EP3C5E144C7N - Cyclone III FPGA, 5K LE, 144-LQFP | Intel / Altera
MPN: EP3C5E144C7N ✓ AktifEP3C5E144C7N Ringkasan
A Cyclone III FPGA is a programmable logic device that combines lookup-table (LUT)-based logic fabric with embedded memory blocks (M9K), embedded multipliers (18x18), and Phase-Locked Loops (PLLs) on a single die. In the broader taxonomy, the EP3C5E144C7N belongs to the SRAM-based programmable logic family, sitting alongside Cyclone IV (next-generation low-power FPGA), Cyclone V (28 nm successor), and MAX series CPLDs. The device is non-volatile-of-configuration: bitstreams are loaded from external flash or JTAG into on-chip SRAM configuration cells, enabling unlimited re-programmability for prototyping, NPI, and field-upgradable end products.
Key features include 5,136 logic elements organized into 290 logic array blocks (LABs), 46 embedded M9K memory blocks (414 Kbits), 46 embedded 18x18 multipliers, and up to 4 PLLs with 4 dedicated clock outputs. The device supports configuration schemes including Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG, and includes Cyclone III architectural primitives such as high-speed LVDS I/O, on-chip termination (OCT), and the Altera remote update IP for in-field bitstream swapping. The 144-pin EQFP package provides a thermal resistance of approximately 22 C/W with a properly soldered exposed pad.
The Cyclone III architecture targets cost-sensitive high-volume applications where the previous-generation Cyclone II could not deliver sufficient logic density, DSP bandwidth, or low static power. The 65 nm process enables typical static power in the milliamp range while retaining deterministic timing closure at 200+ MHz for common logic functions and 250 MHz for DSP blocks. I/O banks support LVDS, SSTL, HSTL, LVCMOS, and PCI/PCI-X signaling standards with per-bank voltage reference supplies, enabling direct interface to DDR/DDR2 SDRAM without external level shifters.
Typical applications include industrial motor control and PLC logic, video surveillance and image-processing front ends, portable medical instrumentation, low-cost software-defined radio (SDR) baseband, and consumer audio/video processing. The combination of low static power, moderate logic capacity, and a small footprint package makes the EP3C5E144C7N a strong fit for space-constrained, cost-driven designs that still need hardware-accelerated DSP or parallel sensor aggregation.
When designing with this device, allocate at least an 8-layer PCB stack-up with continuous GND planes for signal integrity on LVDS pairs, and use the Quartus II / Quartus Prime design suite (13.0 or later recommended for final bitstream) with the Cyclone III device library installed. Decoupling must include 0.1 uF and 10 uF capacitors placed within 5 mm of every VCCIO/VCCINT ball pair, and the exposed thermal pad must be soldered to a 1 sq. inch copper pour to keep junction temperature within the C7 commercial rating.
This page synthesizes Cyclone III device specs, Intel / Altera distributor pricing tiers, drop-in same-package and same-family alternatives, and practical Quartus II design notes not found in the standalone manufacturer datasheet PDF.
Alternatif penggantian untuk EP3C5E144C7N — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EP3C5E144C7N (sama faktor bentuk dan footprint) — berbeda di dalam Package, Process Technology, Speed Grade, Family, Total Memory Bits.
