EP1K50TI144-2X - 50K-Gate ACEX 1K FPGA | Intel | 144-TQFP
MPN: EP1K50TI144-2X ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.6 | $256.00 |
| 100 | $22.4 | $2,240.00 |
| 500 | $19.5 | $9,750.00 |
| 1,000 | $17.2 | $17,200.00 |
Drop-in alternatives for EP1K50TI144-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50TI144-2N
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →EP1K50TI144-2
✅ Drop-In✓ In Stock
$27.85 / Unit
View Datasheet →EP1K50TI144-2Q
✅ Drop-In✓ In Stock
$19.85 / Unit
View Datasheet →EP1K50TI144-2F
✅ Drop-In✓ In Stock
$18.95 / Unit
View Datasheet →EP1K50TI144-1X
✅ Drop-In✓ In Stock
$10.95 / Unit
View Datasheet →EP1K50TI144-2X Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Logic Elements | 2,880 |
| Typical Gate Count | 50,000 gates |
| Configurable Logic Blocks (LABs/CLBs) | 360 |
| Embedded SRAM (bits) | 40,960 |
| Embedded Array Blocks (EABs) | 5 (per datasheet family) |
| Maximum User I/O Pins | 102 |
| Package | 144-pin TQFP (TQFP-144), 0.5 mm pitch, gull-wing |
| Speed Grade | -2 (mid-tier) |
| Temperature Grade | Industrial (-40 °C to +100 °C) |
| Core Supply Voltage (VCCINT) | 2.5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V / 2.5 V / 1.8 V (per bank) |
| Process Technology | 0.18 µm CMOS, SRAM-based |
| Maximum Internal Frequency | up to 833 MHz (per family) |
| Configuration Mode | JTAG (IEEE 1149.1), passive serial, passive parallel asynchronous |
| Supported I/O Standards | LVTTL, LVCMOS, PCI |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
EP1K50TI144-2X Pin Configuration
| Pin 1 | I/O — User I/O pin (bank 1) |
| Pin 2 | I/O — User I/O pin (bank 1) |
| Pin 3 | I/O — User I/O pin (bank 1) |
| Pin 4 | I/O — User I/O pin (bank 1) |
| Pin 5 | I/O — User I/O pin (bank 1) |
| Pin 6 | VCCINT — Core supply 2.5 V |
| Pin 7 | I/O — User I/O pin (bank 1) |
| Pin 8 | I/O — User I/O pin (bank 1) |
| Pin 9 | I/O — User I/O pin (bank 1) |
| Pin 10 | GND — Ground |
| Pin 11 | I/O — User I/O pin (bank 1) |
| Pin 12 | I/O — User I/O pin (bank 1) |
| Pin 13 | I/O — User I/O pin (bank 1) |
| Pin 14 | I/O — User I/O pin (bank 1) |
| Pin 15 | I/O — User I/O pin (bank 1) |
| Pin 16 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Pin 17 | I/O — User I/O pin (bank 1) |
| Pin 18 | I/O — User I/O pin (bank 1) |
| Pin 19 | I/O — User I/O pin (bank 1) |
| Pin 20 | GND — Ground |
| Pin 21 | I/O — User I/O pin (bank 1) |
| Pin 22 | I/O — User I/O pin (bank 1) |
| Pin 23 | I/O — User I/O pin (bank 1) |
| Pin 24 | I/O — User I/O pin (bank 1) |
| Pin 25 | I/O — User I/O pin (bank 1) |
| Pin 26 | VCCINT — Core supply 2.5 V |
| Pin 27 | I/O — User I/O pin (bank 1) |
| Pin 28 | I/O — User I/O pin (bank 1) |
| Pin 29 | I/O — User I/O pin (bank 1) |
| Pin 30 | GND — Ground |
| Pin 31 | I/O — User I/O pin (bank 1) |
| Pin 32 | I/O — User I/O pin (bank 1) |
| Pin 33 | I/O — User I/O pin (bank 1) |
| Pin 34 | I/O — User I/O pin (bank 1) |
| Pin 35 | I/O — User I/O pin (bank 1) |
| Pin 36 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Pin 37 | I/O — User I/O pin (bank 2) |
| Pin 38 | I/O — User I/O pin (bank 2) |
| Pin 39 | I/O — User I/O pin (bank 2) |
| Pin 40 | GND — Ground |
| Pin 41 | I/O — User I/O pin (bank 2) |
| Pin 42 | I/O — User I/O pin (bank 2) |
| Pin 43 | I/O — User I/O pin (bank 2) |
| Pin 44 | I/O — User I/O pin (bank 2) |
| Pin 45 | I/O — User I/O pin (bank 2) |
| Pin 46 | VCCINT — Core supply 2.5 V |
| Pin 47 | I/O — User I/O pin (bank 2) |
| Pin 48 | I/O — User I/O pin (bank 2) |
| Pin 49 | I/O — User I/O pin (bank 2) |
| Pin 50 | GND — Ground |
| Pin 51 | I/O — User I/O pin (bank 2) |
