2
✅ Drop-In✓ Em estoque
$27.85 / unidade
Ver ficha técnica →EP1K50TI144-2Q
✅ Drop-In✓ Em estoque
$19.85 / unidade
Ver ficha técnica →EP1K50TI144-2F
✅ Drop-In✓ Em estoque
$18.95 / unidade
Ver ficha técnica →EP1K50TI144-1X
✅ Drop-In✓ Em estoque
$10.95 / unidade
Ver ficha técnica →EP1K50TI144-2X Classificações máximas e características elétricas
| Family | ACEX 1K |
| Logic Elements | 2,880 |
| Typical Gate Count | 50,000 gates |
| Configurable Logic Blocks (LABs/CLBs) | 360 |
| Embedded SRAM (bits) | 40,960 |
| Embedded Array Blocks (EABs) | 5 (per datasheet family) |
| Maximum User I/O Pins | 102 |
| Encapsulamento | 144-pin TQFP (TQFP-144), 0.5 mm pitch, gull-wing |
| Speed Grade | -2 (mid-tier) |
| Temperature Grade | Industrial (-40 °C to +100 °C) |
| Core Supply Voltage (VCCINT) | 2.5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V / 2.5 V / 1.8 V (per bank) |
| Process Technology | 0.18 µm CMOS, SRAM-based |
| Maximum Internal Frequency | up to 833 MHz (per family) |
| Configuration Mode | JTAG (IEEE 1149.1), passive serial, passive parallel asynchronous |
| Supported I/O Standards | LVTTL, LVCMOS, PCI |
| Tipo de montagem | Surface Mount |
| Status RoHS | unknown |
Configuração de pinos do EP1K50TI144-2X
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | VCCINT — Core supply 2.5 V |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | GND — Ground |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | I/O — User I/O pin (bank 1) |
| Pino 14 | I/O — User I/O pin (bank 1) |
| Pino 15 | I/O — User I/O pin (bank 1) |
| Pino 16 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Pino 17 | I/O — User I/O pin (bank 1) |
| Pino 18 | I/O — User I/O pin (bank 1) |
| Pino 19 | I/O — User I/O pin (bank 1) |
| Pino 20 | GND — Ground |
| Pino 21 | I/O — User I/O pin (bank 1) |
| Pino 22 | I/O — User I/O pin (bank 1) |
| Pino 23 | I/O — User I/O pin (bank 1) |
| Pino 24 | I/O — User I/O pin (bank 1) |
| Pino 25 | I/O — User I/O pin (bank 1) |
| Pino 26 | VCCINT — Core supply 2.5 V |
| Pino 27 | I/O — User I/O pin (bank 1) |
| Pino 28 | I/O — User I/O pin (bank 1) |
| Pino 29 | I/O — User I/O pin (bank 1) |
| Pino 30 | GND — Ground |
| Pino 31 | I/O — User I/O pin (bank 1) |
| Pino 32 | I/O — User I/O pin (bank 1) |
| Pino 33 | I/O — User I/O pin (bank 1) |
| Pino 34 | I/O — User I/O pin (bank 1) |
| Pino 35 | I/O — User I/O pin (bank 1) |
| Pino 36 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | I/O — User I/O pin (bank 2) |
| Pino 39 | I/O — User I/O pin (bank 2) |
| Pino 40 | GND — Ground |
| Pino 41 | I/O — User I/O pin (bank 2) |
| Pino 42 | I/O — User I/O pin (bank 2) |
| Pino 43 | I/O — User I/O pin (bank 2) |
| Pino 44 | I/O — User I/O pin (bank 2) |
| Pino 45 | I/O — User I/O pin (bank 2) |
| Pino 46 | VCCINT — Core supply 2.5 V |
| Pino 47 | I/O — User I/O pin (bank 2) |
| Pino 48 | I/O — User I/O pin (bank 2) |
| Pino 49 | I/O — User I/O pin (bank 2) |
| Pino 50 | GND — Ground |
| Pino 51 | I/O — User I/O pin (bank 2) |
| Pino 52 | I/O — User I/O pin (bank 2) |
| Pino 53 | I/O — User I/O pin (bank 2) |
| Pino 54 | I/O — User I/O pin (bank 2) |
| Pino 55 | I/O — User I/O pin (bank 2) |
| Pino 56 | VCCIO2 — I/O bank 2 supply (3.3/2.5/1.8 V) |
| Pino 57 | I/O — User I/O pin (bank 2) |
| Pino 58 | I/O — User I/O pin (bank 2) |
| Pino 59 | I/O — User I/O pin (bank 2) |
| Pino 60 | GND — Ground |
| Pino 61 | I/O — User I/O pin (bank 3) |
