EP1K50TI144-2 - 50K-Gate ACEX-1K FPGA, 102 I/O, 144-LQFP | Intel
MPN: EP1K50TI144-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.3 | $423.00 |
| 100 | $36.75 | $3,675.00 |
| 500 | $31.2 | $15,600.00 |
| 1,000 | $27.85 | $27,850.00 |
Drop-in alternatives for EP1K50TI144-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K100TI144-2
✅ Drop-In📋 Reference alternative (not in catalog)
EP1K30TI144-2
✅ Drop-In✓ In Stock
$13.85 / Unit
View Datasheet →EP1K10TI144-2
✅ Drop-In✓ In Stock
$16.4 / Unit
View Datasheet →EP1K50TC144-2
✅ Drop-In✓ In Stock
$28.4 / Unit
View Datasheet →EP1K50TI144-1X
✅ Drop-In✓ In Stock
$10.95 / Unit
View Datasheet →EP1K50TI144-2 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Logic Elements (LEs) | 2,880 |
| Typical Gates | 50,000 |
| Maximum User I/O | 102 |
| Logic Array Blocks (LABs) | 360 |
| Total RAM Bits | 40,960 |
| Core Supply Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| Speed Grade | -2 |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Package | 144-LQFP (TQFP-144) |
| Mounting Type | Surface Mount |
| Process Technology | SRAM-based, 0.18 µm |
| Configuration Method | Passive Serial / Passive Parallel / JTAG |
| JTAG Support | IEEE 1149.1 Boundary Scan |
EP1K50TI144-2 Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | I/O — User I/O pin (bank 1) |
| Pin 7 | I/O — User I/O pin (bank 1) |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | I/O — User I/O pin (bank 1) |
| Pin 10 | I/O — User I/O pin (bank 1) |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | I/O — User I/O pin (bank 1) |
| Pin 13 | GND — Ground |
| Pin 14 | VCCINT — Core supply (2.5 V) |
| Pin 15 | I/O — User I/O pin (bank 2) |
| Pin 16 | I/O — User I/O pin (bank 2) |
| Pin 17 | I/O — User I/O pin (bank 2) |
| Pin 18 | I/O — User I/O pin (bank 2) |
| Pin 19 | I/O — User I/O pin (bank 2) |
| Pin 20 | I/O — User I/O pin (bank 2) |
| Pin 21 | I/O — User I/O pin (bank 2) |
| Pin 22 | I/O — User I/O pin (bank 2) |
| Pin 23 | I/O — User I/O pin (bank 2) |
| Pin 24 | I/O — User I/O pin (bank 2) |
| Pin 25 | I/O — User I/O pin (bank 2) |
| Pin 26 | I/O — User I/O pin (bank 2) |
| Pin 27 | I/O — User I/O pin (bank 2) |
| Pin 28 | I/O — User I/O pin (bank 2) |
| Pin 29 | I/O — User I/O pin (bank 2) |
| Pin 30 | I/O — User I/O pin (bank 2) |
| Pin 31 | I/O — User I/O pin (bank 2) |
| Pin 32 | I/O — User I/O pin (bank 2) |
| Pin 33 | I/O — User I/O pin (bank 2) |
| Pin 34 | GND — Ground |
| Pin 35 | VCCINT — Core supply (2.5 V) |
| Pin 36 | I/O — User I/O pin (bank 3) |
| Pin 37 | I/O — User I/O pin (bank 3) |
| Pin 38 | I/O — User I/O pin (bank 3) |
| Pin 39 | I/O — User I/O pin (bank 3) |
| Pin 40 | I/O — User I/O pin (bank 3) |
| Pin 41 | I/O — User I/O pin (bank 3) |
| Pin 42 | I/O — User I/O pin (bank 3) |
| Pin 43 | I/O — User I/O pin (bank 3) |
| Pin 44 | I/O — User I/O pin (bank 3) |
| Pin 45 | I/O — User I/O pin (bank 3) |
| Pin 46 | I/O — User I/O pin (bank 3) |
| Pin 47 | I/O — User I/O pin (bank 3) |
| Pin 48 | I/O — User I/O pin (bank 3) |
| Pin 49 | I/O — User I/O pin (bank 3) |
| Pin 50 | I/O — User I/O pin (bank 3) |
| Pin 51 | I/O — User I/O pin (bank 3) |
| Pin 52 | I/O — User I/O pin (bank 3) |
| Pin 53 | I/O — User I/O pin (bank 3) |
| Pin 54 | I/O — User I/O pin (bank 3) |