EP3C5E144C8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP3C5E144I7N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP3C10E144C7N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP4CE5E144C7N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EP3C16Q240C8N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EP3C25E144C7N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EP3C40E144C7N
✅ Drop-In ⚠️ Spesifikasi Tidak Disahkan📋 Alternatif referensi (tidak dalam katalog)
EP3C5E144C7N Rating Maksimal & Karakteristik Listrik
| Device Family | Cyclone III |
| Logic Elements (LE) | 5,136 |
| Logic Array Blocks (LAB) | 290 |
| Total Memory Bits | 423,936 |
| Embedded M9K Memory Blocks | 46 |
| Embedded 18x18 Multipliers | 46 |
| PLLs | 4 |
| User I/Os | 94 |
| Speed Grade | C7 (7 ns delay) |
| Process Technology | TSMC 65 nm low-power |
| Paket | 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch |
| Suhu Hubung Kerja | 0C to +85C |
| Configuration Modes | AS, PS, FPP, JTAG |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS, PCI/PCI-X |
| Status RoHS | Compliant |
Konfigurasi Pin EP3C5E144C7N
| Pin produk 1 | I/O — User I/O (Bank 1) |
| Pin produk 2 | I/O — User I/O (Bank 1) |
| Pin produk 3 | I/O — User I/O (Bank 1) |
| Pin produk 4 | I/O — User I/O (Bank 1) |
| Pin produk 5 | I/O — User I/O (Bank 1) |
| Pin produk 6 | VCCIO1 — I/O Bank 1 voltage supply |
| Pin produk 7 | I/O — User I/O (Bank 1) |
| Pin produk 8 | I/O — User I/O (Bank 1) |
| Pin produk 9 | I/O — User I/O (Bank 1) |
| Pin produk 10 | GND — Ground |
| Pin produk 11 | I/O — User I/O (Bank 1) |
| Pin produk 12 | I/O — User I/O (Bank 1) |
| Pin produk 13 | I/O — User I/O (Bank 1) |
| Pin produk 14 | I/O — User I/O (Bank 1) |
| Pin produk 15 | I/O — User I/O (Bank 1) |
| Pin produk 16 | VCCIO1 — I/O Bank 1 voltage supply |
| Pin produk 17 | I/O — User I/O (Bank 1) |
| Pin produk 18 | I/O — User I/O (Bank 1) |
| Pin produk 19 | I/O — User I/O (Bank 1) |
| Pin produk 20 | I/O — User I/O (Bank 1) |
| Pin produk 21 | I/O — User I/O (Bank 1) |
| Pin produk 22 | GND — Ground |
| Pin produk 23 | I/O — User I/O (Bank 1) |
| Pin produk 24 | I/O — User I/O (Bank 1) |
| Pin produk 25 | I/O — User I/O (Bank 1) |
| Pin produk 26 | I/O — User I/O (Bank 1) |
| Pin produk 27 | I/O — User I/O (Bank 1) |
| Pin produk 28 | VCCIO1 — I/O Bank 1 voltage supply |
| Pin produk 29 | I/O — User I/O (Bank 1) |
| Pin produk 30 | I/O — User I/O (Bank 1) |
| Pin produk 31 | I/O — User I/O (Bank 1) |
| Pin produk 32 | I/O — User I/O (Bank 1) |
| Pin produk 33 | I/O — User I/O (Bank 1) |
| Pin produk 34 | GND — Ground |
| Pin produk 35 | I/O — User I/O (Bank 1) |
| Pin produk 36 | I/O — User I/O (Bank 1) |
| Pin produk 37 | VCCINT — Core voltage supply (1.2 V) |
| Pin produk 38 | I/O — User I/O (Bank 2) |
| Pin produk 39 | I/O — User I/O (Bank 2) |
| Pin produk 40 | I/O — User I/O (Bank 2) |
| Pin produk 41 | I/O — User I/O (Bank 2) |
| Pin produk 42 | I/O — User I/O (Bank 2) |
| Pin produk 43 | VCCIO2 — I/O Bank 2 voltage supply |
| Pin produk 44 | I/O — User I/O (Bank 2) |
| Pin produk 45 | I/O — User I/O (Bank 2) |
| Pin produk 46 | I/O — User I/O (Bank 2) |
| Pin produk 47 | I/O — User I/O (Bank 2) |
| Pin produk 48 | I/O — User I/O (Bank 2) |
| Pin produk 49 | GND — Ground |
| Pin produk 50 | I/O — User I/O (Bank 2) |
| Pin produk 51 | I/O — User I/O (Bank 2) |
| Pin produk 52 | I/O — User I/O (Bank 2) |
| Pin produk 53 | I/O — User I/O (Bank 2) |
| Pin produk 54 | I/O — User I/O (Bank 2) |
| Pin produk 55 | VCCIO2 — I/O Bank 2 voltage supply |
| Pin produk 56 | I/O — User I/O (Bank 2) |
| Pin produk 57 | I/O — User I/O (Bank 2) |
| Pin produk 58 | I/O — User I/O (Bank 2) |
| Pin produk 59 | I/O — User I/O (Bank 2) |
| Pin produk 60 | I/O — User I/O (Bank 2) |
| Pin produk 61 | GND — Ground |
| Pin produk 62 | I/O — User I/O (Bank 2) |
| Pin produk 63 | I/O — User I/O (Bank 2) |
| Pin produk 64 | I/O — User I/O (Bank 2) |