| Pino 62 | I/O — User I/O pin (bank 3) |
| Pino 63 | I/O — User I/O pin (bank 3) |
| Pino 64 | I/O — User I/O pin (bank 3) |
| Pino 65 | I/O — User I/O pin (bank 3) |
| Pino 66 | VCCINT — Core supply 2.5 V |
| Pino 67 | I/O — User I/O pin (bank 3) |
| Pino 68 | I/O — User I/O pin (bank 3) |
| Pino 69 | I/O — User I/O pin (bank 3) |
| Pino 70 | GND — Ground |
| Pino 71 | I/O — User I/O pin (bank 3) |
| Pino 72 | I/O — User I/O pin (bank 3) |
| Pino 73 | I/O — User I/O pin (bank 3) |
| Pino 74 | I/O — User I/O pin (bank 3) |
| Pino 75 | I/O — User I/O pin (bank 3) |
| Pino 76 | VCCIO3 — I/O bank 3 supply (3.3/2.5/1.8 V) |
| Pino 77 | I/O — User I/O pin (bank 4) |
| Pino 78 | I/O — User I/O pin (bank 4) |
| Pino 79 | I/O — User I/O pin (bank 4) |
| Pino 80 | GND — Ground |
| Pino 81 | I/O — User I/O pin (bank 4) |
| Pino 82 | I/O — User I/O pin (bank 4) |
| Pino 83 | I/O — User I/O pin (bank 4) |
| Pino 84 | I/O — User I/O pin (bank 4) |
| Pino 85 | I/O — User I/O pin (bank 4) |
| Pino 86 | VCCINT — Core supply 2.5 V |
| Pino 87 | I/O — User I/O pin (bank 4) |
| Pino 88 | I/O — User I/O pin (bank 4) |
| Pino 89 | I/O — User I/O pin (bank 4) |
| Pino 90 | GND — Ground |
| Pino 91 | I/O — User I/O pin (bank 4) |
| Pino 92 | I/O — User I/O pin (bank 4) |
| Pino 93 | I/O — User I/O pin (bank 4) |
| Pino 94 | I/O — User I/O pin (bank 4) |
| Pino 95 | I/O — User I/O pin (bank 4) |
| Pino 96 | VCCIO4 — I/O bank 4 supply (3.3/2.5/1.8 V) |
| Pino 97 | MSEL0 — Configuration mode select 0 |
| Pino 98 | MSEL1 — Configuration mode select 1 |
| Pino 99 | nSTATUS — Configuration status (open-drain) |
| Pino 100 | nCONFIG — Configuration control (active-low) |
| Pino 101 | CONF_DONE — Configuration done (open-drain) |
| Pino 102 | DCLK — Configuration clock input |
| Pino 103 | DATA0 — Configuration data input |
| Pino 104 | nCE — Chip enable (active-low) |
| Pino 105 | nCEO — Chip enable output (for daisy-chain) |
| Pino 106 | TDI — JTAG test data in |
| Pino 107 | TMS — JTAG test mode select |
| Pino 108 | TCK — JTAG test clock |
| Pino 109 | TDO — JTAG test data out |
| Pino 110 | GND — Ground |
| Pino 111 | I/O — User I/O pin (bank 4) |
| Pino 112 | I/O — User I/O pin (bank 4) |
| Pino 113 | I/O — User I/O pin (bank 4) |
| Pino 114 | I/O — User I/O pin (bank 4) |
| Pino 115 | I/O — User I/O pin (bank 4) |
| Pino 116 | VCCINT — Core supply 2.5 V |
| Pino 117 | I/O — User I/O pin (bank 4) |
| Pino 118 | I/O — User I/O pin (bank 4) |
| Pino 119 | I/O — User I/O pin (bank 4) |
| Pino 120 | GND — Ground |
| Pino 121 | I/O — User I/O pin (bank 1) |
| Pino 122 | I/O — User I/O pin (bank 1) |
| Pino 123 | I/O — User I/O pin (bank 1) |
| Pino 124 | I/O — User I/O pin (bank 1) |
| Pino 125 | I/O — User I/O pin (bank 1) |
| Pino 126 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Pino 127 | I/O — User I/O pin (bank 1) |
| Pino 128 | I/O — User I/O pin (bank 1) |
| Pino 129 | I/O — User I/O pin (bank 1) |
| Pino 130 | GND — Ground |
| Pino 131 | I/O — User I/O pin (bank 1) |
| Pino 132 | I/O — User I/O pin (bank 1) |
| Pino 133 | I/O — User I/O pin (bank 1) |
| Pino 134 | I/O — User I/O pin (bank 1) |
| Pino 135 | I/O — User I/O pin (bank 1) |
| Pino 136 | VCCINT — Core supply 2.5 V |
| Pino 137 | I/O — User I/O pin (bank 1) |
| Pino 138 | I/O — User I/O pin (bank 1) |
| Pino 139 | I/O — User I/O pin (bank 1) |
| Pino 140 | GND — Ground |