| Pin 55 | GND — Ground |
| Pin 56 | VCCINT — Core supply (2.5 V) |
| Pin 57 | I/O — User I/O pin (bank 4) |
| Pin 58 | I/O — User I/O pin (bank 4) |
| Pin 59 | I/O — User I/O pin (bank 4) |
| Pin 60 | I/O — User I/O pin (bank 4) |
| Pin 61 | I/O — User I/O pin (bank 4) |
| Pin 62 | I/O — User I/O pin (bank 4) |
| Pin 63 | I/O — User I/O pin (bank 4) |
| Pin 64 | I/O — User I/O pin (bank 4) |
| Pin 65 | I/O — User I/O pin (bank 4) |
| Pin 66 | I/O — User I/O pin (bank 4) |
| Pin 67 | I/O — User I/O pin (bank 4) |
| Pin 68 | I/O — User I/O pin (bank 4) |
| Pin 69 | I/O — User I/O pin (bank 4) |
| Pin 70 | I/O — User I/O pin (bank 4) |
| Pin 71 | I/O — User I/O pin (bank 4) |
| Pin 72 | I/O — User I/O pin (bank 4) |
| Pin 73 | I/O — User I/O pin (bank 4) |
| Pin 74 | GND — Ground |
| Pin 75 | VCCINT — Core supply (2.5 V) |
| Pin 76 | I/O — User I/O pin (bank 5) |
| Pin 77 | I/O — User I/O pin (bank 5) |
| Pin 78 | I/O — User I/O pin (bank 5) |
| Pin 79 | I/O — User I/O pin (bank 5) |
| Pin 80 | I/O — User I/O pin (bank 5) |
| Pin 81 | I/O — User I/O pin (bank 5) |
| Pin 82 | I/O — User I/O pin (bank 5) |
| Pin 83 | I/O — User I/O pin (bank 5) |
| Pin 84 | I/O — User I/O pin (bank 5) |
| Pin 85 | I/O — User I/O pin (bank 5) |
| Pin 86 | I/O — User I/O pin (bank 5) |
| Pin 87 | I/O — User I/O pin (bank 5) |
| Pin 88 | I/O — User I/O pin (bank 5) |
| Pin 89 | I/O — User I/O pin (bank 5) |
| Pin 90 | I/O — User I/O pin (bank 5) |
| Pin 91 | I/O — User I/O pin (bank 5) |
| Pin 92 | I/O — User I/O pin (bank 5) |
| Pin 93 | I/O — User I/O pin (bank 5) |
| Pin 94 | GND — Ground |
| Pin 95 | VCCINT — Core supply (2.5 V) |
| Pin 96 | I/O — User I/O pin (bank 6) |
| Pin 97 | I/O — User I/O pin (bank 6) |
| Pin 98 | I/O — User I/O pin (bank 6) |
| Pin 99 | I/O — User I/O pin (bank 6) |
| Pin 100 | I/O — User I/O pin (bank 6) |
| Pin 101 | I/O — User I/O pin (bank 6) |
| Pin 102 | I/O — User I/O pin (bank 6) |
| Pin 103 | I/O — User I/O pin (bank 6) |
| Pin 104 | I/O — User I/O pin (bank 6) |
| Pin 105 | I/O — User I/O pin (bank 6) |
| Pin 106 | I/O — User I/O pin (bank 6) |
| Pin 107 | I/O — User I/O pin (bank 6) |
| Pin 108 | I/O — User I/O pin (bank 6) |
| Pin 109 | I/O — User I/O pin (bank 6) |
| Pin 110 | I/O — User I/O pin (bank 6) |
| Pin 111 | I/O — User I/O pin (bank 6) |
| Pin 112 | I/O — User I/O pin (bank 6) |
| Pin 113 | I/O — User I/O pin (bank 6) |
| Pin 114 | I/O — User I/O pin (bank 6) |
| Pin 115 | I/O — User I/O pin (bank 6) |
| Pin 116 | I/O — User I/O pin (bank 6) |
| Pin 117 | nCONFIG — Configuration control (active-low reset) |
| Pin 118 | nSTATUS — Configuration status (active-low) |
| Pin 119 | CONF_DONE — Configuration done (active-high) |
| Pin 120 | DCLK — Configuration clock input |
| Pin 121 | DATA0 — Configuration data input (LSB) |
| Pin 122 | TDI — JTAG test data in |
| Pin 123 | TMS — JTAG test mode select |
| Pin 124 | TCK — JTAG test clock |
| Pin 125 | TDO — JTAG test data out |
| Pin 126 | MSEL0 — Configuration mode select 0 |
| Pin 127 | MSEL1 — Configuration mode select 1 |
| Pin 128 | DEV_CLRn — Device clear (active-low, optional) |
| Pin 129 | DEV_OE — Device output enable (active-high) |
| Pin 130 | VCCIO — I/O supply voltage |
| Pin 131 | GND — Ground |