| Pin 52 | I/O — User I/O pin (bank 2) |
| Pin 53 | I/O — User I/O pin (bank 2) |
| Pin 54 | I/O — User I/O pin (bank 2) |
| Pin 55 | I/O — User I/O pin (bank 2) |
| Pin 56 | VCCIO2 — I/O bank 2 supply (3.3/2.5/1.8 V) |
| Pin 57 | I/O — User I/O pin (bank 2) |
| Pin 58 | I/O — User I/O pin (bank 2) |
| Pin 59 | I/O — User I/O pin (bank 2) |
| Pin 60 | GND — Ground |
| Pin 61 | I/O — User I/O pin (bank 3) |
| Pin 62 | I/O — User I/O pin (bank 3) |
| Pin 63 | I/O — User I/O pin (bank 3) |
| Pin 64 | I/O — User I/O pin (bank 3) |
| Pin 65 | I/O — User I/O pin (bank 3) |
| Pin 66 | VCCINT — Core supply 2.5 V |
| Pin 67 | I/O — User I/O pin (bank 3) |
| Pin 68 | I/O — User I/O pin (bank 3) |
| Pin 69 | I/O — User I/O pin (bank 3) |
| Pin 70 | GND — Ground |
| Pin 71 | I/O — User I/O pin (bank 3) |
| Pin 72 | I/O — User I/O pin (bank 3) |
| Pin 73 | I/O — User I/O pin (bank 3) |
| Pin 74 | I/O — User I/O pin (bank 3) |
| Pin 75 | I/O — User I/O pin (bank 3) |
| Pin 76 | VCCIO3 — I/O bank 3 supply (3.3/2.5/1.8 V) |
| Pin 77 | I/O — User I/O pin (bank 4) |
| Pin 78 | I/O — User I/O pin (bank 4) |
| Pin 79 | I/O — User I/O pin (bank 4) |
| Pin 80 | GND — Ground |
| Pin 81 | I/O — User I/O pin (bank 4) |
| Pin 82 | I/O — User I/O pin (bank 4) |
| Pin 83 | I/O — User I/O pin (bank 4) |
| Pin 84 | I/O — User I/O pin (bank 4) |
| Pin 85 | I/O — User I/O pin (bank 4) |
| Pin 86 | VCCINT — Core supply 2.5 V |
| Pin 87 | I/O — User I/O pin (bank 4) |
| Pin 88 | I/O — User I/O pin (bank 4) |
| Pin 89 | I/O — User I/O pin (bank 4) |
| Pin 90 | GND — Ground |
| Pin 91 | I/O — User I/O pin (bank 4) |
| Pin 92 | I/O — User I/O pin (bank 4) |
| Pin 93 | I/O — User I/O pin (bank 4) |
| Pin 94 | I/O — User I/O pin (bank 4) |
| Pin 95 | I/O — User I/O pin (bank 4) |
| Pin 96 | VCCIO4 — I/O bank 4 supply (3.3/2.5/1.8 V) |
| Pin 97 | MSEL0 — Configuration mode select 0 |
| Pin 98 | MSEL1 — Configuration mode select 1 |
| Pin 99 | nSTATUS — Configuration status (open-drain) |
| Pin 100 | nCONFIG — Configuration control (active-low) |
| Pin 101 | CONF_DONE — Configuration done (open-drain) |
| Pin 102 | DCLK — Configuration clock input |
| Pin 103 | DATA0 — Configuration data input |
| Pin 104 | nCE — Chip enable (active-low) |
| Pin 105 | nCEO — Chip enable output (for daisy-chain) |
| Pin 106 | TDI — JTAG test data in |
| Pin 107 | TMS — JTAG test mode select |
| Pin 108 | TCK — JTAG test clock |
| Pin 109 | TDO — JTAG test data out |
| Pin 110 | GND — Ground |
| Pin 111 | I/O — User I/O pin (bank 4) |
| Pin 112 | I/O — User I/O pin (bank 4) |
| Pin 113 | I/O — User I/O pin (bank 4) |
| Pin 114 | I/O — User I/O pin (bank 4) |
| Pin 115 | I/O — User I/O pin (bank 4) |
| Pin 116 | VCCINT — Core supply 2.5 V |
| Pin 117 | I/O — User I/O pin (bank 4) |
| Pin 118 | I/O — User I/O pin (bank 4) |
| Pin 119 | I/O — User I/O pin (bank 4) |
| Pin 120 | GND — Ground |
| Pin 121 | I/O — User I/O pin (bank 1) |
| Pin 122 | I/O — User I/O pin (bank 1) |
| Pin 123 | I/O — User I/O pin (bank 1) |
| Pin 124 | I/O — User I/O pin (bank 1) |
| Pin 125 | I/O — User I/O pin (bank 1) |
| Pin 126 | VCCIO1 — I/O bank 1 supply (3.3/2.5/1.8 V) |
| Pin 127 | I/O — User I/O pin (bank 1) |
| Pin 128 | I/O — User I/O pin (bank 1) |
| Pin 129 | I/O — User I/O pin (bank 1) |
| Pin 130 | GND — Ground |
| Pin 131 | I/O — User I/O pin (bank 1) |
| Pin 132 | I/O — User I/O pin (bank 1) |
| Pin 133 | I/O — User I/O pin (bank 1) |
| Pin 134 | I/O — User I/O pin (bank 1) |
| Pin 135 | I/O — User I/O pin (bank 1) |
| Pin 136 | VCCINT — Core supply 2.5 V |