| Pin produk 65 | I/O — User I/O (Bank 2) |
| Pin produk 66 | I/O — User I/O (Bank 2) |
| Pin produk 67 | VCCIO2 — I/O Bank 2 voltage supply |
| Pin produk 68 | I/O — User I/O (Bank 2) |
| Pin produk 69 | I/O — User I/O (Bank 2) |
| Pin produk 70 | VCCINT — Core voltage supply (1.2 V) |
| Pin produk 71 | I/O — User I/O (Bank 3) |
| Pin produk 72 | I/O — User I/O (Bank 3) |
| Pin produk 73 | I/O — User I/O (Bank 3) |
| Pin produk 74 | I/O — User I/O (Bank 3) |
| Pin produk 75 | I/O — User I/O (Bank 3) |
| Pin produk 76 | VCCIO3 — I/O Bank 3 voltage supply |
| Pin produk 77 | I/O — User I/O (Bank 3) |
| Pin produk 78 | I/O — User I/O (Bank 3) |
| Pin produk 79 | I/O — User I/O (Bank 3) |
| Pin produk 80 | I/O — User I/O (Bank 3) |
| Pin produk 81 | I/O — User I/O (Bank 3) |
| Pin produk 82 | GND — Ground |
| Pin produk 83 | I/O — User I/O (Bank 3) |
| Pin produk 84 | I/O — User I/O (Bank 3) |
| Pin produk 85 | I/O — User I/O (Bank 3) |
| Pin produk 86 | I/O — User I/O (Bank 3) |
| Pin produk 87 | I/O — User I/O (Bank 3) |
| Pin produk 88 | VCCIO3 — I/O Bank 3 voltage supply |
| Pin produk 89 | I/O — User I/O (Bank 3) |
| Pin produk 90 | I/O — User I/O (Bank 3) |
| Pin produk 91 | I/O — User I/O (Bank 3) |
| Pin produk 92 | I/O — User I/O (Bank 3) |
| Pin produk 93 | I/O — User I/O (Bank 3) |
| Pin produk 94 | GND — Ground |
| Pin produk 95 | I/O — User I/O (Bank 3) |
| Pin produk 96 | I/O — User I/O (Bank 3) |
| Pin produk 97 | I/O — User I/O (Bank 3) |
| Pin produk 98 | I/O — User I/O (Bank 3) |
| Pin produk 99 | I/O — User I/O (Bank 3) |
| Pin produk 100 | VCCIO3 — I/O Bank 3 voltage supply |
| Pin produk 101 | I/O — User I/O (Bank 3) |
| Pin produk 102 | I/O — User I/O (Bank 3) |
| Pin produk 103 | VCCINT — Core voltage supply (1.2 V) |
| Pin produk 104 | I/O — User I/O (Bank 4) |
| Pin produk 105 | I/O — User I/O (Bank 4) |
| Pin produk 106 | I/O — User I/O (Bank 4) |
| Pin produk 107 | I/O — User I/O (Bank 4) |
| Pin produk 108 | I/O — User I/O (Bank 4) |
| Pin produk 109 | VCCIO4 — I/O Bank 4 voltage supply |
| Pin produk 110 | I/O — User I/O (Bank 4) |
| Pin produk 111 | I/O — User I/O (Bank 4) |
| Pin produk 112 | I/O — User I/O (Bank 4) |
| Pin produk 113 | I/O — User I/O (Bank 4) |
| Pin produk 114 | I/O — User I/O (Bank 4) |
| Pin produk 115 | GND — Ground |
| Pin produk 116 | I/O — User I/O (Bank 4) |
| Pin produk 117 | I/O — User I/O (Bank 4) |
| Pin produk 118 | I/O — User I/O (Bank 4) |
| Pin produk 119 | I/O — User I/O (Bank 4) |
| Pin produk 120 | I/O — User I/O (Bank 4) |
| Pin produk 121 | VCCIO4 — I/O Bank 4 voltage supply |
| Pin produk 122 | I/O — User I/O (Bank 4) |
| Pin produk 123 | I/O — User I/O (Bank 4) |
| Pin produk 124 | I/O — User I/O (Bank 4) |
| Pin produk 125 | I/O — User I/O (Bank 4) |
| Pin produk 126 | I/O — User I/O (Bank 4) |
| Pin produk 127 | GND — Ground |
| Pin produk 128 | I/O — User I/O (Bank 4) |
| Pin produk 129 | I/O — User I/O (Bank 4) |
| Pin produk 130 | I/O — User I/O (Bank 4) |
| Pin produk 131 | I/O — User I/O (Bank 4) |
| Pin produk 132 | I/O — User I/O (Bank 4) |
| Pin produk 133 | VCCIO4 — I/O Bank 4 voltage supply |
| Pin produk 134 | I/O — User I/O (Bank 4) |
| Pin produk 135 | I/O — User I/O (Bank 4) |
| Pin produk 136 | VCCINT — Core voltage supply (1.2 V) |
| Pin produk 137 | TCK — JTAG test clock |
| Pin produk 138 | TMS — JTAG test mode select |
| Pin produk 139 | TDO — JTAG test data out |
| Pin produk 140 | TDI — JTAG test data in |
| Pin produk 141 | nCONFIG — Configuration control |
| Pin produk 142 | nSTATUS — Configuration status |
| Pin produk 143 | MSEL0 — Configuration mode select 0 |
| Pin produk 144 | MSEL1 — Configuration mode select 1 |
Aplikasi Umum
EP3C5E144C7N cocok untuk 6 aplikasis: Industrial Motor Control and PLC Logic, Video Surveillance and Image Processing Front End, Portable Medical Instrumentation, Low-Cost Software-Defined Radio (SDR) Baseband, Consumer Audio/Video Processing, Industrial Networking and Protocol Bridging.