| Pin 132 | I/O — User I/O pin (bank 1) |
| Pin 133 | I/O — User I/O pin (bank 1) |
| Pin 134 | I/O — User I/O pin (bank 1) |
| Pin 135 | I/O — User I/O pin (bank 1) |
| Pin 136 | I/O — User I/O pin (bank 1) |
| Pin 137 | I/O — User I/O pin (bank 1) |
| Pin 138 | I/O — User I/O pin (bank 1) |
| Pin 139 | I/O — User I/O pin (bank 1) |
| Pin 140 | I/O — User I/O pin (bank 1) |
| Pin 141 | I/O — User I/O pin (bank 1) |
| Pin 142 | I/O — User I/O pin (bank 1) |
| Pin 143 | I/O — User I/O pin (bank 1) |
| Pin 144 | I/O — User I/O pin (bank 1) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50TI144-2 is suitable for 6 applications: Industrial Glue Logic Replacement, Legacy Protocol Bridge and Bus Converter, Test and Measurement Instrumentation Front-End, Telecommunications Glue Logic and Framing, Motor Control and Drive Interface, Aerospace Prototype and Avionics Bus Interface.
Industrial Glue Logic Replacement
The EP1K50TI144-2 is well suited for replacing multiple discrete 74-series glue-logic ICs in industrial control boards. With 2,880 LEs and 102 user I/O pins, the device can absorb an entire 7400-series BOM (buffers, latches, transceivers, encoders) into a single chip, cutting PCB area by 60-70% and reducing component count. Its 2.5 V core and LVTTL/LVCMOS I/O support connect directly to legacy 3.3 V microcontrollers and 5 V peripherals via series resistors. Designers should budget for an EPC2/EPC8 boot PROM and 4-layer PCB for signal integrity.
Recommended
Legacy Protocol Bridge and Bus Converter
The EP1K50TI144-2 fits protocol-bridge designs such as UART-to-PCI, I2C-to-parallel, or SPI-to-ISA conversion used in legacy telecom and industrial equipment. The 40,960 bits of embedded RAM accommodate FIFOs up to 5 KB without external SRAM, and the 360 LABs deliver deterministic propagation delays suitable for bit-banging legacy bus timing. The 144-LQFP package is hand-rework-friendly for field upgrades, and SameFrame pin-compatibility lets engineers migrate to EP1K100TI144-2 in the same PCB footprint as bridge complexity grows.
Recommended
Test and Measurement Instrumentation Front-End
The EP1K50TI144-2 serves as the digital back-end for low-cost test instruments such as logic analyzers, pattern generators, and protocol exercisers. Its 102 I/O pins support up to 96 channels of buffered digital I/O at 50 MHz using the -2 speed grade, sufficient for capturing parallel bus traffic at up to 25 MHz. The 2.5 V core delivers low dynamic power (~0.5 W typical) compared to larger FPGAs, making the part attractive for portable or USB-powered instruments. Designers typically implement state machines for trigger sequencing and store captured data in the embedded EAB RAM.
Recommended
Telecommunications Glue Logic and Framing
In legacy telecom systems (T1/E1 framers, DS3 multiplexers, SONET/SDH tributary equipment), the EP1K50TI144-2 handles framing, alarm insertion, and clock-data recovery glue logic. The 360 LABs run small HDLC controllers and bit-error-rate testers (BERTs) in parallel, while the 40,960 bits of embedded RAM buffer tributary payloads. The -2 speed grade comfortably meets 51.84 MHz STS-1 timing. Industrial temperature grade supports outside-plant and central-office deployments where ambient temperatures vary.