| Pino 141 | I/O — User I/O pin (bank 1) |
| Pino 142 | I/O — User I/O pin (bank 1) |
| Pino 143 | I/O — User I/O pin (bank 1) |
| Pino 144 | I/O — User I/O pin (bank 1) |
Aplicações típicas
EP1K50TI144-2X é adequado para 6 aplicaçãos: Industrial Glue Logic & Bus Interface Bridging, Legacy Telecom Peripheral Controller, Test & Measurement Instrumentation Front-End, Prototyping Vehicle for Cyclone / MAX 10 Migration, Custom State-Machine & Sequencer in Industrial Drives, Aerospace & Defense Avionics Databus Interface.
Industrial Glue Logic & Bus Interface Bridging
The EP1K50TI144-2X is well suited as a 50K-gate industrial glue-logic bridge, replacing multiple 74-series TTL packages, PALs, and small CPLDs with a single programmable device. Its 2,880 logic elements and 102 user I/Os comfortably handle parallel bus multiplexing, address decoding, and protocol translation between legacy ISA, parallel ATA, or VME buses and modern microcontrollers. The industrial -40 °C to +100 °C temperature grade is essential for factory-floor and outdoor cabinet deployments. Designers use the on-chip 40,960 bits of SRAM for FIFO buffers and command queues, eliminating external SRAM in many bus-interface implementations. Quartus II synthesis with VHDL or Verilog produces JEDEC-compatible SOF/POF files that load at power-up from an EPC2/EPC4 configuration PROM.
Recomendado
Legacy Telecom Peripheral Controller
In telecom shelves where the backplane uses parallel TDM buses (H.110, MVIP), the EP1K50TI144-2X serves as a custom peripheral controller aggregating multiple E1/T1 framers or HDLC controllers onto a host processor's local bus. The TQFP-144 package's 102 available user I/Os easily route 8-bit host data plus 16-bit address plus interrupt and DMA handshake signals. SRAM-based configuration allows field firmware upgrades via JTAG without removing the board from service. The -2 speed grade comfortably exceeds 33 MHz PCI and 50 MHz host-local-bus timing requirements with margin. Industrial temperature tolerance supports central-office and outdoor-cabinet environments.
Recomendado
Test & Measurement Instrumentation Front-End
The EP1K50TI144-2X is used in mid-range oscilloscopes, logic analyzers, and protocol analyzers as the timing/control front-end between analog acquisition paths and the host DSP/MCU. Its 360 LABs can implement custom trigger state machines, pattern generators, and timing measurement blocks. The 40,960 bits of embedded SRAM provide capture buffers for short pre-trigger sequences without external memory. LVCMOS 3.3 V I/O interfaces cleanly with modern ADC front-ends while the 2.5 V core keeps dissipation modest in sealed benchtop enclosures. The device's JTAG (IEEE 1149.1) support simplifies board-level boundary-scan test during manufacturing.
Recomendado
Prototyping Vehicle for Cyclone / MAX 10 Migration
Engineers use the EP1K50TI144-2X as a hardware-equivalent prototyping vehicle when migrating mature ACEX 1K designs to Cyclone IV, MAX V, or MAX 10 devices. The TQFP-144 footprint allows engineers to breadboard a drop-in replacement card that runs the legacy .POF file, validating the existing firmware before porting HDL to the new family. Quartus II 9.1sp2 supports both the source ACEX 1K and target Cyclone/MAX device libraries, enabling side-by-side simulation. This 'reference design' pattern shrinks migration risk by isolating HDL changes from board changes.