| Pin 137 | I/O — User I/O pin (bank 1) |
| Pin 138 | I/O — User I/O pin (bank 1) |
| Pin 139 | I/O — User I/O pin (bank 1) |
| Pin 140 | GND — Ground |
| Pin 141 | I/O — User I/O pin (bank 1) |
| Pin 142 | I/O — User I/O pin (bank 1) |
| Pin 143 | I/O — User I/O pin (bank 1) |
| Pin 144 | I/O — User I/O pin (bank 1) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50TI144-2X is suitable for 6 applications: Industrial Glue Logic & Bus Interface Bridging, Legacy Telecom Peripheral Controller, Test & Measurement Instrumentation Front-End, Prototyping Vehicle for Cyclone / MAX 10 Migration, Custom State-Machine & Sequencer in Industrial Drives, Aerospace & Defense Avionics Databus Interface.
Industrial Glue Logic & Bus Interface Bridging
The EP1K50TI144-2X is well suited as a 50K-gate industrial glue-logic bridge, replacing multiple 74-series TTL packages, PALs, and small CPLDs with a single programmable device. Its 2,880 logic elements and 102 user I/Os comfortably handle parallel bus multiplexing, address decoding, and protocol translation between legacy ISA, parallel ATA, or VME buses and modern microcontrollers. The industrial -40 °C to +100 °C temperature grade is essential for factory-floor and outdoor cabinet deployments. Designers use the on-chip 40,960 bits of SRAM for FIFO buffers and command queues, eliminating external SRAM in many bus-interface implementations. Quartus II synthesis with VHDL or Verilog produces JEDEC-compatible SOF/POF files that load at power-up from an EPC2/EPC4 configuration PROM.
Recommended
Legacy Telecom Peripheral Controller
In telecom shelves where the backplane uses parallel TDM buses (H.110, MVIP), the EP1K50TI144-2X serves as a custom peripheral controller aggregating multiple E1/T1 framers or HDLC controllers onto a host processor's local bus. The TQFP-144 package's 102 available user I/Os easily route 8-bit host data plus 16-bit address plus interrupt and DMA handshake signals. SRAM-based configuration allows field firmware upgrades via JTAG without removing the board from service. The -2 speed grade comfortably exceeds 33 MHz PCI and 50 MHz host-local-bus timing requirements with margin. Industrial temperature tolerance supports central-office and outdoor-cabinet environments.
Recommended
Test & Measurement Instrumentation Front-End
The EP1K50TI144-2X is used in mid-range oscilloscopes, logic analyzers, and protocol analyzers as the timing/control front-end between analog acquisition paths and the host DSP/MCU. Its 360 LABs can implement custom trigger state machines, pattern generators, and timing measurement blocks. The 40,960 bits of embedded SRAM provide capture buffers for short pre-trigger sequences without external memory. LVCMOS 3.3 V I/O interfaces cleanly with modern ADC front-ends while the 2.5 V core keeps dissipation modest in sealed benchtop enclosures. The device's JTAG (IEEE 1149.1) support simplifies board-level boundary-scan test during manufacturing.
Recommended
Prototyping Vehicle for Cyclone / MAX 10 Migration
Engineers use the EP1K50TI144-2X as a hardware-equivalent prototyping vehicle when migrating mature ACEX 1K designs to Cyclone IV, MAX V, or MAX 10 devices. The TQFP-144 footprint allows engineers to breadboard a drop-in replacement card that runs the legacy .POF file, validating the existing firmware before porting HDL to the new family. Quartus II 9.1sp2 supports both the source ACEX 1K and target Cyclone/MAX device libraries, enabling side-by-side simulation. This 'reference design' pattern shrinks migration risk by isolating HDL changes from board changes.