Industrial Motor Control and PLC Logic
The EP3C5E144C7N's 5,136 logic elements and 46 embedded 18x18 multipliers fit single-axis to dual-axis motor control loops including field-oriented control (FOC), trapezoidal commutation, and PID compensation. The 94 user I/Os support encoder inputs (QEP), Hall sensor feedback, PWM outputs to gate drivers, and isolated communication interfaces (RS-485, CAN, Modbus). The C7 speed grade closes 200 MHz logic timing, sufficient for 50 kHz current loop rates. Compared to DSP-only solutions, the FPGA enables parallel sampling of multiple ADC channels synchronized to PWM edges, eliminating the sequential bottleneck of a single-core DSP.
Direkomendasikan
Video Surveillance and Image Processing Front End
The EP3C5E144C7N's 46 M9K memory blocks (414 Kbits total) and LVDS I/O support enable direct interface to CMOS image sensors at up to 1080p60 resolution using LVDS or sub-LVDS signaling. The 5,136 logic elements implement real-time pipelines for demosaicing, color correction, edge detection, and H.264 baseline encoding pre-processing. The 4 PLLs generate the precise pixel clocks required by MIPI CSI-2 or parallel LVDS sensor interfaces. The 65 nm low-power process keeps total FPGA power below 1.5W at full utilization, enabling fanless surveillance camera designs.
Direkomendasikan
Portable Medical Instrumentation
The EP3C5E144C7N's low static power (typically under 100 mW at idle) and small 22x22 mm EQFP-144 package make it suitable for battery-powered medical devices such as pulse oximeters, ECG monitors, and portable ultrasound front ends. The 5,136 logic elements implement digital filtering, FFT analysis, and adaptive baseline removal on multi-channel ADC streams. The 46 embedded 18x18 multipliers accelerate biquad filter chains and wavelet transforms. On-chip PLLs generate the clock trees needed for simultaneous-sampling ADC interfaces at 1-10 MSPS, while the 94 user I/Os connect to TFT displays, touch panels, and isolated serial ports.
Direkomendasikan
Low-Cost Software-Defined Radio (SDR) Baseband
The EP3C5E144C7N's 46 embedded 18x18 multipliers and 423 Kbits of block RAM enable low-cost SDR baseband implementations for narrowband protocols such as LoRa, Sigfox, NB-IoT, and IEEE 802.15.4 (Zigbee/Thread). The 4 PLLs generate the quadrature sample-rate clocks needed for digital downconversion and channelization. The LVDS I/O pairs interface directly to high-speed ADCs and DACs at 50-100 MSPS. Compared to a microcontroller + DSP solution, the FPGA's parallel processing enables simultaneous demodulation of multiple channels and real-time FEC decoding without timing jitter.
Direkomendasikan
Consumer Audio/Video Processing
The EP3C5E144C7N's logic density and embedded multipliers fit consumer audio processors for HDMI upscaling, audio format conversion (Dolby Digital, DTS), and HDMI CEC bridging. The 94 user I/Os support HDMI, S/PDIF, I2S, and LVDS display interfaces simultaneously. The C7 speed grade enables 1080p60 video processing with line buffers in M9K memory. Cyclone III's low static power keeps enclosure temperatures within consumer product safety limits, while the exposed pad package simplifies thermal management in slim AV receiver chassis.