Recommended
Motor Control and Drive Interface
The EP1K50TI144-2 is deployed as the digital interface between microcontrollers/MOSFET gate drivers in industrial motor drives, BLDC controllers, and stepper drivers. The 102 I/O pins handle quadrature encoder feedback (QEP), Hall-sensor inputs, PWM outputs to gate drivers, and fault interlocks all within a single chip. Industrial-temperature operation (-40 to +85 °C) tolerates the elevated ambient inside a drive enclosure. The 2.5 V core and 3.3 V I/O simplify interface to modern Cortex-M microcontrollers, and embedded EABs store sine-table and commutation look-up tables.
Recommended
Aerospace Prototype and Avionics Bus Interface
The EP1K50TI144-2 is used in legacy aerospace prototypes for ARINC 429, MIL-STD-1553, and discrete avionics bus interface cards. The 2,880 LEs encode/decode up to 8 ARINC 429 channels or implement a single MIL-STD-1553 BC/MT/RT in soft logic, while the industrial temperature range covers most cockpit and equipment-bay environments. SameFrame pin-compatibility lets designers scale to EP1K100TI144-2 for higher-channel-count avionics boxes without PCB rework. Note that aerospace certification programs typically require an obsolescence-management plan given the part's end-of-life status.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50TI144-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100TI144-2 | EP1K30TI144-2 | EP1K10TI144-2 | EP1K50TC144-2 | EP1K50TI144-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 144-LQFP (TQFP-144) | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same |
| Logic Elements (LEs) | 2,880 | 4,992 | 1,728 | 576 | 2,880 | 2,880 |
| Typical Gates | 50,000 | 100,000 | 30,000 | 10,000 | 50,000 | 50,000 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -1 |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded RAM (bits) | 40,960 | 49,152 | 24,576 | 12,288 | 40,960 | 40,960 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest LE density in a hand-solderable 144-LQFP ACEX-1K footprint (vs EP1K30TI144-2)
- Drop-in upgrade path to 100K-gate ACEX-1K on the same PCB (vs EP1K100TI144-2)
- Industrial-temperature operation suitable for outside-plant deployments (vs EP1K50TC144-2)
Design Notes
The EP1K50TI144-2 requires a clean 2.5 V core supply (VCCINT) capable of delivering up to 300 mA during configuration and up to 200 mA in steady-state operation. Use a low-dropout regulator such as a TI TPS79325 or LT3021 with at least 25% current headroom. Place 10 µF + 0.1 µF decoupling capacitors within 5 mm of every VCCINT/GND pair. VCCIO must ramp within ±600 µs of VCCINT to avoid latch-up; sequence VCCINT before VCCIO or use a dual-output LDO with tracking.
The 144-LQFP package has 0.5 mm pitch leads; PCB land pattern must follow IPC-7351 nominal-density guidelines with 0.30 mm pad width and 0.20 mm solder mask sliver. Use a 4-layer stackup with a continuous ground plane under the device. Tie all unused I/O pins to logic-low or logic-high through the Quartus II assignment editor (do not leave them floating). Add a 4.7 kΩ pull-up to VCCIO on nCONFIG, nSTATUS, and CONF_DONE for reliable boot.
Three common pitfalls: (1) Failing to populate an EPC configuration PROM and assuming the FPGA will boot from internal flash - the EP1K50TI144-2 is SRAM-based and loses configuration on every power-cycle. (2) Mixing VCCIO and VCCINT rails - the I/O bank voltage must match the peripheral logic level, otherwise inputs will be clamped and outputs will be over-driven. (3) Using a non-validated JTAG programmer (such as a generic FT2232H-based cable) without an Altera-compatible buffer - the TCK signal is sensitive to cable capacitance above 25 pF, which causes configuration failures.
Compliance Information
ACEX-1K family predates RoHS mandate; RoHS and lead-free status not confirmed in provided web data. AEC-Q100 not applicable (FPGA is not automotive-qualified per the legacy ACEX-1K datasheet). Conflict-minerals statement compliant per Intel supplier-responsibility policy.