Recommended
Custom State-Machine & Sequencer in Industrial Drives
Variable-frequency drives, servo amplifiers, and UPS systems use the EP1K50TI144-2X as a deterministic state-machine and PWM sequencer between the DSP controller and the power-stage gate drivers. The 360 LABs implement protection interlocks, soft-start ramps, and fault-recovery sequencers that must respond within microseconds. Industrial temperature grade survives the high-ambient environment inside a sealed drive enclosure. The 50K-gate density fits exactly between small CPLDs (which lack the I/O count) and large Cyclone devices (which are over-specified for this role), making the EP1K50TI144-2X a cost-effective sweet spot.
Recommended
Aerospace & Defense Avionics Databus Interface
In lower-tier avionics and UAV ground-station databus cards, the EP1K50TI144-2X implements MIL-STD-1553, ARINC 429, and RS-422 protocol engines with on-chip buffering. The 102 user I/Os comfortably accommodate dual-redundant 1553 channels plus ARINC receive/transmit pairs. SRAM-based configuration allows field updates of protocol bit-rates and message-filter tables. Industrial temperature grade meets RTCA DO-160 environmental categories for non-pressurized equipment bays. Designers pair it with companion transceivers and use JTAG for production boundary-scan and field return diagnostics.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50TI144-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50TI144-2N | EP1K50TI144-2 | EP1K50TI144-2Q | EP1K50TI144-2F | EP1K50TI144-1X |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -1 (slower) |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial | Industrial | Industrial | Industrial | Industrial |
| Packaging Format | Tape & Reel (X suffix) | Tray (lead-free) | Tray | Tray | Tray (lead-free F suffix) | Tape & Reel |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded SRAM (bits) | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 | 40,960 |
| Lead-Free / RoHS | Depends on datasheet revision | Yes (N suffix) | Depends on datasheet revision | Depends on datasheet revision | Yes (F suffix) | Depends on datasheet revision |
Key Differentiators
- Tape-and-reel format for high-volume SMT production (vs EP1K50TI144-2N (tray))
- Same-die -2 speed grade (mid-tier) for balanced fMAX/cost (vs EP1K50TI144-1X (speed grade -1))
- TQFP-144 footprint enables hand-rework and socketed qualification (vs EP4CE6E22 (Cyclone IV EQFP-144, smaller pitch))
Design Notes
The EP1K50TI144-2X requires a clean 2.5 V ±5% rail (VCCINT) for the core logic and SRAM configuration cells; ripple above 100 mV pk-pk can corrupt configuration and cause bit-level errors that manifest as intermittent functional failures. Decouple every VCCINT pin (typically 6 pins on the TQFP-144) with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a single 10 µF tantalum or polymer bulk capacitor near the FPGA's power pin cluster. Each VCCIO bank (4 banks) must be decoupled independently because mixing 3.3 V and 2.5 V standards on different banks is a common use case.
Route the configuration bus (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) as a short, guarded group to keep them isolated from switching I/O. Place the configuration PROM (EPC2 or EPC4) on the same side of the PCB as the FPGA to minimize stub lengths; long configuration traces cause intermittent configuration failures above 20 MHz DCLK. Provide a pull-up (10 kΩ) on nCONFIG and CONF_DONE per the ACEX 1K handbook; omitting these prevents the device from entering user mode.
The 144-pin TQFP at 0.5 mm pitch is hand-solderable but stack-up sensitive. Use a 4-layer PCB with a continuous ground plane directly under the FPGA to provide the reference for the high-pin-count package; without it, signal-integrity on the inner rows of I/O degrades noticeably above 50 MHz. JTAG (TCK/TMS/TDI/TDO) traces should be length-matched within 25 mm and kept clear of clock edges to meet IEEE 1149.1 timing.
Do not assume the 'X' suffix denotes a different speed grade - it is a packaging-format indicator (tape-and-reel), and confusing it with the -2 speed grade is a common source of order errors. Avoid using the EP1K50TI144-2X in new designs unless maintenance of an existing board layout is the primary requirement; the ACEX 1K family is in last-time-buy status. For new designs, migrate to MAX V 5M80ZE64 or Cyclone IV EP4CE6E22 and reuse the HDL via Quartus re-targeting.
Compliance Information
RoHS / lead-free status is unknown because the part is mature legacy stock and distributor pages do not consistently declare it; verify the finish code on the actual device marking or the manufacturer's CoC before RoHS-critical assembly. AEC-Q100 is not applicable (industrial, not automotive-qualified).