Recomendado
Custom State-Machine & Sequencer in Industrial Drives
Variable-frequency drives, servo amplifiers, and UPS systems use the EP1K50TI144-2X as a deterministic state-machine and PWM sequencer between the DSP controller and the power-stage gate drivers. The 360 LABs implement protection interlocks, soft-start ramps, and fault-recovery sequencers that must respond within microseconds. Industrial temperature grade survives the high-ambient environment inside a sealed drive enclosure. The 50K-gate density fits exactly between small CPLDs (which lack the I/O count) and large Cyclone devices (which are over-specified for this role), making the EP1K50TI144-2X a cost-effective sweet spot.
Recomendado
Aerospace & Defense Avionics Databus Interface
In lower-tier avionics and UAV ground-station databus cards, the EP1K50TI144-2X implements MIL-STD-1553, ARINC 429, and RS-422 protocol engines with on-chip buffering. The 102 user I/Os comfortably accommodate dual-redundant 1553 channels plus ARINC receive/transmit pairs. SRAM-based configuration allows field updates of protocol bit-rates and message-filter tables. Industrial temperature grade meets RTCA DO-160 environmental categories for non-pressurized equipment bays. Designers pair it with companion transceivers and use JTAG for production boundary-scan and field return diagnostics.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K50TI144-2X — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K50TI144-2N | EP1K50TI144-2 | EP1K50TI144-2Q | EP1K50TI144-2F | EP1K50TI144-1X |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -1 (slower) |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial | Industrial | Industrial | Industrial | Industrial |
| Packaging Format | Tape & Reel (X suffix) | Tray (lead-free) | Tray | Tray | Tray (lead-free F suffix) | Tape & Reel |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded SRAM (bits) | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 |
| Lead-Free / RoHS | Depends on datasheet revision | Yes (N suffix) | Depends on datasheet revision | Depends on datasheet revision | Yes (F suffix) | Depends on datasheet revision |
Principais diferenciais
- Tape-and-reel format for high-volume SMT production (vs EP1K50TI144-2N (tray))
- Same-die -2 speed grade (mid-tier) for balanced fMAX/cost (vs EP1K50TI144-1X (speed grade -1))
- TQFP-144 footprint enables hand-rework and socketed qualification (vs EP4CE6E22 (Cyclone IV EQFP-144, smaller pitch))
Notas de projeto
The EP1K50TI144-2X requires a clean 2.5 V ±5% rail (VCCINT) for the core logic and SRAM configuration cells; ripple above 100 mV pk-pk can corrupt configuration and cause bit-level errors that manifest as intermittent functional failures. Decouple every VCCINT pin (typically 6 pins on the TQFP-144) with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a single 10 µF tantalum or polymer bulk capacitor near the FPGA's power pin cluster. Each VCCIO bank (4 banks) must be decoupled independently because mixing 3.3 V and 2.5 V standards on different banks is a common use case.
Route the configuration bus (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) as a short, guarded group to keep them isolated from switching I/O. Place the configuration PROM (EPC2 or EPC4) on the same side of the PCB as the FPGA to minimize stub lengths; long configuration traces cause intermittent configuration failures above 20 MHz DCLK. Provide a pull-up (10 kΩ) on nCONFIG and CONF_DONE per the ACEX 1K handbook; omitting these prevents the device from entering user mode.
The 144-pin TQFP at 0.5 mm pitch is hand-solderable but stack-up sensitive. Use a 4-layer PCB with a continuous ground plane directly under the FPGA to provide the reference for the high-pin-count package; without it, signal-integrity on the inner rows of I/O degrades noticeably above 50 MHz. JTAG (TCK/TMS/TDI/TDO) traces should be length-matched within 25 mm and kept clear of clock edges to meet IEEE 1149.1 timing.
Do not assume the 'X' suffix denotes a different speed grade - it is a packaging-format indicator (tape-and-reel), and confusing it with the -2 speed grade is a common source of order errors. Avoid using the EP1K50TI144-2X in new designs unless maintenance of an existing board layout is the primary requirement; the ACEX 1K family is in last-time-buy status. For new designs, migrate to MAX V 5M80ZE64 or Cyclone IV EP4CE6E22 and reuse the HDL via Quartus re-targeting.
Informações de conformidade
RoHS / lead-free status is unknown because the part is mature legacy stock and distributor pages do not consistently declare it; verify the finish code on the actual device marking or the manufacturer's CoC before RoHS-critical assembly. AEC-Q100 is not applicable (industrial, not automotive-qualified).