Direkomendasikan
Industrial Networking and Protocol Bridging
The EP3C5E144C7N's 94 user I/Os and 5,136 logic elements support multi-protocol industrial gateway designs bridging EtherCAT, PROFINET, EtherNet/IP, and Modbus TCP on a single device. The M9K memory blocks implement packet buffers and protocol state machines, while the LVDS I/O pairs enable MII/RGMII PHY interfacing at 1 Gbps. The C7 speed grade closes 200 MHz logic timing sufficient for line-rate protocol processing. Compared to discrete microcontrollers, the FPGA enables hardware-accelerated CRC, checksum, and protocol state management without CPU bottlenecks.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EP3C5E144C7N — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EP3C5E144C8N | EP3C5E144I7N | EP3C10E144C7N | EP4CE5E144C7N | EP3C16Q240C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 | 5,136 | 15,408 |
| Speed Grade | C7 (7 ns) | C8 (8 ns) | I7 (7 ns, industrial temp) | C7 (7 ns) | C7 (7 ns) | C8 (8 ns) |
| Operating Junction Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/Os | 94 | 94 | 94 | 94 | 94 | 94 |
| Embedded Memory (Kbits) | 414 | 414 | 414 | 414 | 270 | 504 |
| 18x18 Multipliers | 46 | 46 | 46 | 46 | 25 | 56 |
| Bitstream Compatibility | Cyclone III baseline | Compatible (same family) | Compatible (same family) | Compatible (same family) | Not compatible (Cyclone IV E) | Compatible (same family) |
Diferensiator Kunci
- Lowest-density Cyclone III in 144-EQFP with full feature set (vsEPM570GT100C3N (MAX II CPLD))
- Pin-compatible logic upgrade within same family (vsEP3C5E144C8N (C8 speed grade))
- Industrial temperature variant available in same package (vsEP3C5E144I7N (industrial temp))
Catatan Desain
The EP3C5E144C7N requires separate VCCINT (1.2 V core) and VCCIO (1.5V/1.8V/2.5V/3.3V I/O bank) rails. Per the Cyclone III device datasheet, VCCINT tolerance is +/-5% and each VCCIO bank can be independently configured. Place 0.1 uF and 10 uF decoupling capacitors within 5 mm of every VCCINT/VCCIO pin pair. A ferrite bead or pi-filter on each rail is recommended for designs with high-speed LVDS or external SDRAM interfaces.
Estimated: At full utilization (5,136 LE, 46 multipliers, 250 MHz logic), the EP3C5E144C7N dissipates approximately 0.8-1.2 W. The exposed thermal pad must be soldered to a continuous ground copper pour of at least 1 square inch to maintain the C7 commercial 85C junction temperature. Without the exposed pad soldered, junction temperature can exceed 100C at moderate utilization, triggering thermal slowdown. Use 4-thermal-via array (0.3 mm drill) on the exposed pad for optimal heat transfer.
Allocate at least an 8-layer PCB stack-up with continuous GND planes for signal integrity on LVDS pairs. Per the Cyclone III device handbook, LVDS traces must be 100 ohm differential with intra-pair skew under 5 ps. Route configuration signals (TCK/TMS/TDO/TDI/nCONFIG/nSTATUS) away from high-speed switching nodes. Place the configuration flash (EPCS4/EPCS16) within 25 mm of the FPGA's active serial pins for reliable AS configuration.
Pin assignments should be planned using the Quartus II / Quartus Prime Pin Planner before PCB layout. Group high-speed I/O (LVDS, DDR/DDR2) in adjacent banks to minimize routing congestion. Per the Cyclone III device handbook, each I/O bank has dedicated VREF pins for SSTL/HSTL reference voltages - place VREF bypass capacitors (0.1 uF + 10 uF) within 3 mm of each VREF pin. Avoid routing clock signals across I/O bank boundaries to prevent skew issues.
Do not leave MSEL0/MSEL1 pins floating - they must be tied to VCCINT or GND to select the configuration mode (AS/PS/FPP/JTAG). Per the Cyclone III device handbook, floating MSEL pins cause configuration failures. The nCONFIG pin must be pulled to VCCINT through a 10 kohm resistor. Cyclone III bitstreams are NOT compatible with Cyclone IV or Cyclone V - recompile in Quartus Prime when migrating to newer families.
Informasi Konformitas
RoHS compliant per Intel / Altera product page. Lead-free (Pb-free) reflow compatible. Not AEC-Q100 qualified - Cyclone III is not an automotive-grade family. For automotive applications, consider Cyclone IV E or Cyclone V with AEC-Q100 documentation.
